ATE338423T1 - Elektronische geräte und gehäusekonstruktion für solche geräte - Google Patents

Elektronische geräte und gehäusekonstruktion für solche geräte

Info

Publication number
ATE338423T1
ATE338423T1 AT02745352T AT02745352T ATE338423T1 AT E338423 T1 ATE338423 T1 AT E338423T1 AT 02745352 T AT02745352 T AT 02745352T AT 02745352 T AT02745352 T AT 02745352T AT E338423 T1 ATE338423 T1 AT E338423T1
Authority
AT
Austria
Prior art keywords
carrier
devices
cover
receptacle
recess
Prior art date
Application number
AT02745352T
Other languages
English (en)
Inventor
Eli Margalit
Original Assignee
Motorola Inc
Rotman Ariel
Mosseri Yakov
Motorola Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc, Rotman Ariel, Mosseri Yakov, Motorola Ltd filed Critical Motorola Inc
Application granted granted Critical
Publication of ATE338423T1 publication Critical patent/ATE338423T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the shock resistance of the housing, e.g. by increasing the rigidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
AT02745352T 2001-09-01 2002-06-03 Elektronische geräte und gehäusekonstruktion für solche geräte ATE338423T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0121242A GB2379333A (en) 2001-09-01 2001-09-01 Electronic device casing

Publications (1)

Publication Number Publication Date
ATE338423T1 true ATE338423T1 (de) 2006-09-15

Family

ID=9921388

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02745352T ATE338423T1 (de) 2001-09-01 2002-06-03 Elektronische geräte und gehäusekonstruktion für solche geräte

Country Status (7)

Country Link
US (1) US20040240189A1 (de)
EP (1) EP1425896B1 (de)
AT (1) ATE338423T1 (de)
CA (1) CA2467526A1 (de)
DE (1) DE60214402D1 (de)
GB (1) GB2379333A (de)
WO (1) WO2003021921A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100511304B1 (ko) * 2003-04-04 2005-08-31 엘지전자 주식회사 휴대용 단말기의 충격 흡수 장치
JP3989452B2 (ja) * 2004-02-23 2007-10-10 オリンパス株式会社 電子機器の放熱構造
JP2005310949A (ja) * 2004-04-20 2005-11-04 Olympus Corp 外装体接合部材およびそれを用いた接合構造
JP4406315B2 (ja) 2004-05-07 2010-01-27 オリンパス株式会社 電子機器の筐体構造
JP2010109530A (ja) * 2008-10-29 2010-05-13 Sony Corp 無線通信装置および無線通信方法
US9363905B2 (en) * 2010-02-02 2016-06-07 Apple Inc. Cosmetic co-removal of material for electronic device surfaces
DE202012104371U1 (de) * 2012-11-13 2014-02-14 Dewertokin Gmbh Gehäuse mit mindestens zwei Gehäuseteilen und einem Dichtelement
CN103780726B (zh) * 2014-01-10 2016-04-20 深圳市宝尔爱迪科技有限公司 三防结构及使用该三防结构的手机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4090632A (en) * 1977-01-17 1978-05-23 Ballantine Laboratories, Inc. Adjustable instrument case
GB2064879B (en) * 1979-11-27 1983-07-20 Brookes & Gatehouse Display and/or control unit
US4293135A (en) * 1980-02-25 1981-10-06 Parker-Hannifin Corporation Segmented seal
US4711361A (en) * 1986-05-01 1987-12-08 Motorola, Inc. Interlocking module housing
US4854476A (en) * 1988-07-25 1989-08-08 Serco Mold, Inc. Container and perimeter seal therefor
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
US5394306A (en) * 1993-09-07 1995-02-28 Norand Corporation Shock absorbent packaging apparatus
US6108163A (en) * 1994-10-12 2000-08-22 International Business Machines Corporation Sensitive sensor internally mounted shock for a disk drive
JPH11230263A (ja) * 1998-02-17 1999-08-27 Kenwood Corp 電子機器の部材保持構造
JP3739961B2 (ja) * 1999-03-30 2006-01-25 株式会社Ｐｆｕ 小型携帯端末装置

Also Published As

Publication number Publication date
WO2003021921A1 (en) 2003-03-13
US20040240189A1 (en) 2004-12-02
DE60214402D1 (de) 2006-10-12
EP1425896A1 (de) 2004-06-09
GB2379333A (en) 2003-03-05
EP1425896B1 (de) 2006-08-30
CA2467526A1 (en) 2003-03-13
GB0121242D0 (en) 2001-10-24

Similar Documents

Publication Publication Date Title
SE9702923D0 (sv) Power transistor module packaging structure
WO2001073868A3 (en) Device enclosures and devices with integrated battery
CA2391548A1 (en) Multifunction utility pole
DE69909252D1 (de) Bestückungsvorrichtung für elektronische bauteile
SG80657A1 (en) Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument
DE50214578D1 (de) Gehäuse für einen elektronischen schlüssel
TW200631159A (en) Magnetic shielding for magneticaly sensitive semiconductor devices
TW200707824A (en) Portable electronic device capable of pushing up a battery cover while moving a latch
TR199900448A2 (xx) Fiksaj tertibatlar� i�in nemlendirici baz tabaka.
TW200601947A (en) Electronic apparatus and shielding structure for heat dissipation openings
BR0201008A (pt) Dispositivo eletromecânico para montagem de um módulo eletrônico em um suporte de módulos, especialmente para montagem de um instrumento de indicação embutido em um painel de instrumentos
DE59700682D1 (de) Abschirmgehäuse für elektronische Bauelemente
TW592386U (en) Mounting structure of semiconductor chip and semiconductor device
DE60114688D1 (de) Abschirmgehäuse für eine elektronische Einrichtung
ATE338423T1 (de) Elektronische geräte und gehäusekonstruktion für solche geräte
ATE393423T1 (de) Schaltungs-sicherheit
ATE352080T1 (de) Gegen ausspähung geschützter datenträger
WO2005074652A3 (en) Insert molding electronic devices
WO2004064152A3 (de) Modular aufgebautes bauelement mit verkapselung
DE60101505D1 (de) Trägerband für elektronische Bauteile
TW200625561A (en) Semiconductor device
ATE357743T1 (de) Elektronisches bauelement und verwendung einer darin enthaltenen schutzstruktur
DE60040116D1 (de) Luftgekühltes Gehäuse für elektronische Geräte
DE60005742D1 (de) Gehäuse für eine elektronische Einrichtung
DE602005025746D1 (de) Integrierte schaltung, verfahren zur herstellung der integrierten schaltung und mobiltelefon mit der integrierten schaltung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties