ATE341845T1 - Verfahren zur reduzierung von elektromagnetischer abstrahlung für geschirmte steckverbinder - Google Patents

Verfahren zur reduzierung von elektromagnetischer abstrahlung für geschirmte steckverbinder

Info

Publication number
ATE341845T1
ATE341845T1 AT02768413T AT02768413T ATE341845T1 AT E341845 T1 ATE341845 T1 AT E341845T1 AT 02768413 T AT02768413 T AT 02768413T AT 02768413 T AT02768413 T AT 02768413T AT E341845 T1 ATE341845 T1 AT E341845T1
Authority
AT
Austria
Prior art keywords
reducing electromagnetic
electromagnetic radiation
shielded connectors
transistor
logic
Prior art date
Application number
AT02768413T
Other languages
English (en)
Inventor
Alok Tripathi
Dennis Miller
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE341845T1 publication Critical patent/ATE341845T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
    • H01R13/7195—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with planar filters with openings for contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6597—Specific features or arrangements of connection of shield to conductive members the conductive member being a contact of the connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/947—PCB mounted connector with ground terminal

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Multi-Conductor Connections (AREA)
AT02768413T 2001-08-23 2002-08-01 Verfahren zur reduzierung von elektromagnetischer abstrahlung für geschirmte steckverbinder ATE341845T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/940,147 US6700455B2 (en) 2001-08-23 2001-08-23 Electromagnetic emission reduction technique for shielded connectors

Publications (1)

Publication Number Publication Date
ATE341845T1 true ATE341845T1 (de) 2006-10-15

Family

ID=25474321

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02768413T ATE341845T1 (de) 2001-08-23 2002-08-01 Verfahren zur reduzierung von elektromagnetischer abstrahlung für geschirmte steckverbinder

Country Status (7)

Country Link
US (1) US6700455B2 (de)
EP (1) EP1419559B1 (de)
CN (1) CN1324769C (de)
AT (1) ATE341845T1 (de)
DE (1) DE60215188T2 (de)
TW (1) TW578336B (de)
WO (1) WO2003019733A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI220612B (en) * 2003-03-03 2004-08-21 Ic Plus Corp Network physical layer apparatus with smart cable analyzing function and application device thereof
CA2529815A1 (en) * 2003-06-18 2005-01-06 General Instrument Corporation Low emi with high mechanical strength method of connecting signal connections
US7524209B2 (en) * 2003-09-26 2009-04-28 Fci Americas Technology, Inc. Impedance mating interface for electrical connectors
TW200627241A (en) 2005-01-20 2006-08-01 Avermedia Tech Inc Computer interface card
CN100361042C (zh) * 2005-02-05 2008-01-09 圆刚科技股份有限公司 电脑接口卡
CN101523669B (zh) * 2006-10-05 2012-01-25 Fci公司 电连接器的宽边耦合的信号对构造
US7713088B2 (en) * 2006-10-05 2010-05-11 Fci Broadside-coupled signal pair configurations for electrical connectors
US7708569B2 (en) * 2006-10-30 2010-05-04 Fci Americas Technology, Inc. Broadside-coupled signal pair configurations for electrical connectors
CN102725919B (zh) * 2009-12-30 2015-07-08 Fci公司 具有阻抗调节肋的电连接器
TW201204197A (en) * 2010-07-01 2012-01-16 Hon Hai Prec Ind Co Ltd Printed circuit board
US9136634B2 (en) 2010-09-03 2015-09-15 Fci Americas Technology Llc Low-cross-talk electrical connector
US9868653B2 (en) * 2013-05-01 2018-01-16 Nch Corporation System and method for treating water systems with high voltage discharge and ozone
US10673182B2 (en) 2015-12-07 2020-06-02 Fci Usa Llc Electrical connector having electrically commoned grounds
EP3544126B1 (de) * 2016-12-08 2021-09-22 Huawei Technologies Co., Ltd. Vorrichtung mit usb-anschluss

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4827378A (en) * 1988-06-15 1989-05-02 Rockwell International Corporation Jack coaxial connector EMI shielding apparatus
DE9016083U1 (de) 1990-11-27 1991-02-14 Thomas & Betts Corp., Bridgewater, N.J. Stecker
US5351018A (en) * 1992-11-25 1994-09-27 Thomson Consumer Electronics, Inc. Antenna isolation assembly for hot chassis receiver
US5470238A (en) * 1994-02-09 1995-11-28 Intercon Systems, Inc. Shielded ribbon cable electrical connector assembly and method
US5562498A (en) 1994-12-21 1996-10-08 Delco Electronics Corp. Flexible capacitor filter
JP3684239B2 (ja) * 1995-01-10 2005-08-17 株式会社 日立製作所 低ｅｍｉ電子機器
US6033263A (en) 1996-10-15 2000-03-07 The Whitaker Corporation Electrically connector with capacitive coupling
JP3926880B2 (ja) * 1997-03-31 2007-06-06 富士通株式会社 多層プリント板
US5861783A (en) * 1997-08-01 1999-01-19 Lucent Technologies Inc. Crosstalk reduction in parasitically coupled circuits with an RC network connecting circuit grounds
US6023202A (en) * 1998-02-13 2000-02-08 Hewlett-Packard Company Ground return for high speed digital signals that are capacitively coupled across a DC-isolated interface
CN2405341Y (zh) * 1999-11-11 2000-11-08 富士康(昆山)电脑接插件有限公司 电连接器

Also Published As

Publication number Publication date
EP1419559A1 (de) 2004-05-19
DE60215188T2 (de) 2007-10-18
HK1062081A1 (en) 2004-10-15
TW578336B (en) 2004-03-01
EP1419559B1 (de) 2006-10-04
CN1543697A (zh) 2004-11-03
DE60215188D1 (de) 2006-11-16
CN1324769C (zh) 2007-07-04
US20030038686A1 (en) 2003-02-27
US6700455B2 (en) 2004-03-02
WO2003019733A1 (en) 2003-03-06

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Legal Events

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