ATE339773T1 - Waferhandhabungsvorrichtung und verfahren dafür - Google Patents

Waferhandhabungsvorrichtung und verfahren dafür

Info

Publication number
ATE339773T1
ATE339773T1 AT02791341T AT02791341T ATE339773T1 AT E339773 T1 ATE339773 T1 AT E339773T1 AT 02791341 T AT02791341 T AT 02791341T AT 02791341 T AT02791341 T AT 02791341T AT E339773 T1 ATE339773 T1 AT E339773T1
Authority
AT
Austria
Prior art keywords
wafer
load locks
vacuum chamber
handling apparatus
process station
Prior art date
Application number
AT02791341T
Other languages
English (en)
Inventor
Manny Sieradzki
Nicholas R White
Original Assignee
Diamond Semiconductor Group Ll
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamond Semiconductor Group Ll filed Critical Diamond Semiconductor Group Ll
Application granted granted Critical
Publication of ATE339773T1 publication Critical patent/ATE339773T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT02791341T 2001-11-29 2002-11-27 Waferhandhabungsvorrichtung und verfahren dafür ATE339773T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33425101P 2001-11-29 2001-11-29

Publications (1)

Publication Number Publication Date
ATE339773T1 true ATE339773T1 (de) 2006-10-15

Family

ID=23306329

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02791341T ATE339773T1 (de) 2001-11-29 2002-11-27 Waferhandhabungsvorrichtung und verfahren dafür

Country Status (7)

Country Link
US (1) US7059817B2 (de)
EP (1) EP1454340B1 (de)
JP (1) JP4327599B2 (de)
AT (1) ATE339773T1 (de)
AU (1) AU2002365591A1 (de)
DE (1) DE60214763T2 (de)
WO (1) WO2003046958A2 (de)

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JP3674864B2 (ja) * 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
US7112808B2 (en) * 2004-02-25 2006-09-26 Axcelis Technologies, Inc. Wafer 2D scan mechanism
DE602005021628D1 (de) * 2004-04-05 2010-07-15 Axcelis Tech Inc Inen ionenstrahl
CN1943011A (zh) * 2004-04-09 2007-04-04 艾克塞利斯技术公司 利用弹簧和平衡重的具有往复旋转运动的晶片扫描系统
US7119343B2 (en) * 2004-05-06 2006-10-10 Axcelis Technologies, Inc. Mechanical oscillator for wafer scan with spot beam
US7477956B2 (en) * 2004-07-12 2009-01-13 Applied Materials, Inc. Methods and apparatus for enhancing electronic device manufacturing throughput
US20060097196A1 (en) * 2004-11-08 2006-05-11 Axcelis Technologies Inc. Dose uniformity during scanned ion implantation
JP4907077B2 (ja) 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
KR100621775B1 (ko) * 2005-04-15 2006-09-15 삼성전자주식회사 기판 세정장치
US7694583B2 (en) * 2005-05-05 2010-04-13 Control Gaging, Inc. Gripper gage assembly
JP4767641B2 (ja) * 2005-09-27 2011-09-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
JP4098338B2 (ja) * 2006-07-20 2008-06-11 川崎重工業株式会社 ウェハ移載装置および基板移載装置
US8153513B2 (en) * 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US20080075563A1 (en) * 2006-09-27 2008-03-27 Mclane James R Substrate handling system and method
US20080138178A1 (en) * 2006-12-06 2008-06-12 Axcelis Technologies,Inc. High throughput serial wafer handling end station
US7949425B2 (en) * 2006-12-06 2011-05-24 Axcelis Technologies, Inc. High throughput wafer notch aligner
US8500382B2 (en) * 2007-05-22 2013-08-06 Axcelis Technologies Inc. Airflow management for particle abatement in semiconductor manufacturing equipment
US7772571B2 (en) * 2007-10-08 2010-08-10 Advanced Ion Beam Technology, Inc. Implant beam utilization in an ion implanter
US7987014B2 (en) * 2008-05-15 2011-07-26 Texas Instruments Incorporated Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
JP6208419B2 (ja) * 2012-09-19 2017-10-04 株式会社ダイヘン 算出装置、搬送ロボットシステム、及び算出方法
US9663854B2 (en) * 2013-03-14 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. High-throughput system and method for post-implantation single wafer warm-up
US10157763B2 (en) * 2013-08-29 2018-12-18 Varian Semiconductor Equipment Associates, Inc. High throughput substrate handling endstation and sequence
US9378992B2 (en) 2014-06-27 2016-06-28 Axcelis Technologies, Inc. High throughput heated ion implantation system and method
US9607803B2 (en) 2015-08-04 2017-03-28 Axcelis Technologies, Inc. High throughput cooled ion implantation system and method
US10790177B2 (en) * 2017-11-14 2020-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Systems, devices, and methods for using a real time environment sensor in a FOUP
CN109244186B (zh) * 2018-09-19 2024-02-27 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法
US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
US20250022739A1 (en) * 2023-07-11 2025-01-16 Tokyo Electron Limited Process system, method, and substrate chuck
CN118559954A (zh) * 2024-06-07 2024-08-30 赛胜(常熟)声学科技有限公司 一种发泡材料成型用自动生产方法

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GB2349269A (en) * 1999-04-19 2000-10-25 Applied Materials Inc Ion implanter
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US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
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Also Published As

Publication number Publication date
JP2005510870A (ja) 2005-04-21
US20030123958A1 (en) 2003-07-03
AU2002365591A1 (en) 2003-06-10
EP1454340A2 (de) 2004-09-08
WO2003046958A2 (en) 2003-06-05
JP4327599B2 (ja) 2009-09-09
DE60214763D1 (de) 2006-10-26
EP1454340B1 (de) 2006-09-13
US7059817B2 (en) 2006-06-13
DE60214763T2 (de) 2007-09-06
WO2003046958A3 (en) 2003-12-31

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