ATE344533T1 - Vorrichtung zum ausrichten und verteilen von lötmittelsäulen in einer matrix - Google Patents

Vorrichtung zum ausrichten und verteilen von lötmittelsäulen in einer matrix

Info

Publication number
ATE344533T1
ATE344533T1 AT03257904T AT03257904T ATE344533T1 AT E344533 T1 ATE344533 T1 AT E344533T1 AT 03257904 T AT03257904 T AT 03257904T AT 03257904 T AT03257904 T AT 03257904T AT E344533 T1 ATE344533 T1 AT E344533T1
Authority
AT
Austria
Prior art keywords
alignment plate
solder columns
guide grooves
aligning
vibrator
Prior art date
Application number
AT03257904T
Other languages
English (en)
Inventor
Shinichi Nomoto
Takashi Nauchi
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of ATE344533T1 publication Critical patent/ATE344533T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
AT03257904T 2002-12-17 2003-12-16 Vorrichtung zum ausrichten und verteilen von lötmittelsäulen in einer matrix ATE344533T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002364913A JP3793969B2 (ja) 2002-12-17 2002-12-17 カラム整列装置

Publications (1)

Publication Number Publication Date
ATE344533T1 true ATE344533T1 (de) 2006-11-15

Family

ID=32376235

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03257904T ATE344533T1 (de) 2002-12-17 2003-12-16 Vorrichtung zum ausrichten und verteilen von lötmittelsäulen in einer matrix

Country Status (10)

Country Link
US (1) US6955285B2 (de)
EP (1) EP1432020B1 (de)
JP (1) JP3793969B2 (de)
KR (1) KR100964730B1 (de)
CN (1) CN100347839C (de)
AT (1) ATE344533T1 (de)
DE (1) DE60309420T2 (de)
MY (1) MY130888A (de)
SG (1) SG118220A1 (de)
TW (1) TWI236868B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090250506A1 (en) * 2008-02-28 2009-10-08 General Dynamics Advanced Information Systems Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards
CN102351095B (zh) * 2011-09-05 2013-03-27 南京时恒电子科技有限公司 用于热敏电阻芯片检测分拣的直线送料机构
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9561914B1 (en) * 2015-10-13 2017-02-07 Asm Technology Singapore Pte. Ltd Apparatus and method for transferring electronic devices
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
CN107611064B (zh) * 2017-08-30 2019-08-30 哈尔滨理工大学 一种用于铜柱栅阵列互连器件植柱工艺的装置
CN108015511B (zh) * 2017-12-22 2023-08-08 湖南先步信息股份有限公司 可三轴微调的瓷柱送料机构
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
DE112020007833T5 (de) 2020-12-11 2023-09-21 Fuji Corporation Saugdüse und Bauteilmontierer
US12526920B1 (en) 2024-01-12 2026-01-13 Topline Corporation Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4146123A (en) * 1977-07-28 1979-03-27 Champion International Corporation Stick aligning and conveying method and apparatus
US4206542A (en) * 1978-03-13 1980-06-10 General Dynamics Pomona Division Solder preform loading method and apparatus
US4142286A (en) * 1978-03-15 1979-03-06 Burroughs Corporation Apparatus and method for inserting solder preforms on selected circuit board back plane pins
US4927001A (en) * 1988-02-19 1990-05-22 Excellon Automation Adjustable component cover plate for vibrating conveyor
US5293072A (en) 1990-06-25 1994-03-08 Fujitsu Limited Semiconductor device having spherical terminals attached to the lead frame embedded within the package body
US5788143A (en) 1992-04-08 1998-08-04 International Business Machines Corporation Solder particle deposition
US5626278A (en) 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
JPH10139133A (ja) * 1996-11-14 1998-05-26 Nippon Eranko Kk 錠剤の整列供給装置
US6251767B1 (en) * 1997-01-14 2001-06-26 Texas Instruments Incorporated Ball grid assembly with solder columns
US6182356B1 (en) 1997-11-24 2001-02-06 International Business Machines Corporation Apparatus for solder ball mold loading
JPH11319722A (ja) * 1998-05-20 1999-11-24 Sumitomo Metal Mining Co Ltd 単球分別装置
JP4959056B2 (ja) * 1999-03-17 2012-06-20 ノバテック エスア ボールをボール受容要素中のアパーチャに充填するための充填デバイスおよび方法
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
KR100357210B1 (ko) * 2000-12-29 2002-10-19 앰코 테크놀로지 코리아 주식회사 솔더볼 자동 공급장치
US6492254B2 (en) 2001-01-31 2002-12-10 Bae Systems Information And Electronic Systems Integration, Inc. Ball grid array (BGA) to column grid array (CGA) conversion process
KR200235286Y1 (ko) 2001-03-26 2001-10-10 남평우 비지에이 서브스트레이트의 솔더볼 마운팅 장치
TW200414858A (en) * 2003-01-15 2004-08-01 Senju Metal Industry Co Apparatus and method for aligning and attaching solder columns to a substrate

Also Published As

Publication number Publication date
TWI236868B (en) 2005-07-21
CN100347839C (zh) 2007-11-07
SG118220A1 (en) 2006-01-27
EP1432020A1 (de) 2004-06-23
KR100964730B1 (ko) 2010-06-21
JP3793969B2 (ja) 2006-07-05
DE60309420D1 (de) 2006-12-14
CN1527372A (zh) 2004-09-08
KR20040054518A (ko) 2004-06-25
US6955285B2 (en) 2005-10-18
EP1432020B1 (de) 2006-11-02
JP2004200280A (ja) 2004-07-15
MY130888A (en) 2007-07-31
TW200423840A (en) 2004-11-01
US20040124225A1 (en) 2004-07-01
DE60309420T2 (de) 2007-03-29

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