ATE355597T1 - Kondensator und verfahren zu seiner herstellung - Google Patents

Kondensator und verfahren zu seiner herstellung

Info

Publication number
ATE355597T1
ATE355597T1 AT04028749T AT04028749T ATE355597T1 AT E355597 T1 ATE355597 T1 AT E355597T1 AT 04028749 T AT04028749 T AT 04028749T AT 04028749 T AT04028749 T AT 04028749T AT E355597 T1 ATE355597 T1 AT E355597T1
Authority
AT
Austria
Prior art keywords
laminate
thickness
ceramic layer
ceramic
capacitor
Prior art date
Application number
AT04028749T
Other languages
English (en)
Inventor
Kazuhiro Hayashi
Akifumi Tosa
Motohiko Sato
Jun Otsuka
Manabu Sato
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Application granted granted Critical
Publication of ATE355597T1 publication Critical patent/ATE355597T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
AT04028749T 2003-12-05 2004-12-03 Kondensator und verfahren zu seiner herstellung ATE355597T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003407327 2003-12-05

Publications (1)

Publication Number Publication Date
ATE355597T1 true ATE355597T1 (de) 2006-03-15

Family

ID=34464022

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04028749T ATE355597T1 (de) 2003-12-05 2004-12-03 Kondensator und verfahren zu seiner herstellung

Country Status (5)

Country Link
US (2) US7072169B2 (de)
EP (1) EP1538639B1 (de)
CN (1) CN100580829C (de)
AT (1) ATE355597T1 (de)
DE (1) DE602004004983T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217565A1 (de) * 2002-04-19 2003-11-13 Infineon Technologies Ag Halbleiterbauelement mit integrierter gitterförmiger Kapazitätsstruktur
EP1538640B1 (de) * 2003-12-05 2016-11-16 NGK Spark Plug Co., Ltd. Kondensator und Verfahren zu seiner Herstellung
US7649748B2 (en) * 2005-06-15 2010-01-19 Ibiden Co., Ltd. Multilayer printed wiring board
JP4854345B2 (ja) * 2006-03-16 2012-01-18 富士通株式会社 コンデンサシート及び電子回路基板
JP4844487B2 (ja) * 2006-08-09 2011-12-28 株式会社村田製作所 積層コンデンサ、回路基板、回路モジュール及び積層コンデンサの製造方法
WO2008018870A1 (en) * 2006-08-09 2008-02-14 Geomat Insights, Llc Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
WO2008112658A1 (en) * 2007-03-10 2008-09-18 Sanmina-Sci Corporation Embedded capacitive stack
US7911802B2 (en) * 2007-04-06 2011-03-22 Ibiden Co., Ltd. Interposer, a method for manufacturing the same and an electronic circuit package
US9627312B2 (en) * 2011-10-01 2017-04-18 Intel Corporation On-chip capacitors and methods of assembling same
WO2013116853A1 (en) * 2012-02-03 2013-08-08 University Of Washington Through Its Center For Commercialization Methods and devices for generating electricity from a fuel and an oxidant using a capacitor
US20130215586A1 (en) * 2012-02-16 2013-08-22 Ibiden Co., Ltd. Wiring substrate
US9293521B2 (en) * 2012-03-02 2016-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Concentric capacitor structure
US9159718B2 (en) * 2013-03-08 2015-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Switched capacitor structure
KR101309326B1 (ko) 2012-05-30 2013-09-16 삼성전기주식회사 적층 칩 전자부품, 그 실장 기판 및 포장체
KR101548813B1 (ko) * 2013-11-06 2015-08-31 삼성전기주식회사 적층 세라믹 커패시터
JP2016162904A (ja) * 2015-03-03 2016-09-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
KR102620521B1 (ko) * 2019-07-05 2024-01-03 삼성전기주식회사 적층 세라믹 커패시터
CN110323061B (zh) * 2019-07-10 2024-05-31 南方科技大学 具有多种烧制模式的三维模组
US10984957B1 (en) * 2019-12-03 2021-04-20 International Business Machines Corporation Printed circuit board embedded capacitor
US11450484B2 (en) * 2019-12-27 2022-09-20 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328530A (en) * 1980-06-30 1982-05-04 International Business Machines Corporation Multiple layer, ceramic carrier for high switching speed VLSI chips
MY120414A (en) * 1995-10-03 2005-10-31 Tdk Corp Multilayer ceramic capacitor
JPH10261546A (ja) * 1997-03-19 1998-09-29 Murata Mfg Co Ltd 積層コンデンサ
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
JPH11204372A (ja) 1997-11-14 1999-07-30 Murata Mfg Co Ltd 積層コンデンサ
US6034864A (en) 1997-11-14 2000-03-07 Murata Manufacturing Co., Ltd. Multilayer capacitor
US6549395B1 (en) 1997-11-14 2003-04-15 Murata Manufacturing Co., Ltd Multilayer capacitor
US6678927B1 (en) * 1997-11-24 2004-01-20 Avx Corporation Miniature surface mount capacitor and method of making same
JP3476127B2 (ja) * 1999-05-10 2003-12-10 株式会社村田製作所 積層コンデンサ
JP2001185442A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板
US6346743B1 (en) * 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
JP2002359141A (ja) 2001-05-31 2002-12-13 Ngk Spark Plug Co Ltd 積層電子部品の製造方法
JP2002359149A (ja) * 2001-05-31 2002-12-13 Ngk Spark Plug Co Ltd 積層電子部品の製造方法
JP2003068571A (ja) * 2001-08-27 2003-03-07 Nec Corp 可変コンデンサおよび可変インダクタ並びにそれらを備えた高周波回路モジュール
JP2003158030A (ja) 2001-11-20 2003-05-30 Ngk Spark Plug Co Ltd 積層電子部品の製法
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
JP4548571B2 (ja) * 2002-10-08 2010-09-22 日本特殊陶業株式会社 積層コンデンサの製造方法
JP4458812B2 (ja) 2002-10-30 2010-04-28 京セラ株式会社 コンデンサ、コンデンサの製造方法、配線基板、デカップリング回路及び高周波回路

Also Published As

Publication number Publication date
US7072169B2 (en) 2006-07-04
CN100580829C (zh) 2010-01-13
EP1538639B1 (de) 2007-02-28
US20060245142A1 (en) 2006-11-02
US20050122662A1 (en) 2005-06-09
CN1624829A (zh) 2005-06-08
EP1538639A2 (de) 2005-06-08
EP1538639A3 (de) 2005-12-14
US7233480B2 (en) 2007-06-19
DE602004004983D1 (de) 2007-04-12
DE602004004983T2 (de) 2007-10-31

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Legal Events

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