ATE324222T1 - Bleifreie zink enthaltende weichlotpaste - Google Patents

Bleifreie zink enthaltende weichlotpaste

Info

Publication number
ATE324222T1
ATE324222T1 AT01400249T AT01400249T ATE324222T1 AT E324222 T1 ATE324222 T1 AT E324222T1 AT 01400249 T AT01400249 T AT 01400249T AT 01400249 T AT01400249 T AT 01400249T AT E324222 T1 ATE324222 T1 AT E324222T1
Authority
AT
Austria
Prior art keywords
solder paste
lead
soft solder
zinc containing
containing soft
Prior art date
Application number
AT01400249T
Other languages
English (en)
Inventor
Toshihiko Taguchi
Kunihito Takaura
Masahiko Hirata
Hisahiko Yoshida
Takashi Nagashima
Original Assignee
Senju Metal Industry Co
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co, Matsushita Electric Industrial Co Ltd filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of ATE324222T1 publication Critical patent/ATE324222T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT01400249T 2000-02-04 2001-02-01 Bleifreie zink enthaltende weichlotpaste ATE324222T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000028034 2000-02-04

Publications (1)

Publication Number Publication Date
ATE324222T1 true ATE324222T1 (de) 2006-05-15

Family

ID=18553513

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01400249T ATE324222T1 (de) 2000-02-04 2001-02-01 Bleifreie zink enthaltende weichlotpaste

Country Status (6)

Country Link
US (1) US6440228B1 (de)
EP (1) EP1142666B1 (de)
CN (1) CN1162249C (de)
AT (1) ATE324222T1 (de)
DE (1) DE60119017T2 (de)
MY (1) MY128285A (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002224880A (ja) * 2000-11-28 2002-08-13 Fujitsu Ltd はんだペースト、および電子装置
US7473487B2 (en) * 2001-06-05 2009-01-06 Panasonic Corporation Temperature fuse, and battery using the same
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3788335B2 (ja) * 2001-12-07 2006-06-21 千住金属工業株式会社 ソルダペースト
CN1445049A (zh) * 2002-03-19 2003-10-01 日本胜利株式会社 焊锡膏、焊接成品及焊接方法
US6887319B2 (en) * 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
JP4337326B2 (ja) 2002-10-31 2009-09-30 千住金属工業株式会社 鉛フリーはんだおよびはんだ付け物品
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
EP2017031B1 (de) * 2006-04-26 2017-09-13 Senju Metal Industry Co., Ltd Lötpaste
US7767032B2 (en) 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
US8564140B2 (en) * 2008-09-26 2013-10-22 Alpha Metals, Inc. Mono-acid hybrid conductive composition and method
CN103084756B (zh) * 2013-02-04 2015-04-15 江苏科技大学 一种用于镀锌钢板的点涂式无卤锡膏及其制备方法
CN104384747B (zh) * 2014-10-08 2017-10-13 深圳市唯特偶新材料股份有限公司 一种免冷藏焊锡膏及其制备方法
CN105081600B (zh) * 2015-07-24 2017-07-07 深圳市福英达工业技术有限公司 封装倒置led芯片用的锡基钎焊焊料及其制备方法
TWI646203B (zh) * 2016-07-15 2019-01-01 日商Ｊｘ金屬股份有限公司 Solder alloy
CN119457561A (zh) * 2024-10-25 2025-02-18 东南大学 一种无铅焊膏及其焊接方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE581360A (de) 1958-08-05
US3655461A (en) 1970-09-02 1972-04-11 Sanyo Electric Works Flux for aluminum soldering
CA2221961C (en) 1995-05-24 2008-02-05 Fry's Metals Inc. Epoxy-based, voc-free soldering flux
US6159304A (en) * 1997-07-03 2000-12-12 Matsushita Electric Industrial Co., Ltd. Solder paste

Also Published As

Publication number Publication date
EP1142666B1 (de) 2006-04-26
CN1162249C (zh) 2004-08-18
DE60119017T2 (de) 2006-11-30
US6440228B1 (en) 2002-08-27
EP1142666A1 (de) 2001-10-10
CN1316312A (zh) 2001-10-10
DE60119017D1 (de) 2006-06-01
MY128285A (en) 2007-01-31
US20020050305A1 (en) 2002-05-02

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties