ATE331055T1 - Komposit-plattierungsverfahren - Google Patents

Komposit-plattierungsverfahren

Info

Publication number
ATE331055T1
ATE331055T1 AT01908353T AT01908353T ATE331055T1 AT E331055 T1 ATE331055 T1 AT E331055T1 AT 01908353 T AT01908353 T AT 01908353T AT 01908353 T AT01908353 T AT 01908353T AT E331055 T1 ATE331055 T1 AT E331055T1
Authority
AT
Austria
Prior art keywords
fine particles
composite plating
plating process
present
metal
Prior art date
Application number
AT01908353T
Other languages
English (en)
Inventor
Tetsuo Saji
Kumar Nabeen Shrestha
Original Assignee
Japan Science & Tech Agency
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science & Tech Agency filed Critical Japan Science & Tech Agency
Application granted granted Critical
Publication of ATE331055T1 publication Critical patent/ATE331055T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/10—Electrophoretic coating characterised by the process characterised by the additives used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Glass Compositions (AREA)
AT01908353T 2000-03-06 2001-03-06 Komposit-plattierungsverfahren ATE331055T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000061264A JP3945956B2 (ja) 2000-03-06 2000-03-06 複合めっき方法

Publications (1)

Publication Number Publication Date
ATE331055T1 true ATE331055T1 (de) 2006-07-15

Family

ID=18581425

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01908353T ATE331055T1 (de) 2000-03-06 2001-03-06 Komposit-plattierungsverfahren

Country Status (9)

Country Link
US (1) US6635166B2 (de)
EP (1) EP1201792B1 (de)
JP (1) JP3945956B2 (de)
KR (1) KR100503574B1 (de)
CN (1) CN1260400C (de)
AT (1) ATE331055T1 (de)
DE (1) DE60120874T2 (de)
TW (1) TWI228547B (de)
WO (1) WO2001066831A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4862192B2 (ja) * 2005-09-29 2012-01-25 Ｄｏｗａメタルテック株式会社 複合めっき材の製造方法
EP2031098B1 (de) * 2007-08-28 2019-05-29 Rohm and Haas Electronic Materials LLC Zusammensetzung und entsprechendes verfahren zur galvanischen abscheidung von indiumverbundwerkstoffen
CN101946029B (zh) * 2007-12-11 2012-12-19 恩索恩公司 包含纳米颗粒的金属基复合涂层的电解沉积
US8226807B2 (en) * 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
CN102753735B (zh) * 2010-02-04 2015-04-22 日本精机宝石工业株式会社 散热性材料
TWI539034B (zh) 2012-03-02 2016-06-21 羅門哈斯電子材料有限公司 碳黑及金屬之複合物
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP5907302B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
CN105350056B (zh) * 2015-11-24 2017-12-01 安徽天思朴超精密模具股份有限公司 耐磨损电镀液材料组合物和耐磨损电镀液的制备方法及应用
CN106399990B (zh) * 2016-08-16 2019-09-20 深圳市诚达科技股份有限公司 一种基于不锈钢表面的抗结焦纳米材料及其制备方法
DE102018005348B4 (de) * 2018-07-05 2025-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG Kontaktoberflächen mit Dispersions-Silberschichten
CN110983393A (zh) * 2019-12-27 2020-04-10 广东电网有限责任公司电力科学研究院 一种银-碳化铌复合镀层及其制备方法
CN113584535B (zh) * 2021-07-27 2022-08-16 哈尔滨银光电镀有限公司 一种铝合金用镀镍液
CN113584542B (zh) * 2021-07-27 2022-07-26 东莞普瑞得五金塑胶制品有限公司 一种在铝合金表面镀镍的方法
CN113502518B (zh) * 2021-07-27 2022-05-06 临沂利信铝业有限公司 一种耐磨损铝合金复合材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855236B2 (ja) * 1975-07-17 1983-12-08 ソニー株式会社 酸性Ｎｉ電気メッキ浴
US3996114A (en) * 1975-12-17 1976-12-07 John L. Raymond Electroplating method
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
EP0005890B1 (de) * 1978-06-06 1981-11-25 Akzo N.V. Verfahren zum Absetzen von anorganische Partikel enthaltenden zusammengesetzten Schichten aus einem elektrolytischen Bad
DE3313871C1 (de) * 1983-04-16 1984-05-24 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Bad zur galvanischen Dispersionsabscheidung
JP2607681B2 (ja) 1989-05-19 1997-05-07 三菱重工業株式会社 複合メッキ方法
DE19654953A1 (de) * 1996-06-01 1998-03-26 Glyco Metall Werke Schichtwerkstoff für Gleitelemente

Also Published As

Publication number Publication date
CN1260400C (zh) 2006-06-21
WO2001066831A1 (fr) 2001-09-13
EP1201792B1 (de) 2006-06-21
US6635166B2 (en) 2003-10-21
EP1201792A1 (de) 2002-05-02
CN1363000A (zh) 2002-08-07
EP1201792A4 (de) 2005-03-23
DE60120874D1 (de) 2006-08-03
TWI228547B (en) 2005-03-01
DE60120874T2 (de) 2006-12-28
US20020157957A1 (en) 2002-10-31
KR100503574B1 (ko) 2005-07-29
KR20020007399A (ko) 2002-01-26
JP2001247998A (ja) 2001-09-14
JP3945956B2 (ja) 2007-07-18

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