ATE318698T1 - Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat die elektrolytische kupferfolie benutzend - Google Patents

Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat die elektrolytische kupferfolie benutzend

Info

Publication number
ATE318698T1
ATE318698T1 AT00915371T AT00915371T ATE318698T1 AT E318698 T1 ATE318698 T1 AT E318698T1 AT 00915371 T AT00915371 T AT 00915371T AT 00915371 T AT00915371 T AT 00915371T AT E318698 T1 ATE318698 T1 AT E318698T1
Authority
AT
Austria
Prior art keywords
foil
electrolytic copper
copper foil
carrier
backing
Prior art date
Application number
AT00915371T
Other languages
English (en)
Inventor
Junshi Yoshioka
Akiko Sugimoto
Sakiko Taenaka
Makoto Dobashi
Tsutomu Higuchi
Takuya Yamamoto
Ken-Ichiro Iwakiri
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE318698T1 publication Critical patent/ATE318698T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AT00915371T 1999-08-24 2000-04-06 Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat die elektrolytische kupferfolie benutzend ATE318698T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23756599A JP3370624B2 (ja) 1999-08-24 1999-08-24 キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板

Publications (1)

Publication Number Publication Date
ATE318698T1 true ATE318698T1 (de) 2006-03-15

Family

ID=17017207

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00915371T ATE318698T1 (de) 1999-08-24 2000-04-06 Elektrolytische kupferfolie mit trägerfolie und kupferkaschiertes laminat die elektrolytische kupferfolie benutzend

Country Status (10)

Country Link
US (1) US6541126B1 (de)
EP (1) EP1184165B1 (de)
JP (1) JP3370624B2 (de)
KR (1) KR100418491B1 (de)
CN (1) CN1174857C (de)
AT (1) ATE318698T1 (de)
DE (1) DE60026280T2 (de)
HK (1) HK1039471A1 (de)
TW (1) TWI244358B (de)
WO (1) WO2001014135A1 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3466506B2 (ja) 1999-04-23 2003-11-10 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
JP3628585B2 (ja) * 2000-04-05 2005-03-16 株式会社日鉱マテリアルズ 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法
US20020182432A1 (en) * 2000-04-05 2002-12-05 Masaru Sakamoto Laser hole drilling copper foil
JP3690962B2 (ja) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板
LU90804B1 (fr) * 2001-07-18 2003-01-20 Circuit Foil Luxembourg Trading Sarl Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
EP1542519A4 (de) * 2002-07-31 2010-01-06 Sony Corp Verfahren zur leiterplattenherstellung mit eingebauter einrichtung und leiterplatte mit eingebauter einrichtung und verfahren zur herstellung einer gedruckten leiterplatte und gedruckte leiterplatte
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP5057221B2 (ja) * 2007-08-24 2012-10-24 中村製作所株式会社 放熱部付き金属ベースプリント基板及びその製造方法
JP5181618B2 (ja) * 2007-10-24 2013-04-10 宇部興産株式会社 金属箔積層ポリイミド樹脂基板
WO2010006313A1 (en) * 2008-07-10 2010-01-14 Robert Norman Calliham Method for producing copper-clad aluminum wire
JP5328281B2 (ja) * 2008-10-03 2013-10-30 三井金属鉱業株式会社 多層プリント配線板の製造方法及びその方法を用いて得られる多層プリント配線板
JP2009143234A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
JP2009143233A (ja) * 2008-12-24 2009-07-02 Nippon Mining & Metals Co Ltd キャリア付金属箔
TWI384925B (zh) * 2009-03-17 2013-02-01 Advanced Semiconductor Eng 內埋式線路基板之結構及其製造方法
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5609344B2 (ja) * 2010-07-12 2014-10-22 Ｊｆｅスチール株式会社 電気亜鉛めっき鋼板の製造方法
CN102376863A (zh) * 2010-08-06 2012-03-14 晶元光电股份有限公司 发光元件的制造方法
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
JP4824828B1 (ja) * 2010-11-04 2011-11-30 福田金属箔粉工業株式会社 複合金属箔及びその製造方法並びにプリント配線板
US10212814B2 (en) 2012-03-01 2019-02-19 Mitsui Mining & Smelting Co., Ltd. Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
JP5204908B1 (ja) 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5175992B1 (ja) * 2012-07-06 2013-04-03 Ｊｘ日鉱日石金属株式会社 極薄銅箔及びその製造方法、並びに極薄銅層
EP2894030A4 (de) 2012-09-05 2016-04-20 Toray Industries Laminierter körper
TWI486260B (zh) * 2012-11-16 2015-06-01 Nanya Plastics Corp 具有黑色極薄銅箔之銅箔結構及其製造方法
CN103972513B (zh) * 2013-02-06 2016-08-17 永箔科技股份有限公司 多孔性集流体金属材料连续加工法
JP6425399B2 (ja) * 2013-03-28 2018-11-21 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JP5543647B2 (ja) * 2013-07-23 2014-07-09 三井金属鉱業株式会社 コアレスビルドアップ用支持基板
CN109951964A (zh) 2013-07-23 2019-06-28 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、及树脂基材
WO2015080052A1 (ja) * 2013-11-27 2015-06-04 三井金属鉱業株式会社 キャリア箔付銅箔及び銅張積層板
JP6734785B2 (ja) * 2014-12-08 2020-08-05 三井金属鉱業株式会社 プリント配線板の製造方法
CN104968155B (zh) * 2015-06-03 2018-01-02 合肥工业大学 一种用于形成超薄铜箔剥离层的有机组合物及制备和应用
US9397343B1 (en) * 2015-10-15 2016-07-19 Chang Chun Petrochemical Co., Ltd. Copper foil exhibiting anti-swelling properties
KR101809985B1 (ko) 2017-03-30 2017-12-18 와이엠티 주식회사 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박
US10892671B2 (en) * 2017-07-25 2021-01-12 GM Global Technology Operations LLC Electrically conductive copper components and joining processes therefor
US11365486B2 (en) * 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
CN111058063B (zh) * 2018-10-16 2021-02-02 长春石油化学股份有限公司 电解铜箔、包含其的电极、及包含其的锂离子电池
US12408279B2 (en) 2020-12-10 2025-09-02 Ymt Co., Ltd. Release layer for metal foil with carrier and metal foil comprising the same

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EP0405369B1 (de) * 1989-06-23 1996-02-28 Toagosei Co., Ltd. Verfahren zur Herstellung eines kupferkaschierten Laminats
JPH05102630A (ja) * 1991-10-03 1993-04-23 Hitachi Chem Co Ltd キヤリア付銅箔の製造方法及びそれを用いた銅張積層板
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
JP3224704B2 (ja) * 1994-12-05 2001-11-05 三井金属鉱業株式会社 有機防錆処理銅箔
JPH10146915A (ja) * 1996-11-18 1998-06-02 Mitsubishi Gas Chem Co Inc 接着剤付き極薄銅箔
US6270889B1 (en) * 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6346335B1 (en) * 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer

Also Published As

Publication number Publication date
EP1184165A1 (de) 2002-03-06
HK1039471A1 (zh) 2002-04-26
DE60026280D1 (de) 2006-04-27
KR100418491B1 (ko) 2004-02-11
KR20010075617A (ko) 2001-08-09
EP1184165A4 (de) 2004-10-06
WO2001014135A1 (fr) 2001-03-01
EP1184165B1 (de) 2006-03-01
JP2001062955A (ja) 2001-03-13
CN1174857C (zh) 2004-11-10
JP3370624B2 (ja) 2003-01-27
US6541126B1 (en) 2003-04-01
DE60026280T2 (de) 2006-10-12
CN1321121A (zh) 2001-11-07
TWI244358B (en) 2005-11-21

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