ATE331055T1 - Komposit-plattierungsverfahren - Google Patents

Komposit-plattierungsverfahren

Info

Publication number
ATE331055T1
ATE331055T1 AT01908353T AT01908353T ATE331055T1 AT E331055 T1 ATE331055 T1 AT E331055T1 AT 01908353 T AT01908353 T AT 01908353T AT 01908353 T AT01908353 T AT 01908353T AT E331055 T1 ATE331055 T1 AT E331055T1
Authority
AT
Austria
Prior art keywords
fine particles
composite plating
plating process
present
metal
Prior art date
Application number
AT01908353T
Other languages
English (en)
Inventor
Tetsuo Saji
Kumar Nabeen Shrestha
Original Assignee
Japan Science & Tech Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science & Tech Agency filed Critical Japan Science & Tech Agency
Application granted granted Critical
Publication of ATE331055T1 publication Critical patent/ATE331055T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/10—Electrophoretic coating characterised by the process characterised by the additives used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Glass Compositions (AREA)
AT01908353T 2000-03-06 2001-03-06 Komposit-plattierungsverfahren ATE331055T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000061264A JP3945956B2 (ja) 2000-03-06 2000-03-06 複合めっき方法

Publications (1)

Publication Number Publication Date
ATE331055T1 true ATE331055T1 (de) 2006-07-15

Family

ID=18581425

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01908353T ATE331055T1 (de) 2000-03-06 2001-03-06 Komposit-plattierungsverfahren

Country Status (9)

Country Link
US (1) US6635166B2 (de)
EP (1) EP1201792B1 (de)
JP (1) JP3945956B2 (de)
KR (1) KR100503574B1 (de)
CN (1) CN1260400C (de)
AT (1) ATE331055T1 (de)
DE (1) DE60120874T2 (de)
TW (1) TWI228547B (de)
WO (1) WO2001066831A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4862192B2 (ja) * 2005-09-29 2012-01-25 Ｄｏｗａメタルテック株式会社 複合めっき材の製造方法
TWI400363B (zh) * 2007-08-28 2013-07-01 羅門哈斯電子材料有限公司 電化學沈積之銦複合材料
US8226807B2 (en) 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
PL2242873T3 (pl) * 2007-12-11 2019-02-28 Macdermid Enthone Inc. Elektroosadzanie opartych na metalu kompozytowych powłok zawierających nanocząstki
CN102753735B (zh) * 2010-02-04 2015-04-22 日本精机宝石工业株式会社 散热性材料
EP2634293B1 (de) 2012-03-02 2018-07-18 Rohm and Haas Electronic Materials, L.L.C. Verbundstoffe aus russschwarz und metall
JP5907302B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
JP5907301B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
CN105350056B (zh) * 2015-11-24 2017-12-01 安徽天思朴超精密模具股份有限公司 耐磨损电镀液材料组合物和耐磨损电镀液的制备方法及应用
CN106399990B (zh) * 2016-08-16 2019-09-20 深圳市诚达科技股份有限公司 一种基于不锈钢表面的抗结焦纳米材料及其制备方法
DE102018005348B4 (de) * 2018-07-05 2025-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG Kontaktoberflächen mit Dispersions-Silberschichten
CN110983393A (zh) * 2019-12-27 2020-04-10 广东电网有限责任公司电力科学研究院 一种银-碳化铌复合镀层及其制备方法
CN113502518B (zh) * 2021-07-27 2022-05-06 临沂利信铝业有限公司 一种耐磨损铝合金复合材料
CN113584542B (zh) * 2021-07-27 2022-07-26 东莞普瑞得五金塑胶制品有限公司 一种在铝合金表面镀镍的方法
CN113584535B (zh) * 2021-07-27 2022-08-16 哈尔滨银光电镀有限公司 一种铝合金用镀镍液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855236B2 (ja) * 1975-07-17 1983-12-08 ソニー株式会社 酸性Ｎｉ電気メッキ浴
US3996114A (en) * 1975-12-17 1976-12-07 John L. Raymond Electroplating method
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
EP0005890B1 (de) * 1978-06-06 1981-11-25 Akzo N.V. Verfahren zum Absetzen von anorganische Partikel enthaltenden zusammengesetzten Schichten aus einem elektrolytischen Bad
DE3313871C1 (de) * 1983-04-16 1984-05-24 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Bad zur galvanischen Dispersionsabscheidung
JP2607681B2 (ja) 1989-05-19 1997-05-07 三菱重工業株式会社 複合メッキ方法
DE19654953A1 (de) * 1996-06-01 1998-03-26 Glyco Metall Werke Schichtwerkstoff für Gleitelemente

Also Published As

Publication number Publication date
EP1201792A4 (de) 2005-03-23
JP2001247998A (ja) 2001-09-14
CN1260400C (zh) 2006-06-21
CN1363000A (zh) 2002-08-07
US20020157957A1 (en) 2002-10-31
DE60120874D1 (de) 2006-08-03
EP1201792B1 (de) 2006-06-21
EP1201792A1 (de) 2002-05-02
US6635166B2 (en) 2003-10-21
DE60120874T2 (de) 2006-12-28
KR20020007399A (ko) 2002-01-26
KR100503574B1 (ko) 2005-07-29
JP3945956B2 (ja) 2007-07-18
WO2001066831A1 (fr) 2001-09-13
TWI228547B (en) 2005-03-01

Similar Documents

Publication Publication Date Title
DE60120874D1 (de) Komposit-plattierungsverfahren
ATE298314T1 (de) Wasserbehandlungsmethode
SE9903594L (sv) Katjoniska polymerer för slamavvattning
TW200635862A (en) Waste gas/waste water treatment equipment and method of treating waste gas/waste water
PL343999A1 (en) Method for treating waters, soils, sediments and/or sludges
ATE336639T1 (de) Tensidezusammensetzung zur bohrlochreinigung
EP1609888A3 (de) Verbundplattiertes Produkt und Verfahren zu dessen Herstellung
ATE366786T1 (de) Verwendung magnetischer, poröser anorganischer materialien als sorptionsmittel zur reinigung von wasser und der umwelt von ausgelaufenem öl
EP1598317A4 (de) Verfahren zur herstellung von gemischtem elektrolysiertem wasser
DE602004011520D1 (de) Wässrige, saure lösung und verfahren zur elektrolytischen abscheidung von kupferüberzügen sowie verwendung der lösung
ATE282098T1 (de) Kupfergewinnungsverfahren
TW200718654A (en) Method for processing waste water containing silicon powder
DE58900637D1 (de) Verwendung von substituierten thioharnstoffen zur abtrennung komplex gebundener schwermetallionen.
BRPI0416580A (pt) sistema e método de tratamento de água
ATE276322T1 (de) Kationische basische elektrotauchlackierungszusammensetzung und ihr herstellungsverfahren
DE60205258D1 (de) Vorbehandlung von kunststoffmaterialien
Prueller Water recirculation in vibratory finishing
ATE412616T1 (de) Bakterienstamm zur entfernung der gesamten gelösten feststoffe von gerbereiabwasser
TW200728213A (en) Wastewater treatment apparatus and method thereof
DE60030563D1 (de) "death-effector"-domäne des säugetier-apoptose-mediators, fadd, die bakteriellen zelltod auslöst
Shen Reuse of Electro-Plating Water
Zheng Study on DAF-ASBR Process Treating Wastewater of Synthetic Spice Production
BR9910450A (pt) Processo para tratamento de águas, lamas, sedimentos e/ou lodo
Zevnik et al. Electrochemical technologies for clean environment- trends and uses
Shen et al. Treatment of high density organic wastewater by using oxidation-adsorption.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties