ATE336349T1 - Drahtsägevorrichtung - Google Patents

Drahtsägevorrichtung

Info

Publication number
ATE336349T1
ATE336349T1 AT03029548T AT03029548T ATE336349T1 AT E336349 T1 ATE336349 T1 AT E336349T1 AT 03029548 T AT03029548 T AT 03029548T AT 03029548 T AT03029548 T AT 03029548T AT E336349 T1 ATE336349 T1 AT E336349T1
Authority
AT
Austria
Prior art keywords
chips
wire saw
wire
saw apparatus
sawing
Prior art date
Application number
AT03029548T
Other languages
English (en)
Inventor
Andreas Muller
Alexander Bortnikov
Original Assignee
Hct Shaping Systems Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH00043/03A external-priority patent/CH696159A5/fr
Application filed by Hct Shaping Systems Sa filed Critical Hct Shaping Systems Sa
Application granted granted Critical
Publication of ATE336349T1 publication Critical patent/ATE336349T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y10T83/7533—With biasing or counterbalancing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/748—With work immobilizer
    • Y10T83/7487—Means to clamp work
    • Y10T83/754—Clamp driven by yieldable means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Surgical Instruments (AREA)
AT03029548T 2003-01-13 2003-12-22 Drahtsägevorrichtung ATE336349T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00043/03A CH696159A5 (fr) 2003-01-13 2003-01-13 Dispositif de sciage par fil.
CH01263/03A CH696807A5 (fr) 2003-01-13 2003-07-18 Dispositif de sciage par fil.

Publications (1)

Publication Number Publication Date
ATE336349T1 true ATE336349T1 (de) 2006-09-15

Family

ID=32509222

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03029548T ATE336349T1 (de) 2003-01-13 2003-12-22 Drahtsägevorrichtung

Country Status (7)

Country Link
US (1) US7114424B2 (de)
EP (1) EP1437209B1 (de)
JP (1) JP4510473B2 (de)
AT (1) ATE336349T1 (de)
CH (1) CH696807A5 (de)
DE (1) DE60307588T2 (de)
ES (1) ES2269905T3 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005028112A1 (de) 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung
DE102006050330B4 (de) * 2006-10-25 2009-10-22 Siltronic Ag Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben
US20100126488A1 (en) * 2008-11-25 2010-05-27 Abhaya Kumar Bakshi Method and apparatus for cutting wafers by wire sawing
CN102049818B (zh) * 2009-10-28 2013-09-11 上海日进机床有限公司 晶体硅锭的切割方法
US20110265621A1 (en) * 2010-04-29 2011-11-03 Schmidt Richard F Profile Loaf Cutting System for Food Products
DE102010031364A1 (de) * 2010-07-15 2012-01-19 Gebr. Schmid Gmbh & Co. Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung
JP5185419B2 (ja) * 2011-08-22 2013-04-17 コマツＮｔｃ株式会社 ワイヤソー
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
EP2711978A1 (de) 2012-09-24 2014-03-26 Meyer Burger AG Verfahren zur Herstellung von Wafern
EP2944444A1 (de) 2014-05-16 2015-11-18 Meyer Burger AG Waferverarbeitungsverfahren
KR101841551B1 (ko) * 2016-11-23 2018-03-23 에스케이실트론 주식회사 잉곳 가압 장치 및 이를 포함하는 잉곳 절단 장치
JP6926864B2 (ja) * 2017-09-12 2021-08-25 住友金属鉱山株式会社 単結晶の切断方法、固定冶具、及び、単結晶基板の製造方法
NL2021522B1 (en) * 2018-08-30 2020-04-24 Sdd Holding B V Cutting device and method for cutting paper
KR102097585B1 (ko) * 2018-11-19 2020-04-06 이충석 수직형 멀티 와이어 쏘우용 잉곳 로딩언로딩 장치
JP7302213B2 (ja) * 2019-03-19 2023-07-04 住友金属鉱山株式会社 単結晶の押さえ治具、ワイヤソー装置、及び、単結晶の切断方法
CN119928084B (zh) * 2025-04-03 2025-07-18 润鲁智科检验集团有限公司 一种砌块切割装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03281309A (ja) * 1990-03-30 1991-12-12 Osaka Titanium Co Ltd マルチワイヤソーによる加工方法
DE69526038T2 (de) * 1994-12-15 2002-10-31 Sharp K.K., Osaka Drahtgittersäge und Sägeverfahren
JP3427956B2 (ja) * 1995-04-14 2003-07-22 信越半導体株式会社 ワイヤーソー装置
JPH09272122A (ja) * 1996-04-05 1997-10-21 Sumitomo Metal Ind Ltd マルチワイヤソーによる切断方法
JPH11198017A (ja) * 1998-01-14 1999-07-27 Tokyo Seiko Co Ltd ワイヤ式切断加工装置におけるウエハの隙間維持装置および方法
US6119673A (en) * 1998-12-02 2000-09-19 Tokyo Seimitsu Co., Ltd. Wafer retrieval method in multiple slicing wire saw
JP3767382B2 (ja) * 2001-01-09 2006-04-19 株式会社デンソー ワイヤソーによる切断方法およびそれに用いる切断装置
US6832606B2 (en) * 2001-11-30 2004-12-21 Dowa Mining Co., Ltd. Wire saw and cutting method thereof

Also Published As

Publication number Publication date
JP4510473B2 (ja) 2010-07-21
DE60307588T2 (de) 2007-08-16
ES2269905T3 (es) 2007-04-01
CH696807A5 (fr) 2007-12-14
EP1437209A1 (de) 2004-07-14
JP2004216549A (ja) 2004-08-05
EP1437209B1 (de) 2006-08-16
US7114424B2 (en) 2006-10-03
DE60307588D1 (de) 2006-09-28
US20040159316A1 (en) 2004-08-19

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Legal Events

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