ATE349781T1 - Verfahren zur herstellung einer elektroleitfähigen verbindung - Google Patents

Verfahren zur herstellung einer elektroleitfähigen verbindung

Info

Publication number
ATE349781T1
ATE349781T1 AT01921402T AT01921402T ATE349781T1 AT E349781 T1 ATE349781 T1 AT E349781T1 AT 01921402 T AT01921402 T AT 01921402T AT 01921402 T AT01921402 T AT 01921402T AT E349781 T1 ATE349781 T1 AT E349781T1
Authority
AT
Austria
Prior art keywords
soldering
joint
brazing agent
producing
created
Prior art date
Application number
AT01921402T
Other languages
English (en)
Inventor
Veikko Polvi
Original Assignee
Outokumpu Technology Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Technology Oyj filed Critical Outokumpu Technology Oyj
Application granted granted Critical
Publication of ATE349781T1 publication Critical patent/ATE349781T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/26—Railway- or like rails
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Cable Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Electroplating Methods And Accessories (AREA)
AT01921402T 2000-03-21 2001-03-21 Verfahren zur herstellung einer elektroleitfähigen verbindung ATE349781T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20000657A FI108376B (fi) 2000-03-21 2000-03-21 Menetelmõ sõhk÷õjohtavan liitoksen muodostamiseksi

Publications (1)

Publication Number Publication Date
ATE349781T1 true ATE349781T1 (de) 2007-01-15

Family

ID=8557990

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01921402T ATE349781T1 (de) 2000-03-21 2001-03-21 Verfahren zur herstellung einer elektroleitfähigen verbindung

Country Status (17)

Country Link
US (1) US6772936B2 (de)
EP (1) EP1266430B1 (de)
JP (1) JP2003527971A (de)
KR (1) KR100734189B1 (de)
CN (1) CN1196232C (de)
AT (1) ATE349781T1 (de)
AU (2) AU4839801A (de)
BG (1) BG65249B1 (de)
BR (1) BR0109307A (de)
CA (1) CA2403864C (de)
DE (1) DE60125521T2 (de)
EA (1) EA004489B1 (de)
FI (1) FI108376B (de)
MX (1) MXPA02009127A (de)
PL (1) PL202272B1 (de)
WO (1) WO2001071852A1 (de)
ZA (1) ZA200207286B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080217042A1 (en) * 2007-03-05 2008-09-11 Judson Ward M Method for making rail bonds
US20090004500A1 (en) * 2007-06-26 2009-01-01 Daewoong Suh Multilayer preform for fast transient liquid phase bonding
DE102008054415A1 (de) * 2008-12-09 2010-06-10 Robert Bosch Gmbh Anordnung zweier Substrate mit einer SLID-Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung
US8348139B2 (en) * 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform
JP5643029B2 (ja) 2010-08-30 2014-12-17 矢崎総業株式会社 電線端部の接合方法
CN102489807A (zh) * 2011-11-28 2012-06-13 苏州工业园区隆盛电器成套设备制造有限公司 一种轨道车辆用变压器的铜铜焊接工艺
CN102489871A (zh) * 2011-12-05 2012-06-13 贵研铂业股份有限公司 一种铜及铜合金的焊接方法
JP6075465B2 (ja) 2014-01-07 2017-02-08 株式会社村田製作所 補修方法および補修材
US9937575B2 (en) * 2015-02-05 2018-04-10 United Technologies Corporation Brazed joints and methods of forming brazed joints
CN105834541A (zh) * 2016-06-04 2016-08-10 北京工业大学 一种低温连接高温使用Cu/Sn/Cu钎焊界面的制备方法及结构
CN108247238A (zh) * 2017-12-11 2018-07-06 安徽宝辰机电设备科技有限公司 一种延长使用寿命紫铜用焊接剂及其使用方法
DE102018217612A1 (de) * 2018-10-15 2020-04-16 Siemens Aktiengesellschaft Verfahren zur elektrischen Kontaktierung eines supraleitenden Bandleiters
DE102020105154A1 (de) 2020-02-27 2021-09-02 Bayerische Motoren Werke Aktiengesellschaft Verbindungsanordnung sowie Verfahren zum Herstellen einer Verbindungsanordnung
CN115041913B (zh) * 2022-06-01 2024-04-30 中国社会科学院考古研究所 一种基于热分解还原的出土银器保护修复方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
US4497430A (en) * 1982-09-20 1985-02-05 Allied Corporation Brazing method using homogeneous low melting point copper based alloys
US4678720A (en) * 1985-01-04 1987-07-07 Gte Laboratories Incorporated Silver-copper-titanium brazing alloy
DE3930859C2 (de) * 1988-09-20 1997-04-30 Schulz Harder Juergen Verfahren zum Verlöten wenigstens zweier Elemente
EP0380200A1 (de) * 1989-01-11 1990-08-01 Sumitomo Special Metals Co., Ltd. Verbundfolien zum Hartlöten
DE19638209A1 (de) * 1996-09-19 1998-03-26 Bosch Gmbh Robert Hochschmelzende elektrisch leitende Verbindung und Verfahren zu deren Herstellung
JP3688429B2 (ja) * 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
US6047876A (en) * 1997-09-12 2000-04-11 Materials Resources International Process of using an active solder alloy
JP3335896B2 (ja) * 1997-12-26 2002-10-21 株式会社東芝 ハンダ材及びハンダ材の製造方法
DE60041568D1 (de) * 1999-09-01 2009-04-02 Kaneka Corp Dünnschichtsolarzellenmodul und entsprechendes Herstellungsverfahren
FI114691B (fi) * 2000-02-23 2004-12-15 Outokumpu Oy Menetelmä kuparin ja ruostumattoman teräksen välisen liitoksen muodostamiseksi
FI109233B (fi) * 2000-02-23 2002-06-14 Outokumpu Oy Jäähdytyselementti ja menetelmä jäähdytyselementin valmistamiseksi

Also Published As

Publication number Publication date
EA004489B1 (ru) 2004-04-29
EP1266430A1 (de) 2002-12-18
MXPA02009127A (es) 2004-08-12
US20030038165A1 (en) 2003-02-27
DE60125521D1 (de) 2007-02-08
US6772936B2 (en) 2004-08-10
CA2403864A1 (en) 2001-09-27
FI108376B (fi) 2002-01-15
EP1266430B1 (de) 2006-12-27
PL202272B1 (pl) 2009-06-30
ZA200207286B (en) 2003-05-06
JP2003527971A (ja) 2003-09-24
KR100734189B1 (ko) 2007-07-02
DE60125521T2 (de) 2007-07-05
BG107123A (en) 2003-05-30
CA2403864C (en) 2010-06-08
EA200200994A1 (ru) 2003-04-24
AU2001248398B2 (en) 2004-07-01
CN1196232C (zh) 2005-04-06
BR0109307A (pt) 2002-12-17
CN1423848A (zh) 2003-06-11
PL357723A1 (en) 2004-07-26
WO2001071852A1 (en) 2001-09-27
AU4839801A (en) 2001-10-03
BG65249B1 (bg) 2007-09-28
KR20020084231A (ko) 2002-11-04
FI20000657A0 (fi) 2000-03-21
FI20000657L (fi) 2001-09-22

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Legal Events

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