ATE319174T1 - Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion - Google Patents

Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion

Info

Publication number
ATE319174T1
ATE319174T1 AT97946227T AT97946227T ATE319174T1 AT E319174 T1 ATE319174 T1 AT E319174T1 AT 97946227 T AT97946227 T AT 97946227T AT 97946227 T AT97946227 T AT 97946227T AT E319174 T1 ATE319174 T1 AT E319174T1
Authority
AT
Austria
Prior art keywords
multilayer
component
condenser
multilayer ceramic
new component
Prior art date
Application number
AT97946227T
Other languages
English (en)
Inventor
Zoran Zivic
Original Assignee
Keko Varicon D O O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keko Varicon D O O filed Critical Keko Varicon D O O
Application granted granted Critical
Publication of ATE319174T1 publication Critical patent/ATE319174T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H01C7/112—ZnO type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Thermistors And Varistors (AREA)
  • Bipolar Integrated Circuits (AREA)
AT97946227T 1996-11-11 1997-11-10 Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion ATE319174T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SI9600330A SI9600330A (sl) 1996-11-11 1996-11-11 Zaščitna komponenta z več funkcijami

Publications (1)

Publication Number Publication Date
ATE319174T1 true ATE319174T1 (de) 2006-03-15

Family

ID=20431944

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97946227T ATE319174T1 (de) 1996-11-11 1997-11-10 Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion

Country Status (7)

Country Link
US (2) US6328176B1 (de)
EP (2) EP1632959A3 (de)
KR (1) KR19990077149A (de)
AT (1) ATE319174T1 (de)
DE (1) DE69735378T2 (de)
SI (1) SI9600330A (de)
WO (1) WO1998021731A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060151A (ja) * 2001-08-10 2003-02-28 Fujitsu Ltd 半導体装置
KR100490500B1 (ko) * 2002-09-04 2005-05-17 주식회사 이노칩테크놀로지 도금 특성이 우수한 칩부품 및 그 제조방법
KR101087464B1 (ko) * 2003-08-08 2011-11-25 밸리언트 인터내셔널(바베이도스) 에스알엘 부프로피온 히드로클로라이드의 개질 방출형 정제
DE102004045009B4 (de) * 2004-09-16 2008-03-27 Epcos Ag Elektrisches Bauelement und dessen Verwendung
US9968120B2 (en) * 2006-05-17 2018-05-15 Dsm Nutritional Products Ag Homogenized formulations containing microcapsules and methods of making and using thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105404A (ja) * 1988-10-13 1990-04-18 Nec Corp セラミックコンデンサ
JPH02304910A (ja) * 1989-05-19 1990-12-18 Tama Electric Co Ltd 複合チップ素子
JPH0371614A (ja) * 1989-08-10 1991-03-27 Marcon Electron Co Ltd 面実装形複合部品
US5714802A (en) * 1991-06-18 1998-02-03 Micron Technology, Inc. High-density electronic module
JPH06283301A (ja) * 1993-03-29 1994-10-07 Mitsubishi Materials Corp チップ型複合電子部品及びその製造方法

Also Published As

Publication number Publication date
US6328176B1 (en) 2001-12-11
EP0875067B1 (de) 2006-03-01
US6395605B1 (en) 2002-05-28
SI9600330A (sl) 1998-06-30
EP1632959A3 (de) 2006-09-20
EP0875067A1 (de) 1998-11-04
DE69735378D1 (de) 2006-04-27
EP1632959A2 (de) 2006-03-08
KR19990077149A (ko) 1999-10-25
DE69735378T2 (de) 2006-11-30
WO1998021731A1 (en) 1998-05-22

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties