ATE342570T1 - Geschäumte polymer-dichtung und -abdichtung - Google Patents
Geschäumte polymer-dichtung und -abdichtungInfo
- Publication number
- ATE342570T1 ATE342570T1 AT02719592T AT02719592T ATE342570T1 AT E342570 T1 ATE342570 T1 AT E342570T1 AT 02719592 T AT02719592 T AT 02719592T AT 02719592 T AT02719592 T AT 02719592T AT E342570 T1 ATE342570 T1 AT E342570T1
- Authority
- AT
- Austria
- Prior art keywords
- sealing
- foam
- polyurethane
- foamed polymer
- polymer gasket
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 230000006835 compression Effects 0.000 abstract 2
- 238000007906 compression Methods 0.000 abstract 2
- 239000006260 foam Substances 0.000 abstract 2
- 229920002635 polyurethane Polymers 0.000 abstract 2
- 239000004814 polyurethane Substances 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 229920005830 Polyurethane Foam Polymers 0.000 abstract 1
- 239000011231 conductive filler Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 239000012948 isocyanate Substances 0.000 abstract 1
- 150000002513 isocyanates Chemical class 0.000 abstract 1
- 239000011496 polyurethane foam Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/021—Sealings between relatively-stationary surfaces with elastic packing
- F16J15/022—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0041—Foam properties having specified density
- C08G2110/005—< 50kg/m3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0075—Foam properties prepared with an isocyanate index of 60 or lower
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S277/00—Seal for a joint or juncture
- Y10S277/92—Seal including electromagnetic shielding feature
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Conductive Materials (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/842,261 US6646199B2 (en) | 1999-10-20 | 2001-04-26 | Polymeric foam gaskets and seals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE342570T1 true ATE342570T1 (de) | 2006-11-15 |
Family
ID=25286887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02719592T ATE342570T1 (de) | 2001-04-26 | 2002-04-25 | Geschäumte polymer-dichtung und -abdichtung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6646199B2 (de) |
| EP (1) | EP1382045B1 (de) |
| JP (1) | JP4293793B2 (de) |
| AT (1) | ATE342570T1 (de) |
| CA (1) | CA2444527C (de) |
| DE (1) | DE60215324T2 (de) |
| WO (1) | WO2002089151A1 (de) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7039361B1 (en) * | 2002-02-01 | 2006-05-02 | Ciena Corporation | System and method for reducing electromagnetic interference |
| US6964809B2 (en) * | 2002-02-15 | 2005-11-15 | Pedro M. Buarque de Macedo | Large high density foam glass tile |
| US7060348B2 (en) * | 2002-03-08 | 2006-06-13 | Laird Technologies, Inc. | Flame retardant, electrically conductive shielding materials and methods of making the same |
| US8453400B2 (en) * | 2003-07-22 | 2013-06-04 | Pedro M. Buarque de Macedo | Prestressed, strong foam glass tiles |
| US7311965B2 (en) * | 2003-07-22 | 2007-12-25 | Pedro M. Buarque de Macedo | Strong, high density foam glass tile having a small pore size |
| GB0329891D0 (en) * | 2003-12-23 | 2004-01-28 | Airbus Uk Ltd | A sealing material |
| GB0329890D0 (en) * | 2003-12-23 | 2004-01-28 | Airbus Uk Ltd | Method of Sealing a Joint |
| EP1548337A1 (de) * | 2003-12-24 | 2005-06-29 | Airbus UK Limited | Dichtungsverfahren für Verbindungen |
| US8545974B2 (en) * | 2005-02-09 | 2013-10-01 | Laird Technologies, Inc. | Flame retardant EMI shields |
| US20100258344A1 (en) * | 2005-02-09 | 2010-10-14 | Laird Technologies, Inc. | Flame retardant emi shields |
| US7695560B1 (en) | 2005-12-01 | 2010-04-13 | Buarque De Macedo Pedro M | Strong, lower density composite concrete building material with foam glass aggregate |
| US20080073622A1 (en) * | 2006-09-22 | 2008-03-27 | Inolex Investment Corporation | Conductive polyurethane foam and methods for making same |
| US20080107883A1 (en) * | 2006-11-08 | 2008-05-08 | L&L Products, Inc. | Coated sealer and method of use |
| US20080157915A1 (en) * | 2007-01-03 | 2008-07-03 | Ethan Lin | Flame retardant, electrically-conductive pressure sensitive adhesive materials and methods of making the same |
| GB0720705D0 (en) * | 2007-10-23 | 2007-12-05 | Airbus Uk Ltd | Fastener joint with sealing gasket |
| JP6006350B2 (ja) * | 2009-03-04 | 2016-10-12 | 日東電工株式会社 | 導電性を有する樹脂発泡体 |
