ATE347454T1 - Verfahren zur entfernung organischen materials von trägern - Google Patents

Verfahren zur entfernung organischen materials von trägern

Info

Publication number
ATE347454T1
ATE347454T1 AT99943798T AT99943798T ATE347454T1 AT E347454 T1 ATE347454 T1 AT E347454T1 AT 99943798 T AT99943798 T AT 99943798T AT 99943798 T AT99943798 T AT 99943798T AT E347454 T1 ATE347454 T1 AT E347454T1
Authority
AT
Austria
Prior art keywords
supports
removal
organic material
residues
films
Prior art date
Application number
AT99943798T
Other languages
English (en)
Inventor
Ahmad Waleh
Eric O Levenson
Original Assignee
Best Label Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Best Label Company Inc filed Critical Best Label Company Inc
Application granted granted Critical
Publication of ATE347454T1 publication Critical patent/ATE347454T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/10Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/18Cleaning before device manufacture, i.e. Begin-Of-Line process by combined dry cleaning and wet cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/427Stripping or agents therefor using plasma means only

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Treating Waste Gases (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Liquid Crystal (AREA)
  • Magnetic Heads (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
AT99943798T 1998-08-27 1999-08-20 Verfahren zur entfernung organischen materials von trägern ATE347454T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14144398A 1998-08-27 1998-08-27

Publications (1)

Publication Number Publication Date
ATE347454T1 true ATE347454T1 (de) 2006-12-15

Family

ID=22495715

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99943798T ATE347454T1 (de) 1998-08-27 1999-08-20 Verfahren zur entfernung organischen materials von trägern

Country Status (10)

Country Link
EP (1) EP1123166B1 (de)
JP (1) JP3611196B2 (de)
KR (1) KR100391526B1 (de)
CN (1) CN1234472C (de)
AT (1) ATE347454T1 (de)
CA (1) CA2341548C (de)
DE (1) DE69934326T2 (de)
IL (1) IL141595A0 (de)
MY (1) MY125913A (de)
WO (1) WO2000012231A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3522249B2 (ja) 2000-10-25 2004-04-26 鹿児島日本電気株式会社 有機膜の剥離方法
US6554004B1 (en) 2000-11-07 2003-04-29 Motorola, Inc. Method for removing etch residue resulting from a process for forming a via
US6756187B2 (en) 2002-01-04 2004-06-29 Nec Lcd Technologies, Ltd. Method for removing patterned layer from lower layer through reflow
JP4979941B2 (ja) * 2005-03-30 2012-07-18 Hoya株式会社 マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法
US8034189B2 (en) * 2005-05-02 2011-10-11 Nalco Company Processes for surface cleaning
KR20080051961A (ko) 2006-12-07 2008-06-11 한국전자통신연구원 플렉시블 기판의 세정 방법
JP5151297B2 (ja) * 2007-07-27 2013-02-27 宇部興産株式会社 樹脂フィルムの製造方法、導電層積層樹脂フィルムの製造方法
WO2009017634A2 (en) * 2007-07-31 2009-02-05 Corning Incorporated Cleaning method for duv optical elements to extend their lifetime
KR100912704B1 (ko) * 2008-04-22 2009-08-19 세메스 주식회사 기판 처리 장치 및 그의 포토레지스트 제거 방법
CN104779178B (zh) * 2014-01-13 2018-10-16 中芯国际集成电路制造(上海)有限公司 底部防反射层形成方法
TWI528070B (zh) * 2014-04-18 2016-04-01 遠東科技大學 微波加熱分離液晶玻璃的高分子膜之方法
CN104117501A (zh) * 2014-06-26 2014-10-29 苏州一合光学有限公司 超声波清洗机的槽体布局结构
KR102134261B1 (ko) * 2018-10-25 2020-07-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
TWI811538B (zh) 2019-04-12 2023-08-11 美商英培雅股份有限公司 有機金屬光阻顯影劑組合物及處理方法
CN109898089A (zh) * 2019-04-26 2019-06-18 宁德阿李科技有限公司 一种铝板表面处理方法
KR20220147617A (ko) 2020-03-02 2022-11-03 인프리아 코포레이션 무기 레지스트 패터닝을 위한 공정 환경
JP7186751B2 (ja) * 2020-08-28 2022-12-09 野村マイクロ・サイエンス株式会社 レジスト剥離方法、レジスト剥離装置、及び、前処理方法
CN115846310A (zh) * 2022-12-23 2023-03-28 上海华源磁业股份有限公司 一种磁性铁氧体磁芯表面涂层清理工艺
CN119549476B (zh) * 2024-11-21 2026-02-06 哈尔滨工业大学 一种基于afm热探针扫描技术的非热敏材料微区界面纯净化方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4363673A (en) * 1981-05-22 1982-12-14 The Dow Chemical Company Process for the removal of carbon from solid surfaces
WO1989000895A1 (en) * 1987-07-29 1989-02-09 Purusar Corporation Surface treatment to remove impurities in microrecesses
US5037506A (en) * 1990-09-06 1991-08-06 Subhash Gupta Method of stripping layers of organic materials
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
US5763016A (en) * 1996-12-19 1998-06-09 Anon, Incorporated Method of forming patterns in organic coatings films and layers

Also Published As

Publication number Publication date
MY125913A (en) 2006-08-30
KR20010109267A (ko) 2001-12-08
IL141595A0 (en) 2002-03-10
JP3611196B2 (ja) 2005-01-19
EP1123166B1 (de) 2006-12-06
KR100391526B1 (ko) 2003-07-12
DE69934326T2 (de) 2007-06-21
CA2341548A1 (en) 2000-03-09
CN1359316A (zh) 2002-07-17
EP1123166A4 (de) 2003-08-06
CN1234472C (zh) 2006-01-04
WO2000012231A1 (en) 2000-03-09
CA2341548C (en) 2006-12-19
JP2002523906A (ja) 2002-07-30
EP1123166A1 (de) 2001-08-16
DE69934326D1 (de) 2007-01-18

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