ATE323939T1 - Anpassungsfähige und vernetzbare thermische schnittstellenmaterialien - Google Patents

Anpassungsfähige und vernetzbare thermische schnittstellenmaterialien

Info

Publication number
ATE323939T1
ATE323939T1 AT00965073T AT00965073T ATE323939T1 AT E323939 T1 ATE323939 T1 AT E323939T1 AT 00965073 T AT00965073 T AT 00965073T AT 00965073 T AT00965073 T AT 00965073T AT E323939 T1 ATE323939 T1 AT E323939T1
Authority
AT
Austria
Prior art keywords
thermal interface
networkable
adaptable
interface materials
malenized
Prior art date
Application number
AT00965073T
Other languages
English (en)
Inventor
My Nguyen
James Grundy
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of ATE323939T1 publication Critical patent/ATE323939T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S524/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S524/91—Antistatic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Organic Insulating Materials (AREA)
  • Wrappers (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Laminated Bodies (AREA)
AT00965073T 1999-09-17 2000-09-14 Anpassungsfähige und vernetzbare thermische schnittstellenmaterialien ATE323939T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/398,988 US6238596B1 (en) 1999-03-09 1999-09-17 Compliant and crosslinkable thermal interface materials

Publications (1)

Publication Number Publication Date
ATE323939T1 true ATE323939T1 (de) 2006-05-15

Family

ID=23577653

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00965073T ATE323939T1 (de) 1999-09-17 2000-09-14 Anpassungsfähige und vernetzbare thermische schnittstellenmaterialien

Country Status (9)

Country Link
US (1) US6238596B1 (de)
EP (1) EP1224669B1 (de)
JP (1) JP2003509574A (de)
KR (1) KR100723101B1 (de)
CN (2) CN1280836C (de)
AT (1) ATE323939T1 (de)
AU (1) AU7585600A (de)
DE (1) DE60027452T2 (de)
WO (1) WO2001020618A1 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6706219B2 (en) 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6797382B2 (en) * 1999-12-01 2004-09-28 Honeywell International Inc. Thermal interface materials
US6469379B1 (en) 2001-03-30 2002-10-22 Intel Corporation Chain extension for thermal materials
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
US7495046B2 (en) 2001-12-17 2009-02-24 Daikin Industries, Ltd. Crosslinkable elastomer composition and formed product comprising the same
US6597575B1 (en) 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US20040077773A1 (en) * 2002-07-12 2004-04-22 Tavares Manuel J Low viscosity, flexible, hydrolytically stable potting compounds
CN1681648A (zh) * 2002-07-15 2005-10-12 霍尼韦尔国际公司 热互连和界面系统,其制备方法及其应用
CN1318536C (zh) * 2003-12-13 2007-05-30 鸿富锦精密工业（深圳）有限公司 散热装置及其相变导热片
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
JP4714432B2 (ja) * 2004-07-09 2011-06-29 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性シート
CN100543103C (zh) * 2005-03-19 2009-09-23 清华大学 热界面材料及其制备方法
WO2007053571A2 (en) * 2005-11-01 2007-05-10 Techfilm, Llc Thermal interface material with multiple size distribution thermally conductive fillers
WO2007067393A2 (en) * 2005-12-05 2007-06-14 Corning Cable Systems Llc Polyester gel adapted for use with polycarbonate components
CN1978583A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 热介面材料
US20080023665A1 (en) * 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
WO2008030910A1 (en) * 2006-09-08 2008-03-13 Lord Corporation Flexible microelectronics adhesive
WO2009131913A2 (en) * 2008-04-21 2009-10-29 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US20100112360A1 (en) * 2008-10-31 2010-05-06 Delano Andrew D Layered thermal interface systems methods of production and uses thereof
WO2010104542A1 (en) 2009-03-02 2010-09-16 Honeywell International Inc. Thermal interface material and method of making and using the same
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
JP5218364B2 (ja) * 2009-10-02 2013-06-26 横浜ゴム株式会社 熱伝導性組成物
JP5814688B2 (ja) * 2010-08-31 2015-11-17 三木ポリマー株式会社 熱伝導性樹脂組成物およびそれを含む放熱材
JP6416188B2 (ja) 2013-03-14 2018-10-31 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス
US9428680B2 (en) 2013-03-14 2016-08-30 Dow Corning Corporation Conductive silicone materials and uses
CN105899714B (zh) 2013-12-05 2018-09-21 霍尼韦尔国际公司 具有经调节的pH的甲基磺酸亚锡溶液
KR20160122172A (ko) 2014-02-13 2016-10-21 허니웰 인터내셔날 인코포레이티드 압축성 열전도 재료
US9615486B2 (en) 2014-03-26 2017-04-04 General Electric Company Thermal interface devices
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
DE102015103118A1 (de) * 2014-10-06 2016-04-07 Siltectra Gmbh Splitting-Verfahren und Verwendung eines Materials in einem Splitting-Verfahren
EP3227399B1 (de) 2014-12-05 2021-07-14 Honeywell International Inc. Hochleistungsfähige thermische zwischenmaterialien mit niedrigem wärmewiderstand
CN104726076B (zh) * 2015-01-29 2017-09-22 海门市瑞泰纺织科技有限公司 一种燃烧炉内胆用导热材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
EP3426746B1 (de) * 2016-03-08 2021-07-14 Honeywell International Inc. Phasenwechselmaterial
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
WO2020100102A2 (en) * 2018-11-16 2020-05-22 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR102873148B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물
EP4232507A1 (de) * 2020-10-22 2023-08-30 3M Innovative Properties Company Härtbare zusammensetzungen, artikel daraus und verfahren zur herstellung und verwendung davon
CN116568754A (zh) * 2020-12-24 2023-08-08 陶氏环球技术有限责任公司 热界面材料
WO2022235279A1 (en) * 2021-05-06 2022-11-10 Uniseal, Inc. Two-part curable composition
CN115572439B (zh) * 2022-10-08 2023-07-14 长沙理工大学 一种铝基柔性热界面材料及其制备方法和应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737548B2 (ja) * 1985-10-03 1995-04-26 昭和電工株式会社 放熱シ−ト
US5891951A (en) * 1987-09-14 1999-04-06 Idemitsu Kosan Co., Ltd. Styrene-based resin composition
US5094769A (en) 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
JPH0216135A (ja) * 1988-07-05 1990-01-19 Tokuyama Soda Co Ltd ゴム組成物
FR2635110B1 (fr) * 1988-08-05 1990-11-09 Saim Adhesifs Insonorisants Mo Adhesif pregelifiable
EP0476224A1 (de) 1990-08-21 1992-03-25 Ricon Resins, Inc. Gummi-Klebemischung
US5859105A (en) * 1997-02-11 1999-01-12 Johnson Matthey, Inc. Organosilicon-containing compositions capable of rapid curing at low temperature
JPH09283955A (ja) * 1996-04-10 1997-10-31 Matsushita Electric Works Ltd 放熱シート
JP3780603B2 (ja) * 1997-02-27 2006-05-31 日立化成工業株式会社 放熱シート及び放熱板
JP3290127B2 (ja) * 1998-01-27 2002-06-10 松下電工株式会社 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート
US5989459A (en) * 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials

Also Published As

Publication number Publication date
KR20020075360A (ko) 2002-10-04
DE60027452D1 (de) 2006-05-24
CN1402875A (zh) 2003-03-12
EP1224669B1 (de) 2006-04-19
EP1224669A4 (de) 2003-05-02
WO2001020618A1 (en) 2001-03-22
KR100723101B1 (ko) 2007-06-04
CN1940007A (zh) 2007-04-04
JP2003509574A (ja) 2003-03-11
US6238596B1 (en) 2001-05-29
CN1280836C (zh) 2006-10-18
EP1224669A1 (de) 2002-07-24
AU7585600A (en) 2001-04-17
DE60027452T2 (de) 2006-10-12

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