| JP5701508B2 (ja) * | 2009-03-04 | 2015-04-15 | 日東電工株式会社 | 導電性を有する樹脂発泡体 |
| KR101048083B1 (ko) * | 2010-10-14 | 2011-07-11 | 주식회사 이노칩테크놀로지 | 전자파 차폐 가스켓 |
| CN202721947U (zh) * | 2011-11-03 | 2013-02-06 | 卢子鬯 | 电子仪器用之无卤素阻燃电磁干扰防护垫片 |
| WO2014139126A1 (en) | 2013-03-14 | 2014-09-18 | Laird Technologies, Inc. | Flame-retardant electrically-conductive adhesive material and method of making the same |
| CN104837327A (zh) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | 电路保护结构及电子装置 |
| WO2020139572A1 (en) | 2018-12-27 | 2020-07-02 | Saint-Gobain Performance Plastics Corporation | Polyurethane foam and methods of forming the same |
| CN111378086A (zh) | 2018-12-27 | 2020-07-07 | 美国圣戈班性能塑料公司 | 聚氨酯泡沫体及其形成方法 |
| CN109880344B (zh) * | 2019-01-30 | 2021-02-23 | 中北大学 | 一种低反射高屏蔽水性聚氨酯电磁屏蔽复合泡沫的制备方法 |
| HUE070533T2 (hu) * | 2020-03-18 | 2025-06-28 | Boehringer Ingelheim Microparts Gmbh | Kibocsátó szerkezet, és eljárás kibocsátó szerkezetek szerelésére |
| CN113637359B (zh) * | 2020-05-11 | 2023-10-17 | 臻鼎科技股份有限公司 | 具有拉伸性能的导电油墨和导电元件 |
| EP4604686A1 (de) * | 2024-02-19 | 2025-08-20 | Aptiv Technologies AG | Emv-gehäuse für elektrische bauelemente |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3194860A (en) | 1962-10-02 | 1965-07-13 | John E Ehrreich | Manufacture of reinforced conductive plastic gaskets |
| US3609104A (en) | 1968-02-15 | 1971-09-28 | Ercon Inc | Electrically conductive gasket and material thereof |
| US4011360A (en) | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| US4378322A (en) | 1980-06-05 | 1983-03-29 | Transmet Corporation | Electromagnetic radiation shielding composites and method of production thereof |
| US4769280A (en) | 1980-12-22 | 1988-09-06 | Chomerics, Inc. | Electromagnetic shielding |
| US4434541A (en) | 1980-12-22 | 1984-03-06 | Chomerics, Inc. | Electromagnetic shielding |
| US4507359A (en) | 1980-12-22 | 1985-03-26 | Chomerics, Inc. | Electromagnetic shielding |
| GB2102207B (en) | 1981-07-17 | 1985-04-17 | Ferranti Ltd | Electrical circuit assembly |
| US4652695A (en) | 1983-06-20 | 1987-03-24 | Pawling Corporation | Mesh-covered core strip for high frequency RFI/EMI radiation shielding |
| US4678716A (en) | 1985-08-06 | 1987-07-07 | Chomerics, Inc. | Electromagnetic shielding |
| US4857668A (en) | 1988-04-15 | 1989-08-15 | Schlegel Corporation | Multi-function gasket |
| US4931479B1 (en) | 1988-11-07 | 2000-10-10 | Parker Intangibles Inc | Foam in place conductive polyurethane foam |
| US5141770A (en) | 1988-11-10 | 1992-08-25 | Vanguard Products Corporation | Method of making dual elastomer gasket shield for electromagnetic shielding |
| US4968854A (en) | 1988-11-10 | 1990-11-06 | Vanguard Products Corporation | Dual elastomer gasket shield for electronic equipment |
| US5061566A (en) | 1989-12-28 | 1991-10-29 | Chomerics, Inc. | Corrosion inhibiting emi/rfi shielding coating and method of its use |
| DE9209035U1 (de) | 1992-07-06 | 1992-09-10 | Knürr-Mechanik für die Elektronik AG, 8000 München | Hochfrequenz-Abschirm- und Dichtungsvorrichtung |
| US5545474A (en) | 1994-03-01 | 1996-08-13 | Martin Marietta Corporation | Electromagnetic-attenuating coating materials |
| DE19529624C2 (de) | 1995-08-11 | 1999-07-01 | Knuerr Mechanik Ag | Verfahren und Vorrichtung zum Herstellen einer Abschirmdichtung |
| US6670545B2 (en) | 1999-10-20 | 2003-12-30 | Chemque, Inc. | Conductive coating on a non-conductive flexible substrate |
-
2001
- 2001-04-26 US US09/842,261 patent/US6646199B2/en not_active Expired - Fee Related
-
2002
- 2002-04-25 AT AT02719592T patent/ATE342570T1/de not_active IP Right Cessation
- 2002-04-25 EP EP02719592A patent/EP1382045B1/de not_active Expired - Lifetime
- 2002-04-25 JP JP2002586360A patent/JP4293793B2/ja not_active Expired - Fee Related
- 2002-04-25 WO PCT/CA2002/000603 patent/WO2002089151A1/en not_active Ceased
- 2002-04-25 CA CA2444527A patent/CA2444527C/en not_active Expired - Lifetime
- 2002-04-25 DE DE60215324T patent/DE60215324T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1382045A1 (de) | 2004-01-21 |
| EP1382045B1 (de) | 2006-10-11 |
| DE60215324D1 (de) | 2006-11-23 |
| JP2004527087A (ja) | 2004-09-02 |
| CA2444527A1 (en) | 2002-11-07 |
| JP4293793B2 (ja) | 2009-07-08 |
| US6646199B2 (en) | 2003-11-11 |
| DE60215324T2 (de) | 2007-05-16 |
| CA2444527C (en) | 2010-10-12 |
| WO2002089151A1 (en) | 2002-11-07 |
| US20020010223A1 (en) | 2002-01-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |