ATE347149T1 - Flexibles halbleiter-bauelement und identifikationsetikett - Google Patents

Flexibles halbleiter-bauelement und identifikationsetikett

Info

Publication number
ATE347149T1
ATE347149T1 AT04744449T AT04744449T ATE347149T1 AT E347149 T1 ATE347149 T1 AT E347149T1 AT 04744449 T AT04744449 T AT 04744449T AT 04744449 T AT04744449 T AT 04744449T AT E347149 T1 ATE347149 T1 AT E347149T1
Authority
AT
Austria
Prior art keywords
integrated circuit
semiconductor component
substrate
identification label
flexible semiconductor
Prior art date
Application number
AT04744449T
Other languages
English (en)
Inventor
Ronald Dekker
Theodorus M Michielsen
Antoon M H Tombeur
Pieter W Hooijmans
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE347149T1 publication Critical patent/ATE347149T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Details Of Aerials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Support Of Aerials (AREA)
AT04744449T 2003-07-04 2004-07-01 Flexibles halbleiter-bauelement und identifikationsetikett ATE347149T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03102020A EP1494167A1 (de) 2003-07-04 2003-07-04 Flexibles Halbleiter-Bauelement und Identifikationsetikett

Publications (1)

Publication Number Publication Date
ATE347149T1 true ATE347149T1 (de) 2006-12-15

Family

ID=33427235

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04744449T ATE347149T1 (de) 2003-07-04 2004-07-01 Flexibles halbleiter-bauelement und identifikationsetikett

Country Status (8)

Country Link
US (2) US7816774B2 (de)
EP (2) EP1494167A1 (de)
JP (1) JP2007519215A (de)
CN (1) CN100524351C (de)
AT (1) ATE347149T1 (de)
DE (1) DE602004003498T2 (de)
TW (1) TWI354937B (de)
WO (1) WO2005004049A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566971B2 (en) 2005-05-27 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN100361150C (zh) * 2005-06-24 2008-01-09 清华大学 带有硅基集成天线的射频识别标卡
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
US7690105B2 (en) 2005-08-19 2010-04-06 Coilcraft, Incorporated Method for conserving space in a circuit
CN101405915A (zh) * 2006-03-17 2009-04-08 Nxp股份有限公司 天线装置以及rf通信设备
US8232621B2 (en) * 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8816484B2 (en) * 2007-02-09 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
GB2452732A (en) * 2007-09-12 2009-03-18 Seiko Epson Corp Smart-card chip with organic conductive surface layer for detecting invasive attack
US8106474B2 (en) * 2008-04-18 2012-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2012173654A2 (en) * 2011-06-15 2012-12-20 Power Gold LLC Flexible circuit assembly and method thereof
US8879276B2 (en) 2011-06-15 2014-11-04 Power Gold LLC Flexible circuit assembly and method thereof
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
WO2014121300A2 (en) * 2013-02-04 2014-08-07 American Semiconductor, Inc. Photonic data transfer assembly
US20140264938A1 (en) * 2013-03-14 2014-09-18 Douglas R. Hackler, Sr. Flexible Interconnect
US10102697B2 (en) * 2015-10-31 2018-10-16 Disney Enterprises, Inc. High-Q and over-coupled near-field RFID reader antenna for improved tag read range
US10542619B2 (en) * 2017-12-12 2020-01-21 Eastman Kodak Company Electronic element with embedded information
TWI897003B (zh) * 2023-07-31 2025-09-11 啓碁科技股份有限公司 天線裝置及其形成方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5192716A (en) * 1989-01-25 1993-03-09 Polylithics, Inc. Method of making a extended integration semiconductor structure
US5012236A (en) * 1989-05-26 1991-04-30 Trovan Limited Electromagnetic energy transmission and detection apparatus
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
US5370766A (en) * 1993-08-16 1994-12-06 California Micro Devices Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
JPH07176752A (ja) * 1993-12-17 1995-07-14 Semiconductor Energy Lab Co Ltd 薄膜半導体装置およびその作製方法
JPH07176753A (ja) * 1993-12-17 1995-07-14 Semiconductor Energy Lab Co Ltd 薄膜半導体装置およびその作製方法
DE19601358C2 (de) 1995-01-20 2000-01-27 Fraunhofer Ges Forschung Papier mit integrierter Schaltung
US6342434B1 (en) * 1995-12-04 2002-01-29 Hitachi, Ltd. Methods of processing semiconductor wafer, and producing IC card, and carrier
EP0868706A1 (de) * 1995-12-22 1998-10-07 Sempac SA Verfahren zur herstellung einer chipkarte für kontaktlosen betrieb
JPH08264804A (ja) * 1996-01-20 1996-10-11 Semiconductor Energy Lab Co Ltd 薄膜トランジスタ
KR100330651B1 (ko) * 1997-06-23 2002-03-29 사토 게니치로 Ｉｃ카드용 모듈, ｉｃ카드, 및 ｉｃ카드용 모듈의 제조방법
NL1008929C2 (nl) 1998-04-20 1999-10-21 Vhp Ugchelen Bv Uit papier vervaardigd substraat voorzien van een geïntegreerde schakeling.
JP4062728B2 (ja) * 2002-07-02 2008-03-19 コニカミノルタホールディングス株式会社 Ｉｃカード
CN1711633A (zh) 2002-11-08 2005-12-21 皇家飞利浦电子股份有限公司 柔性装置及其制造方法
JP4566578B2 (ja) * 2003-02-24 2010-10-20 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法
US7554337B2 (en) 2003-05-26 2009-06-30 Nxp B.V. Semiconductor device, method of authentifying and system

Also Published As

Publication number Publication date
JP2007519215A (ja) 2007-07-12
EP1494167A1 (de) 2005-01-05
US20100328028A1 (en) 2010-12-30
US7816774B2 (en) 2010-10-19
CN1816817A (zh) 2006-08-09
TWI354937B (en) 2011-12-21
EP1644874B1 (de) 2006-11-29
WO2005004049A1 (en) 2005-01-13
TW200516505A (en) 2005-05-16
US8105873B2 (en) 2012-01-31
CN100524351C (zh) 2009-08-05
EP1644874A1 (de) 2006-04-12
DE602004003498T2 (de) 2007-10-04
DE602004003498D1 (de) 2007-01-11
US20070108521A1 (en) 2007-05-17

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Legal Events

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