ATE309610T1 - Überspannungsschutzanordnung und herstellungsverfahren - Google Patents
Überspannungsschutzanordnung und herstellungsverfahrenInfo
- Publication number
- ATE309610T1 ATE309610T1 AT97902053T AT97902053T ATE309610T1 AT E309610 T1 ATE309610 T1 AT E309610T1 AT 97902053 T AT97902053 T AT 97902053T AT 97902053 T AT97902053 T AT 97902053T AT E309610 T1 ATE309610 T1 AT E309610T1
- Authority
- AT
- Austria
- Prior art keywords
- electrical
- production method
- surge protection
- protection arrangement
- protection device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
Landscapes
- Emergency Protection Circuit Devices (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58935596A | 1996-01-22 | 1996-01-22 | |
| US3483997P | 1997-01-07 | 1997-01-07 | |
| PCT/US1997/000781 WO1997026665A1 (en) | 1996-01-22 | 1997-01-21 | Over-voltage protection device and method for making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE309610T1 true ATE309610T1 (de) | 2005-11-15 |
Family
ID=26711449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT97902053T ATE309610T1 (de) | 1996-01-22 | 1997-01-21 | Überspannungsschutzanordnung und herstellungsverfahren |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0879470B1 (de) |
| JP (1) | JP4298791B2 (de) |
| AT (1) | ATE309610T1 (de) |
| AU (1) | AU1580897A (de) |
| DE (1) | DE69734571T2 (de) |
| ES (1) | ES2252774T3 (de) |
| WO (1) | WO1997026665A1 (de) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19736754B4 (de) * | 1997-08-23 | 2004-09-30 | Micronas Semiconductor Holding Ag | Integriertes Gasentladungsbauelement zum Überspannungsschutz |
| US6130459A (en) * | 1998-03-10 | 2000-10-10 | Oryx Technology Corporation | Over-voltage protection device for integrated circuits |
| JP2000239995A (ja) * | 1999-02-19 | 2000-09-05 | Matsushita Electric Ind Co Ltd | 絶縁基材とプリプレグおよびそれを用いた回路基板 |
| GB2347783A (en) * | 1999-03-06 | 2000-09-13 | Rover Group | A spark discharge device for ESD protection |
| US7446030B2 (en) | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
| AU6531600A (en) | 1999-08-27 | 2001-03-26 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
| US7695644B2 (en) | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
| US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
| WO2007062122A2 (en) | 2005-11-22 | 2007-05-31 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
| DK2054896T3 (da) | 2006-07-29 | 2012-09-17 | Shocking Technologies Inc | Dielektrisk materiale med ledende eller halvledende organisk materiale |
| US7968010B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Method for electroplating a substrate |
| EP2084748A4 (de) | 2006-09-24 | 2011-09-28 | Shocking Technologies Inc | Formulierungen für ein spannungsumschaltbares dielektrisches material mit einem abgestuften spannungsansprechverhalten und herstellungsverfahren dafür |
| DE102006047377A1 (de) * | 2006-10-06 | 2008-04-10 | Robert Bosch Gmbh | Elektrostatischer Entladungsschutz |
| US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
| US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
| US20090050856A1 (en) | 2007-08-20 | 2009-02-26 | Lex Kosowsky | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
| US8206614B2 (en) | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
| US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
| JP2012504870A (ja) | 2008-09-30 | 2012-02-23 | ショッキング テクノロジーズ インコーポレイテッド | 導電コアシェル粒子を含有する電圧で切替可能な誘電体材料 |
| US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
| US8362871B2 (en) | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
| CN102361920A (zh) | 2009-01-23 | 2012-02-22 | 肖克科技有限公司 | 介电组合物 |
| US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
| US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| KR101679099B1 (ko) | 2009-03-26 | 2016-11-23 | 쇼킹 테크놀로지스 인코포레이티드 | 전압 스위칭형 유전 물질을 갖는 소자 |
| US8199450B2 (en) | 2009-05-05 | 2012-06-12 | Samsung Electronics Co., Ltd. | ESD protection utilizing radiated thermal relief |
| US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
| US20110132645A1 (en) | 2009-12-04 | 2011-06-09 | Ning Shi | Granular varistor and applications for use thereof |
| US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
| US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
| US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
| US8947852B2 (en) | 2011-07-07 | 2015-02-03 | Kemet Electronics Corporation | Integrated EMI filter and surge protection component |
| US8885324B2 (en) | 2011-07-08 | 2014-11-11 | Kemet Electronics Corporation | Overvoltage protection component |
| US9142353B2 (en) | 2011-07-08 | 2015-09-22 | Kemet Electronics Corporation | Discharge capacitor |
| US20130194708A1 (en) | 2012-01-30 | 2013-08-01 | Sony Ericsson Mobile Communications Ab | Current Carrying Structures Having Enhanced Electrostatic Discharge Protection And Methods Of Manufacture |
| CN103021894B (zh) * | 2012-12-30 | 2015-07-08 | 深圳中科系统集成技术有限公司 | 多路静电释放保护器件的加工方法 |
| TWI521659B (zh) * | 2013-05-02 | 2016-02-11 | 乾坤科技股份有限公司 | 電流導通元件 |
| US10388646B1 (en) | 2018-06-04 | 2019-08-20 | Sandisk Technologies Llc | Electrostatic discharge protection devices including a field-induced switching element |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3648364A (en) * | 1970-04-30 | 1972-03-14 | Hokuriku Elect Ind | Method of making a printed resistor |
| US3742420A (en) * | 1971-10-21 | 1973-06-26 | J Harnden | Protective electrical feed through assemblies for enclosures for electrical devices |
| US4486738A (en) * | 1982-02-16 | 1984-12-04 | General Electric Ceramics, Inc. | High reliability electrical components |
| US4788523A (en) * | 1987-12-10 | 1988-11-29 | United States Of America | Viad chip resistor |
| AU627663B2 (en) * | 1990-07-25 | 1992-08-27 | Matsushita Electric Industrial Co., Ltd. | Sic thin-film thermistor |
| JP2581348B2 (ja) * | 1991-07-29 | 1997-02-12 | 日立化成工業株式会社 | チップ型ヒューズの製造法 |
| US5262754A (en) * | 1992-09-23 | 1993-11-16 | Electromer Corporation | Overvoltage protection element |
| US5340641A (en) * | 1993-02-01 | 1994-08-23 | Antai Xu | Electrical overstress pulse protection |
-
1997
- 1997-01-21 ES ES97902053T patent/ES2252774T3/es not_active Expired - Lifetime
- 1997-01-21 EP EP97902053A patent/EP0879470B1/de not_active Expired - Lifetime
- 1997-01-21 JP JP52621897A patent/JP4298791B2/ja not_active Expired - Lifetime
- 1997-01-21 AU AU15808/97A patent/AU1580897A/en not_active Abandoned
- 1997-01-21 AT AT97902053T patent/ATE309610T1/de not_active IP Right Cessation
- 1997-01-21 DE DE69734571T patent/DE69734571T2/de not_active Expired - Lifetime
- 1997-01-21 WO PCT/US1997/000781 patent/WO1997026665A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP4298791B2 (ja) | 2009-07-22 |
| EP0879470A4 (de) | 1999-08-25 |
| JP2000516031A (ja) | 2000-11-28 |
| DE69734571T2 (de) | 2006-08-10 |
| ES2252774T3 (es) | 2006-05-16 |
| EP0879470A1 (de) | 1998-11-25 |
| AU1580897A (en) | 1997-08-11 |
| WO1997026665A1 (en) | 1997-07-24 |
| EP0879470B1 (de) | 2005-11-09 |
| DE69734571D1 (de) | 2005-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |