ATE348504T1 - Einrichtung zur reduzierung des elektromagnetischen rauschens - Google Patents

Einrichtung zur reduzierung des elektromagnetischen rauschens

Info

Publication number
ATE348504T1
ATE348504T1 AT01996068T AT01996068T ATE348504T1 AT E348504 T1 ATE348504 T1 AT E348504T1 AT 01996068 T AT01996068 T AT 01996068T AT 01996068 T AT01996068 T AT 01996068T AT E348504 T1 ATE348504 T1 AT E348504T1
Authority
AT
Austria
Prior art keywords
heatsink
electromagnetic noise
reducing electromagnetic
circuit
signals received
Prior art date
Application number
AT01996068T
Other languages
English (en)
Inventor
Michael Schaffer
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE348504T1 publication Critical patent/ATE348504T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Surgical Instruments (AREA)
  • Vehicle Body Suspensions (AREA)
  • Massaging Devices (AREA)
  • Valve Device For Special Equipments (AREA)
  • Moving Of Heads (AREA)
AT01996068T 2000-11-21 2001-10-31 Einrichtung zur reduzierung des elektromagnetischen rauschens ATE348504T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/718,303 US7656682B1 (en) 2000-11-21 2000-11-21 Electromagnetic noise reduction device

Publications (1)

Publication Number Publication Date
ATE348504T1 true ATE348504T1 (de) 2007-01-15

Family

ID=24885602

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01996068T ATE348504T1 (de) 2000-11-21 2001-10-31 Einrichtung zur reduzierung des elektromagnetischen rauschens

Country Status (7)

Country Link
US (3) US7656682B1 (de)
EP (1) EP1344440B1 (de)
CN (1) CN100342765C (de)
AT (1) ATE348504T1 (de)
AU (1) AU2002227140A1 (de)
DE (1) DE60125234T2 (de)
WO (1) WO2002043308A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7656682B1 (en) * 2000-11-21 2010-02-02 Intel Corporation Electromagnetic noise reduction device
US6944025B2 (en) * 2002-08-20 2005-09-13 Sun Microsystems, Inc. EMI shielding apparatus
US7115817B2 (en) * 2002-09-18 2006-10-03 Sun Microsystems, Inc. Heat sink and electromagnetic interference reduction device
US7164587B1 (en) 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US7145783B2 (en) * 2004-06-07 2006-12-05 Ford Global Technologies, Llc Apparatus reducing radiated emission from electronic modules
CN100388332C (zh) * 2004-10-15 2008-05-14 友达光电股份有限公司 应用于平面显示器的降低电磁干扰的方法与装置
US7660152B2 (en) * 2008-04-30 2010-02-09 International Business Machines Corporation Method and apparatus for implementing self-referencing read operation for PCRAM devices
CN101295924B (zh) * 2008-05-22 2010-06-09 中国人民解放军海军工程大学 消除互感耦合电磁干扰的方法和装置
CN102721691A (zh) * 2011-04-08 2012-10-10 南京分析仪器厂有限公司 一种磁力机械式氧分析器用减波电路
US9538693B2 (en) * 2013-03-15 2017-01-03 A.K. Stamping Company, Inc. Aluminum EMI / RF shield
US20150336463A1 (en) * 2014-05-21 2015-11-26 Delphi Technologies, Inc. Active electromagnetic interference mitigation system and method
US10542644B2 (en) 2016-12-14 2020-01-21 A.K. Stamping Company, Inc. Two-piece solderable shield
US10791656B1 (en) * 2019-11-01 2020-09-29 Advanced Fusion Systems Llc Method and device for separating high level electromagnetic disturbances from microwave signals

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JPS58214256A (ja) 1982-06-07 1983-12-13 Fujitsu Ltd 電子ビ−ム照射装置
US4933605A (en) * 1987-06-12 1990-06-12 Etta Industries, Inc. Fluorescent dimming ballast utilizing a resonant sine wave power converter
US5023525A (en) * 1990-04-03 1991-06-11 Megascan Technology, Inc. Magnetic deflection circuit with stabilized retrace
JP2663098B2 (ja) * 1993-10-25 1997-10-15 株式会社三社電機製作所 消耗電極式直流アーク溶接機
JP2944405B2 (ja) 1993-12-29 1999-09-06 日本電気株式会社 半導体素子の冷却構造および電磁遮蔽構造
US5703416A (en) * 1996-02-23 1997-12-30 Microchip Technology Incorporated Electromagnetic compatibility for integrated circuit pins and internal nodes
US5638895A (en) 1996-03-25 1997-06-17 Dodson; Douglas A. Twin fan cooling device
DE19718649A1 (de) 1997-05-02 1998-11-05 Peter Heiland Vorrichtung und Verfahren zur aktiven Kompensation magnetischer und elektromagnetischer Störfelder
US6134505A (en) * 1997-05-21 2000-10-17 Lucent Technologies Inc. Testing analog circuits using sigma-delta modulators
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US6243680B1 (en) * 1998-06-15 2001-06-05 Nortel Networks Limited Method and apparatus for obtaining a transcription of phrases through text and spoken utterances
DE10019696B4 (de) 1999-04-22 2007-06-06 International Rectifier Corp., El Segundo Schaltung zur Verringerung von Störstrahlung in Motorspeiseschaltungsanwendungen
US6208516B1 (en) 1999-05-11 2001-03-27 Apple Computer, Inc. Electromagnetic interference shield and gap filler for a circuit board
US6219239B1 (en) * 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly
TW448711B (en) 1999-07-22 2001-08-01 Foxconn Prec Components Co Ltd Heat dissipation device
US6798061B2 (en) * 1999-11-15 2004-09-28 Koninklijke Philips Electronics N.V. Multiple semiconductor chip (multi-chip) module for use in power applications
CN1259673A (zh) * 2000-01-25 2000-07-12 北京大学 抵消电磁信号测量中外界周期性干扰的方法
JP3496633B2 (ja) * 2000-10-05 2004-02-16 日本電気株式会社 ヒートシンク及びこれを用いた電源ユニット
US7656682B1 (en) 2000-11-21 2010-02-02 Intel Corporation Electromagnetic noise reduction device
US7277057B2 (en) 2001-10-23 2007-10-02 Intel Corporation Providing integrated chassis antenna for processor-based devices

Also Published As

Publication number Publication date
WO2002043308A2 (en) 2002-05-30
WO2002043308A3 (en) 2003-03-13
AU2002227140A1 (en) 2002-06-03
CN100342765C (zh) 2007-10-10
HK1058285A1 (en) 2004-05-07
EP1344440A2 (de) 2003-09-17
US7656682B1 (en) 2010-02-02
US6819572B2 (en) 2004-11-16
CN1481659A (zh) 2004-03-10
US20030151906A1 (en) 2003-08-14
US7315459B2 (en) 2008-01-01
US20050041358A1 (en) 2005-02-24
DE60125234D1 (de) 2007-01-25
DE60125234T2 (de) 2007-11-08
EP1344440B1 (de) 2006-12-13

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Legal Events

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