ATE355934T1 - Projizierter kardanischer antriebspunkt - Google Patents

Projizierter kardanischer antriebspunkt

Info

Publication number
ATE355934T1
ATE355934T1 AT01952962T AT01952962T ATE355934T1 AT E355934 T1 ATE355934 T1 AT E355934T1 AT 01952962 T AT01952962 T AT 01952962T AT 01952962 T AT01952962 T AT 01952962T AT E355934 T1 ATE355934 T1 AT E355934T1
Authority
AT
Austria
Prior art keywords
projected
spindle
wafer carrier
spherical surface
drive point
Prior art date
Application number
AT01952962T
Other languages
English (en)
Inventor
David G Halley
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE355934T1 publication Critical patent/ATE355934T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Switches With Compound Operations (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Lubrication Of Internal Combustion Engines (AREA)
AT01952962T 2000-07-01 2001-06-29 Projizierter kardanischer antriebspunkt ATE355934T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21566600P 2000-07-01 2000-07-01

Publications (1)

Publication Number Publication Date
ATE355934T1 true ATE355934T1 (de) 2007-03-15

Family

ID=22803881

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01952962T ATE355934T1 (de) 2000-07-01 2001-06-29 Projizierter kardanischer antriebspunkt

Country Status (10)

Country Link
US (1) US6808443B2 (de)
EP (1) EP1365888B1 (de)
JP (1) JP2004502311A (de)
KR (1) KR20030016307A (de)
CN (1) CN1258432C (de)
AT (1) ATE355934T1 (de)
AU (1) AU2001273665A1 (de)
DE (1) DE60127181T2 (de)
TW (1) TW491746B (de)
WO (1) WO2002002276A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4700996B2 (ja) * 2005-04-19 2011-06-15 東芝機械株式会社 転写装置
US7648354B2 (en) * 2005-04-28 2010-01-19 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
JP4729338B2 (ja) * 2005-05-10 2011-07-20 東芝機械株式会社 転写装置
JP4701008B2 (ja) * 2005-05-25 2011-06-15 東芝機械株式会社 ジンバル機構を備えた転写装置
KR101039255B1 (ko) * 2009-07-07 2011-06-07 (주)아산테크 보수 및 관리가 용이한 대구경의 관로시스템
US8545290B2 (en) * 2010-12-08 2013-10-01 Edmond Arzuman Abrahamians Wafer polishing apparatus and method
CN103363243B (zh) * 2013-08-07 2015-07-22 重庆望江工业有限公司 一种阴阳线内管修整装置
CN115401568B (zh) * 2022-09-22 2023-10-20 安庆帝新机电设备有限公司 一种浮封环打磨用自动下料装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2526105A (en) * 1947-01-13 1950-10-17 James B Adams Universal joint for hand tools
US3107505A (en) * 1961-02-15 1963-10-22 Hague Mfg Company Universal joint
EP0119989A1 (de) * 1983-03-18 1984-09-26 Karl Hufnagl Gelenk zur Übertragung eines Drehmoments
US4636180A (en) * 1984-08-23 1987-01-13 Allied Corporation Universal joint with stationary seats
US5342067A (en) * 1993-08-09 1994-08-30 Corning Incorporated Method and apparatus for machining substrate plates for magnetic memory disks
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
US5571044A (en) * 1994-10-11 1996-11-05 Ontrak Systems, Inc. Wafer holder for semiconductor wafer polishing machine
US5830806A (en) * 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
US6425812B1 (en) * 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
SG90746A1 (en) * 1999-10-15 2002-08-20 Ebara Corp Apparatus and method for polishing workpiece

Also Published As

Publication number Publication date
EP1365888A2 (de) 2003-12-03
WO2002002276A2 (en) 2002-01-10
TW491746B (en) 2002-06-21
EP1365888B1 (de) 2007-03-07
WO2002002276A3 (en) 2003-09-25
JP2004502311A (ja) 2004-01-22
CN1258432C (zh) 2006-06-07
US6808443B2 (en) 2004-10-26
DE60127181T2 (de) 2007-11-15
KR20030016307A (ko) 2003-02-26
AU2001273665A1 (en) 2002-01-14
DE60127181D1 (de) 2007-04-19
US20020002031A1 (en) 2002-01-03
CN1533316A (zh) 2004-09-29

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