ATE316247T1 - Kassette zum einbrennen und testen eines wafers - Google Patents

Kassette zum einbrennen und testen eines wafers

Info

Publication number
ATE316247T1
ATE316247T1 AT00955244T AT00955244T ATE316247T1 AT E316247 T1 ATE316247 T1 AT E316247T1 AT 00955244 T AT00955244 T AT 00955244T AT 00955244 T AT00955244 T AT 00955244T AT E316247 T1 ATE316247 T1 AT E316247T1
Authority
AT
Austria
Prior art keywords
wafer
probe
plate
jaws
male connector
Prior art date
Application number
AT00955244T
Other languages
English (en)
Inventor
Frank Otto Uher
John William Andberg
Mark Charles Carbone
Donald Paul Ii Richmond
Original Assignee
Aehr Test Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/353,121 external-priority patent/US6562636B1/en
Priority claimed from US09/353,116 external-priority patent/US6580283B1/en
Priority claimed from US09/353,214 external-priority patent/US6340895B1/en
Application filed by Aehr Test Systems filed Critical Aehr Test Systems
Application granted granted Critical
Publication of ATE316247T1 publication Critical patent/ATE316247T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measuring Leads Or Probes (AREA)
AT00955244T 1999-07-14 2000-07-13 Kassette zum einbrennen und testen eines wafers ATE316247T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/353,121 US6562636B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and electrical test system and method
US09/353,116 US6580283B1 (en) 1999-07-14 1999-07-14 Wafer level burn-in and test methods
US09/353,214 US6340895B1 (en) 1999-07-14 1999-07-14 Wafer-level burn-in and test cartridge

Publications (1)

Publication Number Publication Date
ATE316247T1 true ATE316247T1 (de) 2006-02-15

Family

ID=27408093

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00955244T ATE316247T1 (de) 1999-07-14 2000-07-13 Kassette zum einbrennen und testen eines wafers

Country Status (8)

Country Link
EP (2) EP1218765B1 (de)
JP (1) JP2003504890A (de)
KR (1) KR100735111B1 (de)
CN (1) CN100492040C (de)
AT (1) ATE316247T1 (de)
AU (1) AU6747300A (de)
DE (1) DE60025618T2 (de)
WO (1) WO2001004643A2 (de)

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JP4173306B2 (ja) 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
JP4464237B2 (ja) * 2004-09-30 2010-05-19 Ｎｅｃエレクトロニクス株式会社 バーンイン試験方法，及び，それに用いるバーンイン用測定プログラム
JP2006292727A (ja) * 2005-03-18 2006-10-26 Alps Electric Co Ltd 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
WO2007095555A2 (en) * 2006-02-13 2007-08-23 Finisar Corporation Automated characterization system for laser chip on a submount
CN100360944C (zh) * 2006-03-01 2008-01-09 友达光电股份有限公司 电压检测电路以及电压检测系统
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (de) 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testen von integrierten Schaltungen auf einem Wafer mit einer die Oberfläche freiliegen lassenden Kassette
US7924033B2 (en) * 2008-03-21 2011-04-12 Electro Scientific Industries, Inc. Compensation tool for calibrating an electronic component testing machine to a standardized value
US8030957B2 (en) * 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US8872532B2 (en) * 2009-12-31 2014-10-28 Formfactor, Inc. Wafer test cassette system
CN104048907A (zh) * 2013-03-14 2014-09-17 深圳市海洋王照明工程有限公司 密封圈老化测试装置
CN103487613A (zh) * 2013-09-27 2014-01-01 安徽赛福电子有限公司 电容器芯组耐压测试夹持装置
KR101711111B1 (ko) * 2015-08-21 2017-02-28 주식회사 쎄믹스 웨이퍼 프로버용 카트리지 조립 및 분해 장치 및 그 제어 방법
US10094873B2 (en) 2015-08-28 2018-10-09 Nxp Usa, Inc. High capacity I/O (input/output) cells
TWI700499B (zh) * 2019-07-17 2020-08-01 美商第一檢測有限公司 晶片測試系統
EP4318246A4 (de) 2021-03-23 2025-02-19 Kioxia Corporation Speichersystem
EP4524582A1 (de) * 2023-09-15 2025-03-19 Microtest S.p.A. Patrone für wafer ebene burn-in (wlbi) chip test, verfahren zum laden dieser patrone und maschine für den burn-in test, die diese patrone enthält
CN119644093A (zh) * 2023-09-15 2025-03-18 芯卓科技(浙江)有限公司 晶圆测试盒
KR102648394B1 (ko) * 2023-11-15 2024-03-18 주식회사 유니테스트 웨이퍼 검사용 프로브 카드 홀더
CN117443786B (zh) * 2023-12-22 2024-03-12 杭州芯云半导体技术有限公司 一种基于老化测试的半导体器件分选方法及系统
KR20250122081A (ko) * 2024-02-06 2025-08-13 주식회사 유니테스트 카트리지 모듈 및, 이를 이용한 멀티 웨이퍼 테스트 장치

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DE3850664T2 (de) * 1987-03-11 1994-10-20 Hewlett Packard Co Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche.
US4968931A (en) * 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US5570032A (en) * 1993-08-17 1996-10-29 Micron Technology, Inc. Wafer scale burn-in apparatus and process
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JP2828410B2 (ja) * 1993-12-21 1998-11-25 松下電器産業株式会社 プローブカード及び半導体チップの検査方法
JP3108398B2 (ja) * 1993-12-21 2000-11-13 松下電器産業株式会社 プローブカードの製造方法
JP2922486B2 (ja) * 1993-12-21 1999-07-26 松下電器産業株式会社 プローブカード
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US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5808474A (en) * 1994-11-30 1998-09-15 Lsi Logic Corporation Test socket for testing integrated circuit packages
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Also Published As

Publication number Publication date
JP2003504890A (ja) 2003-02-04
CN100492040C (zh) 2009-05-27
DE60025618T2 (de) 2006-08-03
CN1384922A (zh) 2002-12-11
EP1218765B1 (de) 2006-01-18
AU6747300A (en) 2001-01-30
EP1218765A2 (de) 2002-07-03
DE60025618D1 (de) 2006-04-06
EP1445620A1 (de) 2004-08-11
KR100735111B1 (ko) 2007-07-06
WO2001004643A2 (en) 2001-01-18
KR20020030082A (ko) 2002-04-22
WO2001004643A3 (en) 2002-04-18

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Legal Events

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