ATE321628T1 - Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks - Google Patents

Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks

Info

Publication number
ATE321628T1
ATE321628T1 AT00401691T AT00401691T ATE321628T1 AT E321628 T1 ATE321628 T1 AT E321628T1 AT 00401691 T AT00401691 T AT 00401691T AT 00401691 T AT00401691 T AT 00401691T AT E321628 T1 ATE321628 T1 AT E321628T1
Authority
AT
Austria
Prior art keywords
abrasive
polishing
smooth
article
roughness
Prior art date
Application number
AT00401691T
Other languages
English (en)
Inventor
Jean-Jacques Ferme
Philippe Godefroy
Gilbert Dahan
Original Assignee
Seso
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9547373&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE321628(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Seso filed Critical Seso
Application granted granted Critical
Publication of ATE321628T1 publication Critical patent/ATE321628T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
AT00401691T 1999-06-28 2000-06-15 Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks ATE321628T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9908228 1999-06-28

Publications (1)

Publication Number Publication Date
ATE321628T1 true ATE321628T1 (de) 2006-04-15

Family

ID=9547373

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00401691T ATE321628T1 (de) 1999-06-28 2000-06-15 Verfahren zum polieren von mindestens einer seite eines silizium enthaltende werkstücks

Country Status (8)

Country Link
US (1) US6428395B1 (de)
EP (1) EP1066926B1 (de)
JP (1) JP2001009708A (de)
AT (1) ATE321628T1 (de)
DE (1) DE60026953T2 (de)
DK (1) DK1066926T3 (de)
ES (1) ES2261166T3 (de)
PT (1) PT1066926E (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100664609B1 (ko) 2004-10-20 2007-01-04 주식회사 신안에스엔피 오엘이디 용 유리기판의 연마방법 및 이를 이용하여 생산된 오엘이디용 유리기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61219566A (ja) * 1985-03-25 1986-09-29 Toshiba Corp 研磨定盤用材料
JPS6440267A (en) * 1987-08-07 1989-02-10 Shinetsu Chemical Co Manufacture of precisely polished glass
US5607718A (en) * 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
EP0692318B1 (de) * 1994-06-28 2001-09-12 Ebara Corporation Verfahren und Vorrichtung zum Reinigen von Werkstücken
US5704987A (en) * 1996-01-19 1998-01-06 International Business Machines Corporation Process for removing residue from a semiconductor wafer after chemical-mechanical polishing
JPH10180624A (ja) * 1996-12-19 1998-07-07 Shin Etsu Handotai Co Ltd ラッピング装置及び方法
JPH10204417A (ja) * 1997-01-27 1998-08-04 Kao Corp 加工用助剤組成物、研磨材組成物、表面加工方法及び基板の製造方法

Also Published As

Publication number Publication date
EP1066926A1 (de) 2001-01-10
DE60026953D1 (de) 2006-05-18
PT1066926E (pt) 2006-08-31
ES2261166T3 (es) 2006-11-16
US6428395B1 (en) 2002-08-06
EP1066926B1 (de) 2006-03-29
DK1066926T3 (da) 2006-08-07
JP2001009708A (ja) 2001-01-16
DE60026953T2 (de) 2007-04-05

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