ATE326064T1 - Integriertes halbleiterscheibenprozesssystems - Google Patents

Integriertes halbleiterscheibenprozesssystems

Info

Publication number
ATE326064T1
ATE326064T1 AT96909902T AT96909902T ATE326064T1 AT E326064 T1 ATE326064 T1 AT E326064T1 AT 96909902 T AT96909902 T AT 96909902T AT 96909902 T AT96909902 T AT 96909902T AT E326064 T1 ATE326064 T1 AT E326064T1
Authority
AT
Austria
Prior art keywords
process system
integrated semiconductor
semiconductor disc
disc process
strip
Prior art date
Application number
AT96909902T
Other languages
English (en)
Inventor
Stephen Paul Deornellas
Original Assignee
Tegal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tegal Corp filed Critical Tegal Corp
Application granted granted Critical
Publication of ATE326064T1 publication Critical patent/ATE326064T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Thin Film Transistor (AREA)
AT96909902T 1995-05-10 1996-03-28 Integriertes halbleiterscheibenprozesssystems ATE326064T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/438,261 US5672239A (en) 1995-05-10 1995-05-10 Integrated semiconductor wafer processing system

Publications (1)

Publication Number Publication Date
ATE326064T1 true ATE326064T1 (de) 2006-06-15

Family

ID=23739925

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96909902T ATE326064T1 (de) 1995-05-10 1996-03-28 Integriertes halbleiterscheibenprozesssystems

Country Status (9)

Country Link
US (1) US5672239A (de)
EP (2) EP0826231B1 (de)
JP (1) JP3686678B2 (de)
KR (1) KR100441637B1 (de)
CN (1) CN1082243C (de)
AT (1) ATE326064T1 (de)
CA (1) CA2220046A1 (de)
DE (1) DE69636117D1 (de)
WO (1) WO1996036069A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6672819B1 (en) 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
KR100218269B1 (ko) * 1996-05-30 1999-09-01 윤종용 건식 에칭기의 잔류 가스 제거 장치 및 방법
US6849153B2 (en) * 1998-04-16 2005-02-01 Siemens Aktiengesellschaft Removal of post-rie polymer on A1/CU metal line
US6348159B1 (en) 1999-02-15 2002-02-19 First Solar, Llc Method and apparatus for etching coated substrates
US6432832B1 (en) * 1999-06-30 2002-08-13 Lam Research Corporation Method of improving the profile angle between narrow and wide features
JP3348700B2 (ja) * 1999-08-19 2002-11-20 株式会社東京精密 エッチング装置
US6451158B1 (en) * 1999-12-21 2002-09-17 Lam Research Corporation Apparatus for detecting the endpoint of a photoresist stripping process
KR100675316B1 (ko) * 1999-12-22 2007-01-26 엘지.필립스 엘시디 주식회사 세정장비 일체형 에치/스트립 장치
US20010043989A1 (en) * 2000-05-18 2001-11-22 Masami Akimoto Film forming apparatus and film forming method
KR100793724B1 (ko) * 2001-05-04 2008-01-10 삼성전자주식회사 액정표시장치용 식각모듈
WO2003021642A2 (en) * 2001-08-31 2003-03-13 Applied Materials, Inc. Method and apparatus for processing a wafer
US20030045098A1 (en) * 2001-08-31 2003-03-06 Applied Materials, Inc. Method and apparatus for processing a wafer
US6676493B1 (en) 2001-12-26 2004-01-13 Lam Research Corporation Integrated planarization and clean wafer processing system
JP4195227B2 (ja) * 2002-02-22 2008-12-10 東京エレクトロン株式会社 被処理体の導入ポート構造
US6921555B2 (en) 2002-08-06 2005-07-26 Tegal Corporation Method and system for sequential processing in a two-compartment chamber
US7153542B2 (en) * 2002-08-06 2006-12-26 Tegal Corporation Assembly line processing method
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
KR100505693B1 (ko) * 2003-06-26 2005-08-03 삼성전자주식회사 미세 전자 소자 기판으로부터 포토레지스트 또는 유기물을세정하는 방법
KR100770792B1 (ko) * 2006-07-31 2007-10-26 세메스 주식회사 에칭부와 세정부를 겸비한 건식 에쳐
CN102044407B (zh) * 2009-10-20 2012-04-18 中芯国际集成电路制造(上海)有限公司 芯片的清洗方法
KR101369511B1 (ko) * 2012-01-11 2014-03-06 이완기 기판처리장치 및 방법
US9373533B2 (en) * 2012-12-31 2016-06-21 Cascade Microtech, Inc. Systems and methods for providing wafer access in a wafer processing system
KR101919122B1 (ko) * 2014-08-12 2018-11-15 주식회사 제우스 공정 분리형 기판 처리장치 및 처리방법
US12337467B2 (en) 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186326A (ja) * 1983-04-06 1984-10-23 Hitachi Ltd プラズマ処理装置
US4693777A (en) * 1984-11-30 1987-09-15 Kabushiki Kaisha Toshiba Apparatus for producing semiconductor devices
EP0272141B1 (de) * 1986-12-19 1994-03-02 Applied Materials, Inc. Integriertes Bearbeitungssystem mit Vielfachkammer
JPS63303060A (ja) * 1987-05-30 1988-12-09 Tokuda Seisakusho Ltd 真空処理装置
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
US5171393A (en) * 1991-07-29 1992-12-15 Moffat William A Wafer processing apparatus
US5376212A (en) * 1992-02-18 1994-12-27 Tokyo Electron Yamanashi Limited Reduced-pressure processing apparatus

Also Published As

Publication number Publication date
US5672239A (en) 1997-09-30
EP0826231A1 (de) 1998-03-04
CN1082243C (zh) 2002-04-03
KR100441637B1 (ko) 2004-11-06
DE69636117D1 (de) 2006-06-14
EP0826231B1 (de) 2006-05-10
WO1996036069A1 (en) 1996-11-14
CA2220046A1 (en) 1996-11-14
JPH11505669A (ja) 1999-05-21
EP1686615A1 (de) 2006-08-02
JP3686678B2 (ja) 2005-08-24
KR19990008372A (ko) 1999-01-25
EP0826231A4 (de) 2004-05-19
CN1184556A (zh) 1998-06-10

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