ATE335581T1 - Trennfolienverwendung - Google Patents

Trennfolienverwendung

Info

Publication number
ATE335581T1
ATE335581T1 AT03011077T AT03011077T ATE335581T1 AT E335581 T1 ATE335581 T1 AT E335581T1 AT 03011077 T AT03011077 T AT 03011077T AT 03011077 T AT03011077 T AT 03011077T AT E335581 T1 ATE335581 T1 AT E335581T1
Authority
AT
Austria
Prior art keywords
layer
fluororesin
melting point
release foil
foil use
Prior art date
Application number
AT03011077T
Other languages
English (en)
Inventor
Satoshi Yamamoto
Seitoku Kaya
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of ATE335581T1 publication Critical patent/ATE335581T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
AT03011077T 2002-05-23 2003-05-20 Trennfolienverwendung ATE335581T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002148760A JP3791458B2 (ja) 2002-05-23 2002-05-23 離型フィルム

Publications (1)

Publication Number Publication Date
ATE335581T1 true ATE335581T1 (de) 2006-09-15

Family

ID=29397902

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03011077T ATE335581T1 (de) 2002-05-23 2003-05-20 Trennfolienverwendung

Country Status (8)

Country Link
US (2) US20030219604A1 (de)
EP (1) EP1364762B1 (de)
JP (1) JP3791458B2 (de)
KR (1) KR100930848B1 (de)
CN (1) CN1274491C (de)
AT (1) ATE335581T1 (de)
DE (1) DE60307360T2 (de)
TW (1) TWI305751B (de)

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CN101531080A (zh) * 2004-05-27 2009-09-16 三菱树脂株式会社 脱模用层压膜
JPWO2005115751A1 (ja) * 2004-05-27 2008-03-27 三菱樹脂株式会社 離型用積層フィルム
EP1612021B1 (de) 2004-06-29 2009-09-02 Asahi Glass Company Ltd. Trennfolie für die Einkapselung von Halbleiterchips
JP2007035880A (ja) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd バンプ付きウエハの製造方法、バンプ付きウエハ、半導体装置
JP4541260B2 (ja) * 2005-08-31 2010-09-08 東京特種紙業株式会社 回路板の製造方法
US8249015B2 (en) * 2005-11-10 2012-08-21 Interdigital Technology Corporation Method and system for media independent handover using operation, administration and maintenance protocol
KR20090018032A (ko) * 2006-04-25 2009-02-19 아사히 가라스 가부시키가이샤 반도체 수지 몰드용 이형 필름
JP5123638B2 (ja) * 2006-12-05 2013-01-23 日東電工株式会社 感圧性接着シート
US8475844B2 (en) * 2008-04-16 2013-07-02 Boston Scientific Scimed, Inc. Fluoropolymer-based medical implant coating compositions
US20120180940A1 (en) * 2008-05-14 2012-07-19 Yves Bader Method to produce stab and ballistic resistant composite structures
CN102791480B (zh) * 2010-03-12 2015-06-17 积水化学工业株式会社 脱模膜和脱模膜的制造方法
KR20140106691A (ko) * 2011-12-22 2014-09-03 다이킨 고교 가부시키가이샤 이형 필름
TWI549240B (zh) * 2013-08-27 2016-09-11 碩正科技股份有限公司 應用於晶圓封裝之離形元件
US20150064294A1 (en) * 2013-08-27 2015-03-05 Suregiant Technology Co., Ltd Release Device Applied in Electronic Package
CN104004461B (zh) * 2014-06-12 2015-07-15 番禺南沙殷田化工有限公司 一种aba结构粘合片及其制备方法
WO2017179542A1 (ja) * 2016-04-11 2017-10-19 旭硝子株式会社 積層体、プリント基板、および積層体の製造方法
JP6627666B2 (ja) * 2016-07-07 2020-01-08 株式会社オートネットワーク技術研究所 回路基板及び電気接続箱
WO2018181403A1 (ja) * 2017-03-30 2018-10-04 日東電工株式会社 耐熱離型シートとその製造方法
CN110116539A (zh) * 2018-02-05 2019-08-13 深圳市一心电子有限公司 多层复合结构的离型膜及其制造方法
JP7187906B2 (ja) * 2018-09-10 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法
US11993688B2 (en) 2019-03-28 2024-05-28 Toray Industries, Inc. Molded article of carbon fiber composite material and production method for molded article of carbon fiber composite material
JP7246994B2 (ja) * 2019-03-28 2023-03-28 三井化学東セロ株式会社 プリント配線基板製造プロセス用離型フィルム、及びその用途
JP7246998B2 (ja) * 2019-03-29 2023-03-28 三井化学東セロ株式会社 プリント基板の製造方法、プリント基板製造装置、及びプリント基板
WO2020196497A1 (ja) * 2019-03-28 2020-10-01 三井化学東セロ株式会社 プリント配線基板製造プロセス用離型フィルム、プリント基板の製造方法、プリント基板製造装置、及びプリント基板
JP6751974B1 (ja) * 2019-10-16 2020-09-09 株式会社コバヤシ 離型フィルム及び離型フィルムの製造方法
CN114555366B (zh) * 2019-10-18 2023-03-24 昭和电工株式会社 透明导电膜层合体及其加工方法
CN113263816A (zh) * 2021-05-22 2021-08-17 江苏双星彩塑新材料股份有限公司 一种抗冲击防爆聚酯离型膜及其制备方法
KR20230064291A (ko) * 2021-11-03 2023-05-10 삼성전자주식회사 이형 필름 및 이를 이용하는 반도체 패키지의 제조 방법

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Also Published As

Publication number Publication date
CN1274491C (zh) 2006-09-13
JP2003334903A (ja) 2003-11-25
EP1364762B1 (de) 2006-08-09
TW200403147A (en) 2004-03-01
EP1364762A1 (de) 2003-11-26
DE60307360D1 (de) 2006-09-21
CN1459405A (zh) 2003-12-03
KR20030091701A (ko) 2003-12-03
JP3791458B2 (ja) 2006-06-28
KR100930848B1 (ko) 2009-12-10
US20030219604A1 (en) 2003-11-27
DE60307360T2 (de) 2007-09-13
TWI305751B (en) 2009-02-01
US20050084684A1 (en) 2005-04-21

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