ATE359692T1 - Leiterplattenanordnung - Google Patents

Leiterplattenanordnung

Info

Publication number
ATE359692T1
ATE359692T1 AT00958959T AT00958959T ATE359692T1 AT E359692 T1 ATE359692 T1 AT E359692T1 AT 00958959 T AT00958959 T AT 00958959T AT 00958959 T AT00958959 T AT 00958959T AT E359692 T1 ATE359692 T1 AT E359692T1
Authority
AT
Austria
Prior art keywords
components
heat generating
heat
pcb
heat dissipating
Prior art date
Application number
AT00958959T
Other languages
English (en)
Inventor
George Young
Original Assignee
Commergy Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commergy Technologies Ltd filed Critical Commergy Technologies Ltd
Application granted granted Critical
Publication of ATE359692T1 publication Critical patent/ATE359692T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc-Dc Converters (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT00958959T 1999-09-13 2000-09-13 Leiterplattenanordnung ATE359692T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE990765 1999-09-13
IE991024 1999-12-06

Publications (1)

Publication Number Publication Date
ATE359692T1 true ATE359692T1 (de) 2007-05-15

Family

ID=26320262

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00958959T ATE359692T1 (de) 1999-09-13 2000-09-13 Leiterplattenanordnung

Country Status (9)

Country Link
US (1) US6982876B1 (de)
EP (1) EP1212927B1 (de)
JP (1) JP2003509872A (de)
CN (1) CN1207947C (de)
AT (1) ATE359692T1 (de)
AU (1) AU7036200A (de)
DE (1) DE60034351D1 (de)
IE (1) IE20000731A1 (de)
WO (1) WO2001020955A1 (de)

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DE102005008521A1 (de) 2005-02-24 2006-08-31 OCé PRINTING SYSTEMS GMBH Anordnung und Verfahren zum Kühlen eines Leistungshalbleiters
JP4492454B2 (ja) 2005-06-20 2010-06-30 富士電機システムズ株式会社 パワー半導体モジュール
US8164406B2 (en) * 2006-05-26 2012-04-24 Delta Electronics, Inc. Transformer
US20080158834A1 (en) * 2006-12-28 2008-07-03 Tomohide Ogura Module
FR2956277A1 (fr) * 2010-02-09 2011-08-12 Peugeot Citroen Automobiles Sa Circuit imprime a elements de connexion couples thermiquement par l'arriere par un joint thermo-conducteur
US8310831B2 (en) * 2010-05-19 2012-11-13 Hamilton Sundstrand Corporation Thermal packaging of a motor controller for an auxiliary power unit
US9320131B2 (en) * 2010-09-17 2016-04-19 Intervention Technology Pty Ltd Power supply device and components thereof
KR101156903B1 (ko) * 2010-10-28 2012-06-21 삼성전기주식회사 전력변환모듈의 방열장치
US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
DE102011056265A1 (de) 2011-12-12 2013-06-13 Weidmüller Interface GmbH & Co. KG Steckvorrichtung zur kontaktlosen induktiven Energieübertragung und Betriebsverfahren für eine solche Steckvorrichtung
US20150116064A1 (en) * 2013-10-28 2015-04-30 Ford Global Technologies, Llc Inductor housing
JP6310791B2 (ja) * 2014-06-25 2018-04-11 矢崎総業株式会社 スイッチボックス
JP2016071269A (ja) * 2014-09-30 2016-05-09 株式会社東芝 電子機器、及びシステム
KR20160050950A (ko) * 2014-10-31 2016-05-11 현대모비스 주식회사 인덕터 방열 장치를 구비하는 dc-dc 컨버터
CN106160412B (zh) * 2015-04-10 2019-09-17 台达电子企业管理（上海）有限公司 电源模块与应用该电源模块的能量转换装置
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
CN204859861U (zh) * 2015-07-27 2015-12-09 台达电子企业管理（上海）有限公司 一种模块电源
US10034379B2 (en) * 2016-01-29 2018-07-24 Cyntec Co., Ltd. Stacked electronic structure
US10785871B1 (en) 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US11336167B1 (en) 2016-04-05 2022-05-17 Vicor Corporation Delivering power to semiconductor loads
BE1026201B1 (de) * 2018-04-11 2019-11-12 Phoenix Contact Gmbh & Co. Kg Leiterplattenanordnung
EP3731390B1 (de) * 2018-05-18 2023-11-08 Telefonaktiebolaget LM Ericsson (publ) Stromversorgungsvorrichtung und leiterplattenvorrichtung damit
US11158451B2 (en) * 2018-10-09 2021-10-26 Delta Electronics, Inc. Power module
CA3203037A1 (en) * 2020-12-31 2022-07-07 Ariel Sverdlik Cooling of ultrasound energizers mounted on printed circuit boards
DE102021106594A1 (de) 2021-03-18 2022-09-22 Fachhochschule Kiel Niederinduktive hochintegrierte schaltungsanordnung
US20220396154A1 (en) * 2021-06-14 2022-12-15 Panasonic Intellectual Property Management Co., Ltd. Vehicle mounted electric power converter
US12376239B2 (en) 2023-03-06 2025-07-29 e-con Systems India Private Limited Modular printed circuit board assembly and method to operate the same

