ATE31843T1 - Metallhalbleiter-absetzung. - Google Patents

Metallhalbleiter-absetzung.

Info

Publication number
ATE31843T1
ATE31843T1 AT84307712T AT84307712T ATE31843T1 AT E31843 T1 ATE31843 T1 AT E31843T1 AT 84307712 T AT84307712 T AT 84307712T AT 84307712 T AT84307712 T AT 84307712T AT E31843 T1 ATE31843 T1 AT E31843T1
Authority
AT
Austria
Prior art keywords
metal semiconductor
semiconductor deposition
metal
layer
thickness
Prior art date
Application number
AT84307712T
Other languages
English (en)
Inventor
Brian Dr Martin
Original Assignee
British Telecomm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Telecomm filed Critical British Telecomm
Application granted granted Critical
Publication of ATE31843T1 publication Critical patent/ATE31843T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/202—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials for lift-off processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
AT84307712T 1983-11-22 1984-11-08 Metallhalbleiter-absetzung. ATE31843T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB838331158A GB8331158D0 (en) 1983-11-22 1983-11-22 Metal/semiconductor deposition
EP84307712A EP0145272B1 (de) 1983-11-22 1984-11-08 Metallhalbleiter-Absetzung

Publications (1)

Publication Number Publication Date
ATE31843T1 true ATE31843T1 (de) 1988-01-15

Family

ID=10552173

Family Applications (1)

Application Number Title Priority Date Filing Date
AT84307712T ATE31843T1 (de) 1983-11-22 1984-11-08 Metallhalbleiter-absetzung.

Country Status (7)

Country Link
US (1) US4568411A (de)
EP (1) EP0145272B1 (de)
JP (1) JPS60167448A (de)
AT (1) ATE31843T1 (de)
CA (1) CA1219835A (de)
DE (1) DE3468584D1 (de)
GB (1) GB8331158D0 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712291A (en) * 1985-06-06 1987-12-15 The United States Of America As Represented By The Secretary Of The Air Force Process of fabricating TiW/Si self-aligned gate for GaAs MESFETs
US4670297A (en) * 1985-06-21 1987-06-02 Raytheon Company Evaporated thick metal and airbridge interconnects and method of manufacture
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
US4853080A (en) * 1988-12-14 1989-08-01 Hewlett-Packard Lift-off process for patterning shields in thin magnetic recording heads
HU221294B1 (en) * 1989-07-07 2002-09-28 Novartis Ag Process for producing retarde compositions containing the active ingredient in a polymeric carrier
JPH06215329A (ja) * 1992-11-18 1994-08-05 Mitsumi Electric Co Ltd 微細導電パターンの形成方法
US5770350A (en) * 1993-11-09 1998-06-23 Lg Semicon Co. Ltd. Method for forming pattern using multilayer resist
JP2000199968A (ja) * 1999-01-06 2000-07-18 Sony Corp 多層レジスト構造およびこれを用いた３次元微細構造の作製方法
US7892974B2 (en) 2000-04-11 2011-02-22 Cree, Inc. Method of forming vias in silicon carbide and resulting devices and circuits
US20070036890A1 (en) * 2005-08-12 2007-02-15 Feng Zhong Method of making a fuel cell component using a mask
US11948848B2 (en) * 2019-02-12 2024-04-02 Intel Corporation Subtractive etch resolution implementing a functional thin metal resist
CN110379707B (zh) * 2019-08-21 2024-05-28 无锡英菲感知技术有限公司 一种金属图形化的剥离结构及其制作方法
JP6875480B2 (ja) * 2019-09-27 2021-05-26 マクセルホールディングス株式会社 蒸着マスク及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370764A (en) * 1976-12-07 1978-06-23 Fujitsu Ltd Electrode formation method by lift off method
IT1096042B (it) * 1978-06-26 1985-08-17 Cise Spa Struttura di fotoresist particolarmente adatta per la deposizione fotolitografica di strisce metalliche parallele su un substrato di base e procedimento per la sua realizzazione
NL8004573A (nl) * 1979-09-19 1981-03-23 Gen Electric Werkwijze voor het vervaardigen van samengestelde voorwerpen.
EP0031463B1 (de) * 1979-12-26 1984-06-13 International Business Machines Corporation Verfahren zum musterförmigen Anbringen eines Materials auf einem Substrat und Verwendung dieses Verfahrens zur Herstellung einer gemusterten Maskenstruktur auf einem Halbleitersubstrat
JPS56147449A (en) * 1980-04-18 1981-11-16 Fujitsu Ltd Pattern forming method
IT1226065B (it) * 1987-10-29 1990-12-10 Vittoria Spa Off Carcassa orditale per pneumatici per cicli in genere ed in particolare per biciclette sportive e da corsa.

Also Published As

Publication number Publication date
JPS60167448A (ja) 1985-08-30
DE3468584D1 (en) 1988-02-11
CA1219835A (en) 1987-03-31
EP0145272A2 (de) 1985-06-19
EP0145272B1 (de) 1988-01-07
EP0145272A3 (en) 1985-07-31
GB8331158D0 (en) 1983-12-29
US4568411A (en) 1986-02-04

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee