ATE349705T1 - Anisotrope leitfähige folie und impedanzmesssonde - Google Patents

Anisotrope leitfähige folie und impedanzmesssonde

Info

Publication number
ATE349705T1
ATE349705T1 AT03791286T AT03791286T ATE349705T1 AT E349705 T1 ATE349705 T1 AT E349705T1 AT 03791286 T AT03791286 T AT 03791286T AT 03791286 T AT03791286 T AT 03791286T AT E349705 T1 ATE349705 T1 AT E349705T1
Authority
AT
Austria
Prior art keywords
frequency region
sheet
ghz
impedance measurement
impedance
Prior art date
Application number
AT03791286T
Other languages
English (en)
Inventor
Daisuke Yamada
Kiyoshi Kimura
Naoshi Yasuda
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of ATE349705T1 publication Critical patent/ATE349705T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Insulated Conductors (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT03791286T 2002-08-27 2003-08-26 Anisotrope leitfähige folie und impedanzmesssonde ATE349705T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002247757 2002-08-27

Publications (1)

Publication Number Publication Date
ATE349705T1 true ATE349705T1 (de) 2007-01-15

Family

ID=31972483

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03791286T ATE349705T1 (de) 2002-08-27 2003-08-26 Anisotrope leitfähige folie und impedanzmesssonde

Country Status (9)

Country Link
US (1) US7071722B2 (de)
EP (1) EP1544625B1 (de)
KR (1) KR100892196B1 (de)
CN (1) CN1685240A (de)
AT (1) ATE349705T1 (de)
AU (1) AU2003257535A1 (de)
DE (1) DE60310739T2 (de)
TW (1) TWI248517B (de)
WO (1) WO2004021018A1 (de)

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DE60031436T2 (de) 1999-08-25 2007-08-30 Hitachi Chemical Co., Ltd. Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
TWI237120B (en) * 2002-10-09 2005-08-01 Advanced Semiconductor Eng Impedance standard substrate and method for calibrating vector network analyzer
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
EP1686655A4 (de) * 2003-11-17 2008-02-13 Jsr Corp Anisotropes leitfähiges blatt, herstellungsverfahren dafür und produkt damit
CN1894589A (zh) * 2003-12-18 2007-01-10 Jsr株式会社 各向异性导电性连接器和电路装置的检查方法
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US7595790B2 (en) * 2005-01-31 2009-09-29 Panasonic Corporation Pressure sensitive conductive sheet, method of manufacturing the same, and touch panel using the same
US7323887B2 (en) * 2005-04-01 2008-01-29 Rosemount Analytical Inc. Conductivity sensor and manufacturing method therefor
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (de) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Breitbandige aktiv-passiv-differenzsignalsonde
US7235978B2 (en) * 2005-09-07 2007-06-26 Matsushita Electric Industrial Co., Ltd. Device for measuring impedance of electronic component
DE112007001399T5 (de) * 2006-06-09 2009-05-07 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
WO2008150398A1 (en) * 2007-05-29 2008-12-11 Rosemount Analytical, Inc. Multilayer conductivity sensor4
US7785494B2 (en) * 2007-08-03 2010-08-31 Teamchem Company Anisotropic conductive material
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7816932B2 (en) * 2008-02-21 2010-10-19 Teradyne, Inc. Test system with high frequency interposer
JP2011513755A (ja) * 2008-03-07 2011-04-28 カリフォルニア インスティテュート オブ テクノロジー 磁性粒子検出を基本とする実効インダクタンスの変化
CN101576571B (zh) * 2008-05-06 2013-04-10 深圳麦逊电子有限公司 Pcb测试机用密度转换装置
JP5236354B2 (ja) * 2008-05-20 2013-07-17 モレックス インコーポレイテド 電気コネクタ
US9599591B2 (en) 2009-03-06 2017-03-21 California Institute Of Technology Low cost, portable sensor for molecular assays
US20100252783A1 (en) * 2009-04-07 2010-10-07 Syh-Tau Yeh Ambient-curable anisotropic conductive adhesive
US8822843B2 (en) * 2011-03-07 2014-09-02 Nokia Corporation Apparatus and associated methods
CN103969294B (zh) * 2013-01-25 2016-06-01 泰科电子(上海)有限公司 硅油检测器、电力终端组件和硅油检测器的使用方法
JP6782884B2 (ja) * 2015-02-26 2020-11-11 積水ポリマテック株式会社 弾性コネクタ
KR102390960B1 (ko) * 2015-06-05 2022-04-27 삼성디스플레이 주식회사 표시 장치
DE102017100986A1 (de) * 2017-01-19 2018-07-19 Yazaki Systems Technologies Gmbh Anordnung und Verfahren zur Herstellung solch einer Anordnung
CN116189963A (zh) * 2018-06-25 2023-05-30 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体
KR102093860B1 (ko) * 2018-10-18 2020-03-26 주식회사 아이에스시 검사용 커넥터 및 검사용 커넥터의 제조방법
CN115706200A (zh) * 2021-08-17 2023-02-17 重庆康佳光电技术研究院有限公司 导电粒子、导电胶、电路板组件及芯片转移方法
CN115372703B (zh) * 2022-07-28 2025-07-25 深圳市氢瑞燃料电池科技有限公司 一种测量片状堆叠材料电阻分布的装置
KR102784459B1 (ko) * 2023-08-07 2025-03-21 주식회사 아이에스시 전기 접속용 커넥터 및 커넥터 조립체, 및 전기 접속용 커넥터의 제조 방법
CN119395519B (zh) * 2025-01-03 2025-04-29 麦峤里(上海)半导体科技有限责任公司 四探针测量仪、四探针测量系统及四探针测量仪测量待测硅片的方法

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JP3675301B2 (ja) * 2000-05-17 2005-07-27 Ｊｓｒ株式会社 異方導電性シート
US6720787B2 (en) * 2000-09-25 2004-04-13 Jsr Corporation Anisotropically conductive sheet, production process thereof and applied product thereof
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Also Published As

Publication number Publication date
US7071722B2 (en) 2006-07-04
WO2004021018A1 (ja) 2004-03-11
US20060006884A1 (en) 2006-01-12
DE60310739T2 (de) 2007-10-11
DE60310739D1 (de) 2007-02-08
AU2003257535A1 (en) 2004-03-19
KR20050059084A (ko) 2005-06-17
CN1685240A (zh) 2005-10-19
EP1544625B1 (de) 2006-12-27
TWI248517B (en) 2006-02-01
EP1544625A4 (de) 2005-10-12
TW200405014A (en) 2004-04-01
EP1544625A1 (de) 2005-06-22
KR100892196B1 (ko) 2009-04-07

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