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JPS5833813A (ja) * 1981-08-25 1983-02-28 Ricoh Co Ltd 電源トランスユニツト
US4712160A (en) * 1985-07-02 1987-12-08 Matsushita Electric Industrial Co., Ltd. Power supply module
DE3527208A1 (de) 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
DE3716102A1 (de) * 1987-05-14 1988-11-24 Bosch Gmbh Robert Elektrisches schalt- und steuergeraet
EP0413848A1 (de) 1989-08-25 1991-02-27 Siemens Aktiengesellschaft Adapterplatte für elektrische Spulen
US5019941A (en) * 1989-11-03 1991-05-28 Motorola, Inc. Electronic assembly having enhanced heat dissipating capabilities
US5161098A (en) 1991-09-09 1992-11-03 Power Integrations, Inc. High frequency switched mode converter
JP2772184B2 (ja) * 1991-11-07 1998-07-02 株式会社東芝 半導体装置
JPH06350220A (ja) * 1993-06-08 1994-12-22 Tokyo Electric Co Ltd 電子機器の回路基板
US5734555A (en) * 1994-03-30 1998-03-31 Intel Corporation Shared socket multi-chip module and/or piggyback pin grid array package
JPH07297048A (ja) * 1994-04-27 1995-11-10 Kyocera Corp コイルコア部材を有する回路基板
JPH08273944A (ja) * 1995-03-31 1996-10-18 Yokogawa Electric Corp 平面型トランス
US5726858A (en) * 1996-05-23 1998-03-10 Compaq Computer Corporation Shielded electrical component heat sink apparatus
JPH10173298A (ja) * 1996-12-10 1998-06-26 Murata Mfg Co Ltd 電子機器
US5835350A (en) * 1996-12-23 1998-11-10 Lucent Technologies Inc. Encapsulated, board-mountable power supply and method of manufacture therefor
DE19704152C2 (de) * 1997-02-04 1998-11-05 Siemens Ag Steuergerät für ein Antiblockiersystem
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WO1998054735A1 (de) * 1997-05-27 1998-12-03 Melcher Ag Vorrichtung und verfahren zum kühlen einer planarinduktivität
EP0896419A3 (de) 1997-08-04 1999-06-02 Alcatel In einem Magnetkreis eingebauter Stromwandler
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Also Published As

Publication number Publication date
EP1212927B1 (de) 2007-04-11
US6982876B1 (en) 2006-01-03
WO2001020955A1 (en) 2001-03-22
EP1212927A1 (de) 2002-06-12
DE60034351D1 (de) 2007-05-24
CN1387746A (zh) 2002-12-25
CN1207947C (zh) 2005-06-22
JP2003509872A (ja) 2003-03-11
AU7036200A (en) 2001-04-17
IE20000731A1 (en) 2001-07-11

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties