ATE340219T1 - Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss - Google Patents

Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss

Info

Publication number
ATE340219T1
ATE340219T1 AT03781663T AT03781663T ATE340219T1 AT E340219 T1 ATE340219 T1 AT E340219T1 AT 03781663 T AT03781663 T AT 03781663T AT 03781663 T AT03781663 T AT 03781663T AT E340219 T1 ATE340219 T1 AT E340219T1
Authority
AT
Austria
Prior art keywords
composition
reinforced epoxy
polyanhydride
flow
flow underfilling
Prior art date
Application number
AT03781663T
Other languages
English (en)
Inventor
Jayesh P Shah
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of ATE340219T1 publication Critical patent/ATE340219T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Reinforced Plastic Materials (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AT03781663T 2002-11-06 2003-10-31 Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss ATE340219T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/289,504 US7056978B2 (en) 2002-11-06 2002-11-06 Toughened epoxy-anhydride no-flow underfill encapsulant

Publications (1)

Publication Number Publication Date
ATE340219T1 true ATE340219T1 (de) 2006-10-15

Family

ID=32176082

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03781663T ATE340219T1 (de) 2002-11-06 2003-10-31 Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss

Country Status (10)

Country Link
US (1) US7056978B2 (de)
EP (1) EP1558678B1 (de)
JP (1) JP2006505675A (de)
KR (1) KR20050084677A (de)
CN (1) CN1732225A (de)
AT (1) ATE340219T1 (de)
AU (1) AU2003287428A1 (de)
DE (1) DE60308545T2 (de)
DK (1) DK1558678T3 (de)
WO (1) WO2004044053A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7209324B2 (en) * 2003-06-30 2007-04-24 Hitachi Global Storage Netherlands, B.V. Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers
US7064929B2 (en) * 2003-06-30 2006-06-20 Hitachi Global Storage Netherlands B.V. Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers
EP1649322A4 (de) 2003-07-17 2007-09-19 Honeywell Int Inc Planarisierungsfilme für fortschrittliche mikroelektronsiche anwendungen und einrichtungen und herstellungsverfahren dafür
WO2005108487A1 (en) * 2004-04-22 2005-11-17 Henkel Corporation Methods for improving the flux compatibility of underfill formulations
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
CA2577681C (en) * 2004-08-18 2013-10-08 Kaneka Corporation Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
WO2007125806A1 (ja) * 2006-04-28 2007-11-08 Showa Denko K.K. 熱硬化性樹脂組成物およびその用途
WO2008105189A1 (ja) * 2007-02-28 2008-09-04 Kaneka Corporation ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法
CN101143933B (zh) * 2007-09-27 2010-09-29 成都多沐汽车工程有限公司 实心环氧塑料板材及生产方法
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
WO2010005710A1 (en) * 2008-06-16 2010-01-14 3M Innovative Properties Company Toughened curable compositions
EP2223966B1 (de) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy-Haftmittelzusammensetzungen mit hoher mechanischer Festigkeit über einen breiten Temperaturbereich
KR101117757B1 (ko) * 2009-02-26 2012-03-15 도레이첨단소재 주식회사 비유동성 언더필용 수지조성물 및 이를 이용한 비유동성 언더필 필름
CN102884100B (zh) * 2010-03-24 2018-02-06 蓝立方知识产权有限责任公司 包括作为增韧剂的聚(环氧丙烷)多元醇的环氧树脂组合物
CN101864147B (zh) * 2010-06-28 2012-12-26 深圳市库泰克电子材料技术有限公司 一种低粘度、低线膨胀系数的底部填充胶
JP2012162585A (ja) * 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
CN102516963B (zh) * 2011-10-17 2013-07-31 中国石油天然气股份有限公司 用于油水井套管修复的化学复合树脂封固剂
CN102559115B (zh) * 2011-12-22 2013-11-27 烟台德邦科技有限公司 一种芯片级底部填充胶及其制备方法
CN107353586A (zh) * 2011-12-27 2017-11-17 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
EP2909252B1 (de) * 2012-10-19 2017-06-21 Blue Cube IP LLC Gehärtete epoxidduroplaste mit kern-hülle-gummis und polyolen
WO2014062409A2 (en) * 2012-10-19 2014-04-24 Dow Global Technologies Llc Low odor epoxy resin systems based on nadic anhydride-type harneders
CN105121496A (zh) * 2013-03-15 2015-12-02 蓝立方知识产权有限责任公司 含有核壳橡胶和多元醇的韧化环氧树脂热固物
US20160280864A1 (en) * 2013-10-08 2016-09-29 Timothy A. Morley Low odor epoxy resin systems based on nadic anhydride-type hardeners
EP3762465B1 (de) * 2018-03-08 2023-05-03 Dow Silicones Corporation Selbstklebendes silikonelastomer
CN108794987B (zh) * 2018-06-20 2021-04-20 深圳博元新材科技有限公司 一种高增韧的环氧组合物及其制备方法
US20210242102A1 (en) * 2020-02-04 2021-08-05 Intel Corporation Underfill material for integrated circuit (ic) package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100193147B1 (ko) 1990-03-30 1999-06-15 월터클라웨인, 한느-피터 위트린 개질된 에폭시 수지
US5789482A (en) * 1990-03-30 1998-08-04 Ciba Specialty Chemicals Corporation Epoxy resin with anhydride, toughener and active hydrogen-containing compound
ES2148213T3 (es) 1992-07-09 2000-10-16 Vantico Ag Suspensiones endurecibles a base de resinas epoxi.
EP0717073B1 (de) * 1994-12-13 2000-10-11 Ciba SC Holding AG Core/Shell-Zähigkeitsvermittler enthaltende härtbare Epoxidharz-Giessmassen
US6180696B1 (en) 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
JP4798848B2 (ja) * 1999-03-16 2011-10-19 ハンツマン アドバンスト マテリアルズ （スイッツァランド） ゲーエムベーハー 特別な性質の組合せを有する硬化性組成物
US6624216B2 (en) 2002-01-31 2003-09-23 National Starch And Chemical Investment Holding Corporation No-flow underfill encapsulant

Also Published As

Publication number Publication date
DE60308545D1 (de) 2006-11-02
CN1732225A (zh) 2006-02-08
EP1558678B1 (de) 2006-09-20
WO2004044053A1 (en) 2004-05-27
US20040087681A1 (en) 2004-05-06
AU2003287428A1 (en) 2004-06-03
DE60308545T2 (de) 2007-09-13
JP2006505675A (ja) 2006-02-16
US7056978B2 (en) 2006-06-06
EP1558678A1 (de) 2005-08-03
DK1558678T3 (da) 2007-01-29
KR20050084677A (ko) 2005-08-26

Similar Documents

Publication Publication Date Title
DE60308545D1 (de) Verstärktes epoxid / polyanhydrid zusammensetzung für unterfüllung ohne durchfluss
WO2003065447A3 (en) No-flow underfill encapsulant
DE60316759D1 (de) Epoxy-polysiloxanharzzusammensetzungen, damit eingekapselte Halbleitereinrichtungen und Verfahren
ATE365758T1 (de) Nichtfliessende unterfüllungszusammensetzung
MY126953A (en) Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same
TW200726784A (en) Epoxy resin molding material for sealing use and semiconductor device
DE602004023734D1 (de) Lösungsmittel-modifizierte harz-zusammensetzungen und verwendungsverfahren dafür
MY138890A (en) Combinations of resin compositions and methods of use therof
ATE377059T1 (de) Polysilazanmodifizierte polyaminhärtungsmittel für epoxidharze
DE60200279D1 (de) Epoxidharzzusammensetzung zum Verkapseln von Halbleiterbauteilen sowie Halbleiterbauteil, welches von der Zusammensetzung Gebrauch macht
EP2410001A4 (de) Einschlusskomplex, härtungsmittel, härtungsbeschleuniger, epoxidharzzusammensetzung und epoxidharzzusammensetzung zur einkapselung von halbleitern
TWI317743B (en) Curing accelerator, epoxy resin composition, and semiconductor device
DE60121553D1 (de) Harzzusammensetzung, formmaterial und geformter gegenstand
TW200718749A (en) Liquid epoxy resin composition
TW200801064A (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
MY116439A (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device
EP1049152A3 (de) Epoxydharzzusammensetzung zur Einkapselung von Halbleitern und Halbleiterbauelement
MY143212A (en) Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
SG158878A1 (en) Epoxy resin composition, method of rendering the same latent, and semiconductor device
DE60218480D1 (de) Epoxydharz
PL401407A1 (pl) Wodna kompozycja klejowa do laczenia elastomerów
ATE409712T1 (de) Epoxidharz zusammensetzung
NZ513137A (en) Two part anchoring adhesive putty with the two parts being in a side by side relationship
TW200708584A (en) Die attach adhesives with improved stress performance
TW200519135A (en) Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties