ATE343851T1 - Verwendung diverser materialien bei der kapselung elektronischer bauelemente mit lufthohlräumen - Google Patents

Verwendung diverser materialien bei der kapselung elektronischer bauelemente mit lufthohlräumen

Info

Publication number
ATE343851T1
ATE343851T1 AT02737544T AT02737544T ATE343851T1 AT E343851 T1 ATE343851 T1 AT E343851T1 AT 02737544 T AT02737544 T AT 02737544T AT 02737544 T AT02737544 T AT 02737544T AT E343851 T1 ATE343851 T1 AT E343851T1
Authority
AT
Austria
Prior art keywords
sidewalls
base
lid
die
temperature
Prior art date
Application number
AT02737544T
Other languages
English (en)
Inventor
Raymond S Bregante
Tony Shaffer
K Scott Mellen
Richard J Ross
Original Assignee
Rjr Polymers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjr Polymers Inc filed Critical Rjr Polymers Inc
Application granted granted Critical
Publication of ATE343851T1 publication Critical patent/ATE343851T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packages (AREA)
  • Casings For Electric Apparatus (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Packaging Frangible Articles (AREA)
  • Organic Insulating Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AT02737544T 2001-07-12 2002-06-19 Verwendung diverser materialien bei der kapselung elektronischer bauelemente mit lufthohlräumen ATE343851T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/904,583 US6511866B1 (en) 2001-07-12 2001-07-12 Use of diverse materials in air-cavity packaging of electronic devices

Publications (1)

Publication Number Publication Date
ATE343851T1 true ATE343851T1 (de) 2006-11-15

Family

ID=25419388

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02737544T ATE343851T1 (de) 2001-07-12 2002-06-19 Verwendung diverser materialien bei der kapselung elektronischer bauelemente mit lufthohlräumen

Country Status (16)

Country Link
US (1) US6511866B1 (de)
EP (1) EP1415335B1 (de)
JP (1) JP4362366B2 (de)
KR (1) KR100815740B1 (de)
CN (1) CN1266751C (de)
AT (1) ATE343851T1 (de)
AU (1) AU2002310466B2 (de)
CA (1) CA2453003C (de)
DE (1) DE60215669T2 (de)
IL (1) IL159727A0 (de)
MA (1) MA26134A1 (de)
MX (1) MXPA04000248A (de)
MY (1) MY122915A (de)
PL (1) PL205553B1 (de)
TW (1) TW554504B (de)
WO (1) WO2003007362A1 (de)

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US7075174B2 (en) * 2004-02-26 2006-07-11 Agere Systems Inc. Semiconductor packaging techniques for use with non-ceramic packages
US7030472B2 (en) * 2004-04-01 2006-04-18 Agere Systems Inc. Integrated circuit device having flexible leadframe
CN1778986B (zh) 2004-06-02 2015-08-19 应用材料公司 用于密封腔室的方法和装置
US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
US7429790B2 (en) * 2005-10-24 2008-09-30 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
US7683480B2 (en) * 2006-03-29 2010-03-23 Freescale Semiconductor, Inc. Methods and apparatus for a reduced inductance wirebond array
EP2141973A1 (de) * 2008-07-02 2010-01-06 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Verfahren zur Bereitstellung leitfähiger Strukturen in einem mehrschichtigen Foliensystem und mehrschichtiges Foliensystem damit
US9293350B2 (en) * 2008-10-28 2016-03-22 Stats Chippac Ltd. Semiconductor package system with cavity substrate and manufacturing method therefor
US8110445B2 (en) * 2009-05-06 2012-02-07 Infineon Technologies Ag High power ceramic on copper package
US8013429B2 (en) 2009-07-14 2011-09-06 Infineon Technologies Ag Air cavity package with copper heat sink and ceramic window frame
US8759965B2 (en) * 2009-10-14 2014-06-24 Stmicroelectronics, Inc. Modular low stress package technology
US8564968B1 (en) 2011-05-10 2013-10-22 Triquint Semiconductor, Inc. Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall
US8907467B2 (en) * 2012-03-28 2014-12-09 Infineon Technologies Ag PCB based RF-power package window frame
JP2017518640A (ja) * 2014-05-23 2017-07-06 マテリオン コーポレイション エアキャビティパッケージ
US10015882B1 (en) 2015-01-05 2018-07-03 Qorvo Us, Inc. Modular semiconductor package
US10468399B2 (en) 2015-03-31 2019-11-05 Cree, Inc. Multi-cavity package having single metal flange
DE102015209892A1 (de) * 2015-05-29 2016-12-01 Rolls-Royce Deutschland Ltd & Co Kg Adaptives Flugzeugtriebwerk und Flugzeug mit einem adaptiven Triebwerk
US9629246B2 (en) 2015-07-28 2017-04-18 Infineon Technologies Ag PCB based semiconductor package having integrated electrical functionality
US9997476B2 (en) 2015-10-30 2018-06-12 Infineon Technologies Ag Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
US10225922B2 (en) 2016-02-18 2019-03-05 Cree, Inc. PCB based semiconductor package with impedance matching network elements integrated therein
US10115605B2 (en) 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates
US11791251B2 (en) 2021-07-29 2023-10-17 Qorvo Us, Inc. High power laminate RF package
US12136615B2 (en) 2021-11-30 2024-11-05 Qorvo Us, Inc. Electronic package with interposer between integrated circuit dies

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Also Published As

Publication number Publication date
MY122915A (en) 2006-05-31
AU2002310466B2 (en) 2006-07-20
MA26134A1 (fr) 2004-04-01
CN1266751C (zh) 2006-07-26
EP1415335A4 (de) 2005-12-21
DE60215669T2 (de) 2007-08-23
JP2004535675A (ja) 2004-11-25
EP1415335A1 (de) 2004-05-06
CN1526162A (zh) 2004-09-01
CA2453003C (en) 2009-12-22
JP4362366B2 (ja) 2009-11-11
PL368717A1 (en) 2005-04-04
MXPA04000248A (es) 2004-05-04
KR20040036898A (ko) 2004-05-03
US20030013234A1 (en) 2003-01-16
KR100815740B1 (ko) 2008-03-20
CA2453003A1 (en) 2003-01-23
US6511866B1 (en) 2003-01-28
PL205553B1 (pl) 2010-04-30
IL159727A0 (en) 2004-06-20
DE60215669D1 (de) 2006-12-07
WO2003007362A1 (en) 2003-01-23
EP1415335B1 (de) 2006-10-25
TW554504B (en) 2003-09-21
HK1065641A1 (en) 2005-02-25

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