ATE313242T1 - Elektronische einrichtung - Google Patents

Elektronische einrichtung

Info

Publication number
ATE313242T1
ATE313242T1 AT02729402T AT02729402T ATE313242T1 AT E313242 T1 ATE313242 T1 AT E313242T1 AT 02729402 T AT02729402 T AT 02729402T AT 02729402 T AT02729402 T AT 02729402T AT E313242 T1 ATE313242 T1 AT E313242T1
Authority
AT
Austria
Prior art keywords
printed
electronic device
circuit board
chamber
dissipation
Prior art date
Application number
AT02729402T
Other languages
English (en)
Inventor
Marcos Guilherme Schwarz
Original Assignee
Brasil Compressores Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brasil Compressores Sa filed Critical Brasil Compressores Sa
Application granted granted Critical
Publication of ATE313242T1 publication Critical patent/ATE313242T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Liquid Crystal Substances (AREA)
  • Glass Compositions (AREA)
AT02729402T 2001-01-11 2002-01-11 Elektronische einrichtung ATE313242T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BRPI0100051A BRPI0100051B1 (pt) 2001-01-11 2001-01-11 gabinete de dispositivo eletrônico
PCT/BR2002/000005 WO2002056659A1 (en) 2001-01-11 2002-01-11 An electronic device

Publications (1)

Publication Number Publication Date
ATE313242T1 true ATE313242T1 (de) 2005-12-15

Family

ID=36776505

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02729402T ATE313242T1 (de) 2001-01-11 2002-01-11 Elektronische einrichtung

Country Status (11)

Country Link
US (2) US20040075986A1 (de)
EP (1) EP1360884B1 (de)
JP (2) JP4410466B2 (de)
CN (1) CN100459837C (de)
AT (1) ATE313242T1 (de)
BR (1) BRPI0100051B1 (de)
DE (1) DE60207989T2 (de)
ES (1) ES2256471T3 (de)
MX (1) MXPA03006187A (de)
SK (1) SK287825B6 (de)
WO (1) WO2002056659A1 (de)

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US8358506B2 (en) * 2010-08-27 2013-01-22 Direct Grid Technologies, LLC Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations
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US9414530B1 (en) * 2012-12-18 2016-08-09 Amazon Technologies, Inc. Altering thermal conductivity in devices
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WO2015105849A1 (en) * 2014-01-08 2015-07-16 Enphase Energy, Inc. Double insulated heat spreader
JP6198068B2 (ja) 2014-11-19 2017-09-20 株式会社デンソー 電子装置
JP6201966B2 (ja) 2014-11-25 2017-09-27 株式会社デンソー 電子装置
BR202014032719Y1 (pt) * 2014-12-26 2020-04-07 Embraco Ind De Compressores E Solucoes Em Refrigeracao Ltda gabinete de dispositivo eletrônico
WO2016121660A1 (ja) * 2015-01-29 2016-08-04 京セラ株式会社 回路基板および電子装置
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
JP2016219599A (ja) * 2015-05-20 2016-12-22 株式会社リコー 電子機器および熱拡散体
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
JP2017188597A (ja) * 2016-04-07 2017-10-12 アズビル株式会社 基板ユニットおよび基板ユニットの製造方法
CN106211553B (zh) * 2016-07-28 2019-04-19 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
CN206472427U (zh) * 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
ES2971209T3 (es) * 2016-11-16 2024-06-04 Integra Lifesciences Entpr Lllp Pieza de mano quirúrgica ultrasónica
CN106877629A (zh) * 2017-02-17 2017-06-20 华为技术有限公司 一种插脚散热的电源适配器
CN107172840B (zh) * 2017-06-08 2022-11-15 歌尔科技有限公司 一种云台Camera惯性测量单元隔热固定结构
JP6622785B2 (ja) * 2017-12-19 2019-12-18 ファナック株式会社 電子部品ユニット
US10849217B2 (en) * 2018-07-02 2020-11-24 Aptiv Technologies Limited Electrical-circuit assembly with heat-sink
US11121058B2 (en) 2019-07-24 2021-09-14 Aptiv Technologies Limited Liquid cooled module with device heat spreader
US20220217870A1 (en) * 2019-09-06 2022-07-07 Hewlett-Packard Development Company, L.P. Circuit boards for electronic devices
DE102019215696A1 (de) * 2019-10-11 2021-04-15 Continental Teves Ag & Co. Ohg Elektronikeinheit mit verbesserter Kühlung
JP7349030B2 (ja) * 2020-02-07 2023-09-21 ケーエムダブリュ・インコーポレーテッド 電装素子の放熱装置
CN115298900B (zh) * 2020-02-07 2026-02-13 株式会社Kmw 电子元件的散热装置
US11382205B2 (en) 2020-09-16 2022-07-05 Aptiv Technologies Limited Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly
JP7521353B2 (ja) * 2020-09-25 2024-07-24 富士通オプティカルコンポーネンツ株式会社 光通信モジュール
WO2022252019A1 (zh) * 2021-05-31 2022-12-08 华为数字能源技术有限公司 一种电源适配器以及电子设备系统
CN114071919B (zh) * 2021-11-16 2023-08-18 中国电子科技集团公司第二十九研究所 一种高密度集成的大功率电子模块
US20250380367A1 (en) * 2024-06-11 2025-12-11 SanDisk Technologies, Inc. Electronic device having a double-walled housing that acts as a thermal barrier

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Also Published As

Publication number Publication date
ES2256471T3 (es) 2006-07-16
US20070127217A1 (en) 2007-06-07
DE60207989T2 (de) 2006-08-24
US7576988B2 (en) 2009-08-18
JP2004517503A (ja) 2004-06-10
EP1360884B1 (de) 2005-12-14
EP1360884A1 (de) 2003-11-12
BRPI0100051B1 (pt) 2016-11-29
BR0100051A (pt) 2002-09-24
SK287825B6 (sk) 2011-11-04
MXPA03006187A (es) 2004-11-12
DE60207989D1 (de) 2006-01-19
US20040075986A1 (en) 2004-04-22
JP2008135771A (ja) 2008-06-12
SK8522003A3 (en) 2003-12-02
CN100459837C (zh) 2009-02-04
CN1484936A (zh) 2004-03-24
WO2002056659A1 (en) 2002-07-18
JP4410466B2 (ja) 2010-02-03

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