ATE321363T1 - Einrichtung zum halten eines objekts unter vakuum und verfahren zu ihrer herstellung und benutzung in nichtgekühlten infrarotsensoren - Google Patents

Einrichtung zum halten eines objekts unter vakuum und verfahren zu ihrer herstellung und benutzung in nichtgekühlten infrarotsensoren

Info

Publication number
ATE321363T1
ATE321363T1 AT03762720T AT03762720T ATE321363T1 AT E321363 T1 ATE321363 T1 AT E321363T1 AT 03762720 T AT03762720 T AT 03762720T AT 03762720 T AT03762720 T AT 03762720T AT E321363 T1 ATE321363 T1 AT E321363T1
Authority
AT
Austria
Prior art keywords
object under
cavity
maintaining
production
under vacuum
Prior art date
Application number
AT03762720T
Other languages
English (en)
Inventor
Jean-Louis Ouvrier-Buffet
Sylvette Bisotto
Chantal Beccia
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE321363T1 publication Critical patent/ATE321363T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Physical Vapour Deposition (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
AT03762720T 2002-07-03 2003-07-01 Einrichtung zum halten eines objekts unter vakuum und verfahren zu ihrer herstellung und benutzung in nichtgekühlten infrarotsensoren ATE321363T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0208293A FR2842022B1 (fr) 2002-07-03 2002-07-03 Dispositif de maintien d'un objet sous vide et procedes de fabrication de ce dispositif, application aux detecteurs intrarouges non refroidis

Publications (1)

Publication Number Publication Date
ATE321363T1 true ATE321363T1 (de) 2006-04-15

Family

ID=29725107

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03762720T ATE321363T1 (de) 2002-07-03 2003-07-01 Einrichtung zum halten eines objekts unter vakuum und verfahren zu ihrer herstellung und benutzung in nichtgekühlten infrarotsensoren

Country Status (6)

Country Link
US (1) US7279682B2 (de)
EP (1) EP1518279B1 (de)
AT (1) ATE321363T1 (de)
DE (1) DE60304198T2 (de)
FR (1) FR2842022B1 (de)
WO (1) WO2004006290A2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015637A1 (ja) * 2003-08-08 2005-02-17 Matsushita Electric Industrial Co., Ltd. 電子デバイスおよびその製造方法
FR2874691B1 (fr) * 2004-08-24 2006-11-17 Ulis Soc Par Actions Simplifie Composant de detection de rayonnements electromagnetiques, et notamment infrarouge, bloc optique d'imagerie infrarouge integrant un tel composant et procede pour sa realisation
FR2879819B1 (fr) * 2004-12-21 2007-02-23 Ulis Soc Par Actions Simplifie Composant de detection de rayonnements electromagnetiques notamment infrarouges
IL165948A0 (en) * 2004-12-23 2006-01-15 Rafael Armament Dev Authority Chip packaging
DE102007042085B3 (de) * 2007-09-05 2009-03-05 Continental Automotive Gmbh Energiespeichersystem
FR2946777B1 (fr) 2009-06-12 2011-07-22 Commissariat Energie Atomique Dispositif de detection et/ou d'emission de rayonnement electromagnetique et procede de fabrication d'un tel dispositif
US8471206B1 (en) * 2009-07-14 2013-06-25 Flir Systems, Inc. Infrared detector vacuum test systems and methods
FR2981198B1 (fr) * 2011-10-11 2014-04-04 Commissariat Energie Atomique Structure d'encapsulation de dispositif electronique et procede de realisation d'une telle structure
FR2982073B1 (fr) * 2011-10-28 2014-10-10 Commissariat Energie Atomique Structure d'encapsulation hermetique d'un dispositif et d'un composant electronique
DE102012200327B4 (de) * 2012-01-11 2022-01-05 Osram Gmbh Optoelektronisches Bauelement
EP2736071B8 (de) * 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Verkapselung mit Getter auf Waferebene
US9864138B2 (en) 2015-01-05 2018-01-09 The Research Foundation For The State University Of New York Integrated photonics including germanium
US10976491B2 (en) 2016-11-23 2021-04-13 The Research Foundation For The State University Of New York Photonics interposer optoelectronics
US10698156B2 (en) 2017-04-27 2020-06-30 The Research Foundation For The State University Of New York Wafer scale bonded active photonics interposer
KR20220124298A (ko) 2018-04-04 2022-09-14 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 집적 포토닉스 플랫폼 상의 이종 구조
US10816724B2 (en) 2018-04-05 2020-10-27 The Research Foundation For The State University Of New York Fabricating photonics structure light signal transmission regions
US11029466B2 (en) 2018-11-21 2021-06-08 The Research Foundation For The State University Of New York Photonics structure with integrated laser
TWI851601B (zh) 2018-11-21 2024-08-11 紐約州立大學研究基金會 光子光電系統及其製造方法
US11550099B2 (en) 2018-11-21 2023-01-10 The Research Foundation For The State University Of New York Photonics optoelectrical system
EP3987578A2 (de) 2019-06-18 2022-04-27 The Research Foundation for The State University of New York Herstellung von leiterbahnen einer photonischen struktur
US20220254825A1 (en) * 2021-02-09 2022-08-11 Spring Rainbow Optics Co., Ltd Thermal sensor module with dual package
CN119191218A (zh) * 2024-09-26 2024-12-27 武汉高芯科技有限公司 一种光学器件真空封装结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60790B2 (ja) 1976-10-04 1985-01-10 富士通株式会社 冷却型光電変換装置
US5317157A (en) * 1991-11-20 1994-05-31 Fujitsu Limited Infrared ray detecting sensor with getter partition
US5293511A (en) * 1993-03-16 1994-03-08 Texas Instruments Incorporated Package for a semiconductor device
EP0734589B1 (de) * 1993-12-13 1998-03-25 Honeywell Inc. Integrierte silizium-vakuum-mikropackung für infrarot-geräte
US5921461A (en) * 1997-06-11 1999-07-13 Raytheon Company Vacuum package having vacuum-deposited local getter and its preparation
JP2000337959A (ja) * 1999-05-28 2000-12-08 Mitsubishi Electric Corp 赤外線検出器及びその製造方法
FR2816447B1 (fr) * 2000-11-07 2003-01-31 Commissariat Energie Atomique Dispositif de detection de rayonnements electromagnetiques tridimensionnel et procede de realisation de ce dispositif

Also Published As

Publication number Publication date
US7279682B2 (en) 2007-10-09
EP1518279A2 (de) 2005-03-30
WO2004006290A2 (fr) 2004-01-15
WO2004006290A3 (fr) 2004-04-15
DE60304198D1 (de) 2006-05-11
DE60304198T2 (de) 2006-12-14
FR2842022B1 (fr) 2005-05-06
EP1518279B1 (de) 2006-03-22
FR2842022A1 (fr) 2004-01-09
US20050211900A1 (en) 2005-09-29

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