ATE321349T1 - Modul zur entkopplung von hochfrequenz-signalen von einer versorgungsleitung - Google Patents

Modul zur entkopplung von hochfrequenz-signalen von einer versorgungsleitung

Info

Publication number
ATE321349T1
ATE321349T1 AT03722919T AT03722919T ATE321349T1 AT E321349 T1 ATE321349 T1 AT E321349T1 AT 03722919 T AT03722919 T AT 03722919T AT 03722919 T AT03722919 T AT 03722919T AT E321349 T1 ATE321349 T1 AT E321349T1
Authority
AT
Austria
Prior art keywords
module
supply line
frequency signals
decoupling
high frequency
Prior art date
Application number
AT03722919T
Other languages
English (en)
Inventor
Marion Matters-Kammerer
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE321349T1 publication Critical patent/ATE321349T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/2039—Galvanic coupling between Input/Output
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Microwave Amplifiers (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Communication Cables (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Ceramic Capacitors (AREA)
  • Filters And Equalizers (AREA)
AT03722919T 2002-05-24 2003-05-13 Modul zur entkopplung von hochfrequenz-signalen von einer versorgungsleitung ATE321349T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10223295 2002-05-24

Publications (1)

Publication Number Publication Date
ATE321349T1 true ATE321349T1 (de) 2006-04-15

Family

ID=29557303

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03722919T ATE321349T1 (de) 2002-05-24 2003-05-13 Modul zur entkopplung von hochfrequenz-signalen von einer versorgungsleitung

Country Status (8)

Country Link
US (1) US7154735B2 (de)
EP (1) EP1512157B8 (de)
JP (1) JP2005527165A (de)
CN (1) CN100483581C (de)
AT (1) ATE321349T1 (de)
AU (1) AU2003230077A1 (de)
DE (1) DE60304172T2 (de)
WO (1) WO2003100800A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10255475A1 (de) * 2002-11-28 2004-06-09 Philips Intellectual Property & Standards Gmbh Entkopplungsmodul zum Auskoppeln hochfrequenter Signale aus einer mit einer Induktivität behafteten Spannungsversorgungsleitung
US9741673B2 (en) 2007-06-22 2017-08-22 Cree, Inc. RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
EP2867991B1 (de) 2012-06-29 2020-03-18 Cree, Inc. Rf-transistorpackungen mit stabilisierungsmerkmalen für hohe frequenzen
US8964427B2 (en) * 2012-06-29 2015-02-24 Rockwell Automation Technologies, Inc. Adaptive online filter for DC offset elimination
US9875848B2 (en) * 2015-12-21 2018-01-23 Qualcomm Incorporated MIM capacitor and method of making the same
CN112652873A (zh) * 2020-12-03 2021-04-13 北京工业大学 一种扇形微带线去耦电路的设计

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734819A (en) * 1985-12-20 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package
US5472900A (en) * 1991-12-31 1995-12-05 Intel Corporation Capacitor fabricated on a substrate containing electronic circuitry
US5422782A (en) * 1992-11-24 1995-06-06 Circuit Components Inc. Multiple resonant frequency decoupling capacitor
SE511824C2 (sv) * 1997-08-22 1999-12-06 Ericsson Telefon Ab L M Avkopplingskondensator samt chipsmodul
US6515359B1 (en) * 1998-01-20 2003-02-04 Micron Technology, Inc. Lead frame decoupling capacitor semiconductor device packages including the same and methods
US6801422B2 (en) * 1999-12-28 2004-10-05 Intel Corporation High performance capacitor
US6775150B1 (en) * 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
US6760232B2 (en) * 2001-03-16 2004-07-06 Sun Microsystems, Inc. Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages
US6700794B2 (en) * 2001-07-26 2004-03-02 Harris Corporation Decoupling capacitor closely coupled with integrated circuit
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance

Also Published As

Publication number Publication date
CN1656581A (zh) 2005-08-17
WO2003100800A1 (en) 2003-12-04
US20060007632A1 (en) 2006-01-12
EP1512157A1 (de) 2005-03-09
US7154735B2 (en) 2006-12-26
EP1512157B8 (de) 2006-07-19
DE60304172D1 (de) 2006-05-11
EP1512157B1 (de) 2006-03-22
JP2005527165A (ja) 2005-09-08
AU2003230077A1 (en) 2003-12-12
CN100483581C (zh) 2009-04-29
DE60304172T2 (de) 2007-01-04

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