ATE340219T1 - Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss - Google Patents

Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss

Info

Publication number
ATE340219T1
ATE340219T1 AT03781663T AT03781663T ATE340219T1 AT E340219 T1 ATE340219 T1 AT E340219T1 AT 03781663 T AT03781663 T AT 03781663T AT 03781663 T AT03781663 T AT 03781663T AT E340219 T1 ATE340219 T1 AT E340219T1
Authority
AT
Austria
Prior art keywords
composition
reinforced epoxy
polyanhydride
flow
flow underfilling
Prior art date
Application number
AT03781663T
Other languages
English (en)
Inventor
Jayesh P Shah
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of ATE340219T1 publication Critical patent/ATE340219T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
AT03781663T 2002-11-06 2003-10-31 Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss ATE340219T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/289,504 US7056978B2 (en) 2002-11-06 2002-11-06 Toughened epoxy-anhydride no-flow underfill encapsulant

Publications (1)

Publication Number Publication Date
ATE340219T1 true ATE340219T1 (de) 2006-10-15

Family

ID=32176082

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03781663T ATE340219T1 (de) 2002-11-06 2003-10-31 Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss

Country Status (10)

Country Link
US (1) US7056978B2 (de)
EP (1) EP1558678B1 (de)
JP (1) JP2006505675A (de)
KR (1) KR20050084677A (de)
CN (1) CN1732225A (de)
AT (1) ATE340219T1 (de)
AU (1) AU2003287428A1 (de)
DE (1) DE60308545T2 (de)
DK (1) DK1558678T3 (de)
WO (1) WO2004044053A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
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US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7209324B2 (en) * 2003-06-30 2007-04-24 Hitachi Global Storage Netherlands, B.V. Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers
US7064929B2 (en) * 2003-06-30 2006-06-20 Hitachi Global Storage Netherlands B.V. Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers
EP1649322A4 (de) 2003-07-17 2007-09-19 Honeywell Int Inc Planarisierungsfilme für fortschrittliche mikroelektronsiche anwendungen und einrichtungen und herstellungsverfahren dafür
WO2005108487A1 (en) * 2004-04-22 2005-11-17 Henkel Corporation Methods for improving the flux compatibility of underfill formulations
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
JP5027509B2 (ja) * 2004-08-18 2012-09-19 株式会社カネカ 半導体封止剤用エポキシ樹脂組成物およびエポキシ樹脂成形材料
KR101004242B1 (ko) 2006-04-28 2010-12-24 쇼와 덴코 가부시키가이샤 열경화성 수지 조성물 및 그의 용도
JP5544162B2 (ja) * 2007-02-28 2014-07-09 株式会社カネカ ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法
CN101143933B (zh) * 2007-09-27 2010-09-29 成都多沐汽车工程有限公司 实心环氧塑料板材及生产方法
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
WO2010005710A1 (en) * 2008-06-16 2010-01-14 3M Innovative Properties Company Toughened curable compositions
EP2223966B1 (de) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy-Haftmittelzusammensetzungen mit hoher mechanischer Festigkeit über einen breiten Temperaturbereich
KR101117757B1 (ko) * 2009-02-26 2012-03-15 도레이첨단소재 주식회사 비유동성 언더필용 수지조성물 및 이를 이용한 비유동성 언더필 필름
BR112012023949A2 (pt) * 2010-03-24 2017-08-08 Dow Global Technologies Llc composição de resina epóxi curável
CN101864147B (zh) * 2010-06-28 2012-12-26 深圳市库泰克电子材料技术有限公司 一种低粘度、低线膨胀系数的底部填充胶
JP2012162585A (ja) * 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
CN102516963B (zh) * 2011-10-17 2013-07-31 中国石油天然气股份有限公司 用于油水井套管修复的化学复合树脂封固剂
CN102559115B (zh) * 2011-12-22 2013-11-27 烟台德邦科技有限公司 一种芯片级底部填充胶及其制备方法
CN103183925B (zh) * 2011-12-27 2017-09-08 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
CN104736593A (zh) * 2012-10-19 2015-06-24 陶氏环球技术有限公司 含有核壳橡胶和多元醇的韧化环氧树脂热固物
EP2909251B1 (de) * 2012-10-19 2017-07-26 Dow Global Technologies LLC Geruchsarme epoxidharzsysteme auf basis von nadic-anhydrid-härtungsmitteln
BR112015021037A2 (pt) * 2013-03-15 2017-07-18 Blue Cube Ip Llc composição de resina curável, processo para preparar uma composição de resina curável, composição de resina curada e artigo
US20160280864A1 (en) * 2013-10-08 2016-09-29 Timothy A. Morley Low odor epoxy resin systems based on nadic anhydride-type hardeners
US20210002526A1 (en) * 2018-03-08 2021-01-07 Dow Silicones Corporation Self-adhesive silicone elastomer
CN108794987B (zh) * 2018-06-20 2021-04-20 深圳博元新材科技有限公司 一种高增韧的环氧组合物及其制备方法
US20210242102A1 (en) * 2020-02-04 2021-08-05 Intel Corporation Underfill material for integrated circuit (ic) package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789482A (en) * 1990-03-30 1998-08-04 Ciba Specialty Chemicals Corporation Epoxy resin with anhydride, toughener and active hydrogen-containing compound
KR100193147B1 (ko) 1990-03-30 1999-06-15 월터클라웨인, 한느-피터 위트린 개질된 에폭시 수지
ES2148213T3 (es) * 1992-07-09 2000-10-16 Vantico Ag Suspensiones endurecibles a base de resinas epoxi.
DE59508782D1 (de) * 1994-12-13 2000-11-16 Ciba Sc Holding Ag Core/Shell-Zähigkeitsvermittler enthaltende härtbare Epoxidharz-Giessmassen
US6180696B1 (en) 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
EP1165688B1 (de) * 1999-03-16 2007-01-24 Huntsman Advanced Materials (Switzerland) GmbH Härtbare zusammensetzung mit besonderer eigenschaftskombination
US6624216B2 (en) * 2002-01-31 2003-09-23 National Starch And Chemical Investment Holding Corporation No-flow underfill encapsulant

Also Published As

Publication number Publication date
DK1558678T3 (da) 2007-01-29
EP1558678B1 (de) 2006-09-20
CN1732225A (zh) 2006-02-08
DE60308545T2 (de) 2007-09-13
US7056978B2 (en) 2006-06-06
US20040087681A1 (en) 2004-05-06
JP2006505675A (ja) 2006-02-16
KR20050084677A (ko) 2005-08-26
DE60308545D1 (de) 2006-11-02
WO2004044053A1 (en) 2004-05-27
EP1558678A1 (de) 2005-08-03
AU2003287428A1 (en) 2004-06-03

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