ATE312417T1 - Selbstausrichtender uebergang zwischen einer uebertragungsleitung und einem modul - Google Patents
Selbstausrichtender uebergang zwischen einer uebertragungsleitung und einem modulInfo
- Publication number
- ATE312417T1 ATE312417T1 AT00969440T AT00969440T ATE312417T1 AT E312417 T1 ATE312417 T1 AT E312417T1 AT 00969440 T AT00969440 T AT 00969440T AT 00969440 T AT00969440 T AT 00969440T AT E312417 T1 ATE312417 T1 AT E312417T1
- Authority
- AT
- Austria
- Prior art keywords
- transmission line
- module
- transition
- self
- self aligning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Connection Structure (AREA)
- Optical Couplings Of Light Guides (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Electrotherapy Devices (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Combinations Of Printed Boards (AREA)
- Microwave Amplifiers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2000/009799 WO2002029923A1 (en) | 2000-10-06 | 2000-10-06 | Self-aligned transition between a transmission line and a module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE312417T1 true ATE312417T1 (de) | 2005-12-15 |
Family
ID=8164117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00969440T ATE312417T1 (de) | 2000-10-06 | 2000-10-06 | Selbstausrichtender uebergang zwischen einer uebertragungsleitung und einem modul |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6940361B1 (de) |
| EP (1) | EP1325533B1 (de) |
| JP (1) | JP3930803B2 (de) |
| CN (1) | CN100355147C (de) |
| AT (1) | ATE312417T1 (de) |
| AU (1) | AU2000279154A1 (de) |
| DE (1) | DE60024684T2 (de) |
| WO (1) | WO2002029923A1 (de) |
Families Citing this family (67)
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|---|---|---|---|---|
| KR100723635B1 (ko) * | 2005-12-08 | 2007-06-04 | 한국전자통신연구원 | 고주파 신호를 전달하기 위한 변환 회로 및 이를 구비한송수신 모듈 |
| GB0718706D0 (en) | 2007-09-25 | 2007-11-07 | Creative Physics Ltd | Method and apparatus for reducing laser speckle |
| WO2008069714A1 (en) * | 2006-12-05 | 2008-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | A surface-mountable waveguide arrangement |
| US11726332B2 (en) | 2009-04-27 | 2023-08-15 | Digilens Inc. | Diffractive projection apparatus |
| US9335604B2 (en) | 2013-12-11 | 2016-05-10 | Milan Momcilo Popovich | Holographic waveguide display |
| TWM371979U (en) * | 2009-08-06 | 2010-01-01 | Microelectronics Tech Inc | Wave guide and assembly of wave guide and pcb |
| US11300795B1 (en) | 2009-09-30 | 2022-04-12 | Digilens Inc. | Systems for and methods of using fold gratings coordinated with output couplers for dual axis expansion |
| US11320571B2 (en) | 2012-11-16 | 2022-05-03 | Rockwell Collins, Inc. | Transparent waveguide display providing upper and lower fields of view with uniform light extraction |
| US10795160B1 (en) | 2014-09-25 | 2020-10-06 | Rockwell Collins, Inc. | Systems for and methods of using fold gratings for dual axis expansion |
| US8233204B1 (en) | 2009-09-30 | 2012-07-31 | Rockwell Collins, Inc. | Optical displays |
| US8659826B1 (en) | 2010-02-04 | 2014-02-25 | Rockwell Collins, Inc. | Worn display system and method without requiring real time tracking for boresight precision |
| US9274349B2 (en) | 2011-04-07 | 2016-03-01 | Digilens Inc. | Laser despeckler based on angular diversity |
| WO2013027004A1 (en) | 2011-08-24 | 2013-02-28 | Milan Momcilo Popovich | Wearable data display |
| US10670876B2 (en) | 2011-08-24 | 2020-06-02 | Digilens Inc. | Waveguide laser illuminator incorporating a despeckler |
| WO2016020630A2 (en) | 2014-08-08 | 2016-02-11 | Milan Momcilo Popovich | Waveguide laser illuminator incorporating a despeckler |
| US9715067B1 (en) | 2011-09-30 | 2017-07-25 | Rockwell Collins, Inc. | Ultra-compact HUD utilizing waveguide pupil expander with surface relief gratings in high refractive index materials |
| US9507150B1 (en) | 2011-09-30 | 2016-11-29 | Rockwell Collins, Inc. | Head up display (HUD) using a bent waveguide assembly |
| US8634139B1 (en) | 2011-09-30 | 2014-01-21 | Rockwell Collins, Inc. | System for and method of catadioptric collimation in a compact head up display (HUD) |
| US9366864B1 (en) | 2011-09-30 | 2016-06-14 | Rockwell Collins, Inc. | System for and method of displaying information without need for a combiner alignment detector |
| US20150010265A1 (en) | 2012-01-06 | 2015-01-08 | Milan, Momcilo POPOVICH | Contact image sensor using switchable bragg gratings |
| US9523852B1 (en) | 2012-03-28 | 2016-12-20 | Rockwell Collins, Inc. | Micro collimator system and method for a head up display (HUD) |
| CN106125308B (zh) | 2012-04-25 | 2019-10-25 | 罗克韦尔柯林斯公司 | 用于显示图像的装置和方法 |
| US9933684B2 (en) | 2012-11-16 | 2018-04-03 | Rockwell Collins, Inc. | Transparent waveguide display providing upper and lower fields of view having a specific light output aperture configuration |
| US9674413B1 (en) | 2013-04-17 | 2017-06-06 | Rockwell Collins, Inc. | Vision system and method having improved performance and solar mitigation |
| WO2015015138A1 (en) | 2013-07-31 | 2015-02-05 | Milan Momcilo Popovich | Method and apparatus for contact image sensing |
| US9244281B1 (en) | 2013-09-26 | 2016-01-26 | Rockwell Collins, Inc. | Display system and method using a detached combiner |
| US10732407B1 (en) | 2014-01-10 | 2020-08-04 | Rockwell Collins, Inc. | Near eye head up display system and method with fixed combiner |
| US9519089B1 (en) | 2014-01-30 | 2016-12-13 | Rockwell Collins, Inc. | High performance volume phase gratings |
| US9244280B1 (en) | 2014-03-25 | 2016-01-26 | Rockwell Collins, Inc. | Near eye display system and method for display enhancement or redundancy |
| WO2016020632A1 (en) | 2014-08-08 | 2016-02-11 | Milan Momcilo Popovich | Method for holographic mastering and replication |
| US10241330B2 (en) | 2014-09-19 | 2019-03-26 | Digilens, Inc. | Method and apparatus for generating input images for holographic waveguide displays |
| US9715110B1 (en) | 2014-09-25 | 2017-07-25 | Rockwell Collins, Inc. | Automotive head up display (HUD) |
| US10088675B1 (en) | 2015-05-18 | 2018-10-02 | Rockwell Collins, Inc. | Turning light pipe for a pupil expansion system and method |
| EP3245444B1 (de) | 2015-01-12 | 2021-09-08 | DigiLens Inc. | Umweltisolierte wellenleiteranzeige |
| US9632226B2 (en) | 2015-02-12 | 2017-04-25 | Digilens Inc. | Waveguide grating device |
| US10126552B2 (en) | 2015-05-18 | 2018-11-13 | Rockwell Collins, Inc. | Micro collimator system and method for a head up display (HUD) |
| US11366316B2 (en) | 2015-05-18 | 2022-06-21 | Rockwell Collins, Inc. | Head up display (HUD) using a light pipe |
| US10247943B1 (en) | 2015-05-18 | 2019-04-02 | Rockwell Collins, Inc. | Head up display (HUD) using a light pipe |
| US10108010B2 (en) | 2015-06-29 | 2018-10-23 | Rockwell Collins, Inc. | System for and method of integrating head up displays and head down displays |
| US10690916B2 (en) | 2015-10-05 | 2020-06-23 | Digilens Inc. | Apparatus for providing waveguide displays with two-dimensional pupil expansion |
| US10598932B1 (en) | 2016-01-06 | 2020-03-24 | Rockwell Collins, Inc. | Head up display for integrating views of conformally mapped symbols and a fixed image source |
| CN108780224B (zh) | 2016-03-24 | 2021-08-03 | 迪吉伦斯公司 | 用于提供偏振选择性全息波导装置的方法和设备 |
| WO2017178781A1 (en) | 2016-04-11 | 2017-10-19 | GRANT, Alastair, John | Holographic waveguide apparatus for structured light projection |
| EP3548939A4 (de) | 2016-12-02 | 2020-11-25 | DigiLens Inc. | Wellenleitervorrichtung mit gleichmässiger ausgabebeleuchtung |
| WO2018129398A1 (en) | 2017-01-05 | 2018-07-12 | Digilens, Inc. | Wearable heads up displays |
| US10295824B2 (en) | 2017-01-26 | 2019-05-21 | Rockwell Collins, Inc. | Head up display with an angled light pipe |
| JP6861588B2 (ja) * | 2017-07-07 | 2021-04-21 | 株式会社フジクラ | 伝送線路 |
| CN111386495B (zh) | 2017-10-16 | 2022-12-09 | 迪吉伦斯公司 | 用于倍增像素化显示器的图像分辨率的系统和方法 |
| EP3710876A4 (de) | 2018-01-08 | 2022-02-09 | DigiLens Inc. | Systeme und verfahren zur herstellung von wellenleiterzellen |
| US10914950B2 (en) | 2018-01-08 | 2021-02-09 | Digilens Inc. | Waveguide architectures and related methods of manufacturing |
| KR102745805B1 (ko) | 2018-01-08 | 2024-12-20 | 디지렌즈 인코포레이티드. | 광 도파관의 제조 방법 |
| US10732569B2 (en) | 2018-01-08 | 2020-08-04 | Digilens Inc. | Systems and methods for high-throughput recording of holographic gratings in waveguide cells |
| US11402801B2 (en) | 2018-07-25 | 2022-08-02 | Digilens Inc. | Systems and methods for fabricating a multilayer optical structure |
| US20200225471A1 (en) | 2019-01-14 | 2020-07-16 | Digilens Inc. | Holographic Waveguide Display with Light Control Layer |
| US20200247017A1 (en) | 2019-02-05 | 2020-08-06 | Digilens Inc. | Methods for Compensating for Optical Surface Nonuniformity |
| US20220283377A1 (en) | 2019-02-15 | 2022-09-08 | Digilens Inc. | Wide Angle Waveguide Display |
| CN120405821A (zh) | 2019-02-15 | 2025-08-01 | 迪吉伦斯公司 | 使用集成光栅提供全息波导显示的方法和装置 |
| US20200292745A1 (en) | 2019-03-12 | 2020-09-17 | Digilens Inc. | Holographic Waveguide Backlight and Related Methods of Manufacturing |
| US20200386947A1 (en) | 2019-06-07 | 2020-12-10 | Digilens Inc. | Waveguides Incorporating Transmissive and Reflective Gratings and Related Methods of Manufacturing |
| JP2022543571A (ja) | 2019-07-29 | 2022-10-13 | ディジレンズ インコーポレイテッド | 画素化されたディスプレイの画像解像度および視野を乗算するための方法および装置 |
| KR102775783B1 (ko) | 2019-08-29 | 2025-02-28 | 디지렌즈 인코포레이티드. | 진공 격자 및 이의 제조 방법 |
| DE102020121855A1 (de) | 2020-08-20 | 2022-02-24 | Infineon Technologies Ag | Hochfrequenz-Vorrichtungen und zugehörige Herstellungsverfahren |
| US12399326B2 (en) | 2021-01-07 | 2025-08-26 | Digilens Inc. | Grating structures for color waveguides |
| US12158612B2 (en) | 2021-03-05 | 2024-12-03 | Digilens Inc. | Evacuated periodic structures and methods of manufacturing |
| US12033950B2 (en) | 2021-07-13 | 2024-07-09 | Nxp Usa, Inc. | Semiconductor device with self-aligned waveguide and method therefor |
| CN118661138A (zh) | 2021-12-29 | 2024-09-17 | 迪吉伦斯公司 | 利用倒置母版进行全息记录的方法和系统 |
| HU231635B1 (hu) * | 2022-04-13 | 2025-04-28 | Nivelco Ipari Elektronika Zrt. | Körpolarizált antenna csatoló szerkezet |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485986A (ja) * | 1990-07-30 | 1992-03-18 | Rohm Co Ltd | 印刷回路基板 |
| US5793263A (en) | 1996-05-17 | 1998-08-11 | University Of Massachusetts | Waveguide-microstrip transmission line transition structure having an integral slot and antenna coupling arrangement |
| JP2003068928A (ja) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | 高周波用配線基板の実装構造 |
-
2000
- 2000-10-06 AT AT00969440T patent/ATE312417T1/de not_active IP Right Cessation
- 2000-10-06 EP EP00969440A patent/EP1325533B1/de not_active Expired - Lifetime
- 2000-10-06 US US10/398,440 patent/US6940361B1/en not_active Expired - Fee Related
- 2000-10-06 AU AU2000279154A patent/AU2000279154A1/en not_active Abandoned
- 2000-10-06 WO PCT/EP2000/009799 patent/WO2002029923A1/en not_active Ceased
- 2000-10-06 JP JP2002533428A patent/JP3930803B2/ja not_active Expired - Fee Related
- 2000-10-06 DE DE60024684T patent/DE60024684T2/de not_active Expired - Lifetime
- 2000-10-06 CN CNB008199477A patent/CN100355147C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100355147C (zh) | 2007-12-12 |
| JP3930803B2 (ja) | 2007-06-13 |
| WO2002029923A1 (en) | 2002-04-11 |
| JP2004511155A (ja) | 2004-04-08 |
| US6940361B1 (en) | 2005-09-06 |
| CN1454402A (zh) | 2003-11-05 |
| DE60024684T2 (de) | 2006-06-22 |
| EP1325533B1 (de) | 2005-12-07 |
| DE60024684D1 (de) | 2006-01-12 |
| EP1325533A1 (de) | 2003-07-09 |
| AU2000279154A1 (en) | 2002-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |