ATE346310T1 - Nickellegierungssondenkartenrahmenlaminat - Google Patents

Nickellegierungssondenkartenrahmenlaminat

Info

Publication number
ATE346310T1
ATE346310T1 AT02709234T AT02709234T ATE346310T1 AT E346310 T1 ATE346310 T1 AT E346310T1 AT 02709234 T AT02709234 T AT 02709234T AT 02709234 T AT02709234 T AT 02709234T AT E346310 T1 ATE346310 T1 AT E346310T1
Authority
AT
Austria
Prior art keywords
metallic
layers
laminated
probe card
nickel alloy
Prior art date
Application number
AT02709234T
Other languages
English (en)
Inventor
Francis T Mcquade
Zbigniew Kukielka
William F Thiessen
Stephen Evans
Original Assignee
Wentworth Lab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/953,599 external-priority patent/US6566898B2/en
Application filed by Wentworth Lab Inc filed Critical Wentworth Lab Inc
Application granted granted Critical
Publication of ATE346310T1 publication Critical patent/ATE346310T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Laminated Bodies (AREA)
AT02709234T 2001-01-31 2002-01-30 Nickellegierungssondenkartenrahmenlaminat ATE346310T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26524401P 2001-01-31 2001-01-31
US09/953,599 US6566898B2 (en) 2000-03-06 2001-09-17 Temperature compensated vertical pin probing device

Publications (1)

Publication Number Publication Date
ATE346310T1 true ATE346310T1 (de) 2006-12-15

Family

ID=26951070

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02709234T ATE346310T1 (de) 2001-01-31 2002-01-30 Nickellegierungssondenkartenrahmenlaminat

Country Status (8)

Country Link
EP (1) EP1356307B1 (de)
JP (1) JP4125598B2 (de)
KR (1) KR100871579B1 (de)
CN (1) CN1228641C (de)
AT (1) ATE346310T1 (de)
DE (1) DE60216232T2 (de)
TW (1) TWI228595B (de)
WO (1) WO2002061443A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY137372A (en) * 2003-11-14 2009-01-30 Wentworth Lab Inc Die design with integrated assembly aid
JP4721637B2 (ja) * 2003-12-25 2011-07-13 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット、導電性接触子ホルダの製造方法および検査方法
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102006054734A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings sowie entsprechendes Verfahren
JP5190195B2 (ja) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス 電気的接続装置
US8222912B2 (en) 2009-03-12 2012-07-17 Sv Probe Pte. Ltd. Probe head structure for probe test cards
KR100964568B1 (ko) * 2009-04-22 2010-06-21 주식회사 엠아이티 어드밴스 프로브카드의 정열판 제조방법
CN102346201B (zh) * 2010-07-26 2015-06-17 旺矽科技股份有限公司 垂直式探针卡的探针头及其复合板的制作方法
KR101437774B1 (ko) * 2013-04-17 2014-09-11 송지은 어드밴스 프로브헤드
KR102099639B1 (ko) * 2013-08-08 2020-05-15 세메스 주식회사 테스트 트레이의 인서트 어셈블리 및 이를 포함하는 테스트 트레이
CN103558424B (zh) * 2013-11-15 2016-03-30 上海华岭集成电路技术股份有限公司 提升平整度和绝缘性的探针卡
KR101671221B1 (ko) * 2014-12-31 2016-11-16 한국기술교육대학교 산학협력단 반도체 검사장치
JP6706079B2 (ja) * 2016-01-18 2020-06-03 新光電気工業株式会社 プローブガイド板及びプローブ装置とそれらの製造方法
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
KR102093419B1 (ko) * 2018-11-27 2020-03-26 주식회사 에스디에이 프로브 카드
KR102466911B1 (ko) * 2020-09-28 2022-11-14 주식회사 디아이티 프레임과의 결합수단을 구비한 다층 세라믹 기판 및 그의 제조 방법
CN114527369B (zh) * 2022-01-28 2024-08-09 强一半导体(苏州)股份有限公司 一种Cobra探针插针装置及其插针方法
KR102685223B1 (ko) * 2022-04-27 2024-07-17 (주)티에스이 프로브의 돌출길이가 조정되는 프로브 헤드

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650990A (ja) * 1992-07-30 1994-02-25 Nec Corp プローブカード
JP2632136B2 (ja) * 1994-10-17 1997-07-23 日本電子材料株式会社 高温測定用プローブカード
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
US5955888A (en) * 1997-09-10 1999-09-21 Xilinx, Inc. Apparatus and method for testing ball grid array packaged integrated circuits
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6163162A (en) * 1999-01-11 2000-12-19 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6633175B1 (en) * 2000-03-06 2003-10-14 Wenworth Laboratories, Inc. Temperature compensated vertical pin probing device

Also Published As

Publication number Publication date
DE60216232D1 (de) 2007-01-04
EP1356307B1 (de) 2006-11-22
EP1356307A4 (de) 2005-09-07
WO2002061443A1 (en) 2002-08-08
HK1057097A1 (en) 2004-03-12
KR100871579B1 (ko) 2008-12-02
CN1489696A (zh) 2004-04-14
JP4125598B2 (ja) 2008-07-30
CN1228641C (zh) 2005-11-23
DE60216232T2 (de) 2007-10-11
TWI228595B (en) 2005-03-01
WO2002061443A9 (en) 2003-06-05
EP1356307A1 (de) 2003-10-29
KR20030075162A (ko) 2003-09-22
JP2004518957A (ja) 2004-06-24

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties