ATE345663T1 - Verkapselungsanordnung - Google Patents

Verkapselungsanordnung

Info

Publication number
ATE345663T1
ATE345663T1 AT02718745T AT02718745T ATE345663T1 AT E345663 T1 ATE345663 T1 AT E345663T1 AT 02718745 T AT02718745 T AT 02718745T AT 02718745 T AT02718745 T AT 02718745T AT E345663 T1 ATE345663 T1 AT E345663T1
Authority
AT
Austria
Prior art keywords
encapsulating
encapsulating arrangement
encapsulation arrangement
arrangement
electric component
Prior art date
Application number
AT02718745T
Other languages
English (en)
Inventor
Hakan Toernqvist
Sophia Johansson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of ATE345663T1 publication Critical patent/ATE345663T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Molding Of Porous Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Laminated Bodies (AREA)
AT02718745T 2001-03-28 2002-03-28 Verkapselungsanordnung ATE345663T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0101107A SE0101107D0 (sv) 2001-03-28 2001-03-28 Encapsulation arrangement

Publications (1)

Publication Number Publication Date
ATE345663T1 true ATE345663T1 (de) 2006-12-15

Family

ID=20283577

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02718745T ATE345663T1 (de) 2001-03-28 2002-03-28 Verkapselungsanordnung

Country Status (6)

Country Link
US (1) US20020166687A1 (de)
EP (1) EP1374651B1 (de)
AT (1) ATE345663T1 (de)
DE (1) DE60216064T2 (de)
SE (1) SE0101107D0 (de)
WO (1) WO2002080638A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004375B2 (en) * 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
US20060142424A1 (en) * 2003-05-23 2006-06-29 Jayesh Shah Foamable underfill encapsulant
US20040235996A1 (en) * 2003-05-23 2004-11-25 Jayesh Shah Foamable underfill encapsulant
US7047633B2 (en) * 2003-05-23 2006-05-23 National Starch And Chemical Investment Holding, Corporation Method of using pre-applied underfill encapsulant
DE10340328A1 (de) * 2003-08-29 2005-03-24 Endress + Hauser Gmbh + Co. Kg Vergußschale
US20060177966A1 (en) * 2005-02-09 2006-08-10 Jayesh Shah Package or pre-applied foamable underfill for lead-free process
ES2354835T3 (es) 2005-09-08 2011-03-18 Cardlab Aps Tarjeta de transacciones dinámicas y procedimiento para escribir información en la misma.
US7659141B2 (en) * 2007-09-25 2010-02-09 Silverbrook Research Pty Ltd Wire bond encapsulant application control
US7741720B2 (en) * 2007-09-25 2010-06-22 Silverbrook Research Pty Ltd Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
US8063318B2 (en) * 2007-09-25 2011-11-22 Silverbrook Research Pty Ltd Electronic component with wire bonds in low modulus fill encapsulant
DE102008024551A1 (de) * 2008-05-21 2009-11-26 Tesa Se Verfahren zur Verkapselung von optoelektronischen Bauteilen
US9230874B1 (en) * 2009-07-13 2016-01-05 Altera Corporation Integrated circuit package with a heat conductor
US9337152B2 (en) * 2013-03-15 2016-05-10 Nuvotronics, Inc Formulation for packaging an electronic device and assemblies made therefrom
MA41187A (fr) 2014-12-19 2021-04-07 Cardlab Aps Procédé et ensemble pour générer un champ magnétique et procédé de fabrication d'un ensemble
EP3035230A1 (de) 2014-12-19 2016-06-22 Cardlab ApS Verfahren und Anordnung zum Erzeugen eines Magnetfeldes
EP3082071A1 (de) 2015-04-17 2016-10-19 Cardlab ApS Vorrichtung und verfahren zur ausgabe eines magnetfelds
US9972553B1 (en) * 2016-01-06 2018-05-15 National Technology & Engineering Solutions Of Sandia, Llc Packaging system with cleaning channel and method of making the same
KR102818863B1 (ko) * 2020-12-17 2025-06-10 세키스이가세이힝코교가부시키가이샤 반도체 봉지용 수지 조성물, 언더필, 몰드 수지, 및 반도체 패키지

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2771838B2 (ja) * 1989-03-31 1998-07-02 ポリプラスチックス株式会社 電子部品の樹脂封止方法、樹脂封止用成形金型及び電子部品封止成形品
EP0634792B1 (de) * 1991-03-08 1998-04-29 Japan Gore-Tex, Inc. In Harz versiegelte Halbleitervorrichtung bestehend aus porösem Fluorkohlenstoffharz
US5907190A (en) * 1994-11-24 1999-05-25 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having a cured silicone coating with non uniformly dispersed filler
JP2871591B2 (ja) * 1996-05-14 1999-03-17 日本電気株式会社 高周波用電子部品および高周波用電子部品の製造方法
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes

Also Published As

Publication number Publication date
WO2002080638A1 (en) 2002-10-10
EP1374651B1 (de) 2006-11-15
EP1374651A1 (de) 2004-01-02
DE60216064D1 (de) 2006-12-28
DE60216064T2 (de) 2007-05-03
US20020166687A1 (en) 2002-11-14
SE0101107D0 (sv) 2001-03-28

Similar Documents

Publication Publication Date Title
ATE345663T1 (de) Verkapselungsanordnung
FR2855655B1 (fr) Detecteur de rayonnement infrarouge photovoltaique a grille conductrice independante et tridimensionnelle
DE69840953D1 (de) Harzvergossenes Halbleiterbauteil
DE10294771D2 (de) Leistungshalbleitermodul
ATE364904T1 (de) Leuchtdiode-beleuchtungsvorrichtung mit wärmeabfuhrsystem
DE59912676D1 (de) Leistungshalbleitermodul
ATE405250T1 (de) Teilchen mit maskiertem gefüge, einen wirkstoff enthaltend
TW200509337A (en) Semiconductor assembled heat sink structure for embedding electronic components
MY146850A (en) Integrated circuit enclosed retroreflective product
ATA10432001A (de) Magnetsetzroboter
AU2003205944A1 (en) Output circuit for a semiconductor amplifier element
FR2832241B1 (fr) Dispositif tracable par un identifiant electronique
DE50300666D1 (de) Airbaganordnung
EP1401021A4 (de) Leistungshalbleiterbauelement
DE60218475D1 (de) Elektrischer gegenstand mit dielektrischer epoxyschicht, die mit aminophenylfluorenen gehärtet ist
DE10293997D2 (de) Leistungshalbleitermodul
DE60120702D1 (de) Trägerfreie 103pd brachytherapiesamen
DE60335725D1 (de) Aerosolpartikelladegerät
DE60118054D1 (de) Magnetische Trägerteilchen
DE50213213D1 (de) Elektrische Bauelementanordnung
IT1318880B1 (it) Circuito elettronico per il pilotaggio ad alta efficienza di carichipiezo-elettrici con cablaggio induttivo-resisitivo.
DE60213878D1 (de) Digitale elektronische komponente, die vor analysen des elektrischen typs geschützt ist
DE50309615D1 (de) Anschlusssystem
DE50202154D1 (de) Airbaganordnung
WO2004014104A3 (en) Electroacoustic transducer with built in transducer circuit

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties