ATE360273T1 - Anordnung und verfahren zum richten eines laserstrahls auf werkstücke - Google Patents
Anordnung und verfahren zum richten eines laserstrahls auf werkstückeInfo
- Publication number
- ATE360273T1 ATE360273T1 AT04256713T AT04256713T ATE360273T1 AT E360273 T1 ATE360273 T1 AT E360273T1 AT 04256713 T AT04256713 T AT 04256713T AT 04256713 T AT04256713 T AT 04256713T AT E360273 T1 ATE360273 T1 AT E360273T1
- Authority
- AT
- Austria
- Prior art keywords
- laser system
- delivery optics
- target delivery
- target
- telescope
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2308—Amplifier arrangements, e.g. MOPA
- H01S3/2325—Multi-pass amplifiers, e.g. regenerative amplifiers
- H01S3/235—Regenerative amplifiers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/10076—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating using optical phase conjugation, e.g. phase conjugate reflection
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51572603P | 2003-10-30 | 2003-10-30 | |
| US10/789,557 US7291805B2 (en) | 2003-10-30 | 2004-02-27 | Target isolation system, high power laser and laser peening method and system using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE360273T1 true ATE360273T1 (de) | 2007-05-15 |
Family
ID=34426331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04256713T ATE360273T1 (de) | 2003-10-30 | 2004-10-29 | Anordnung und verfahren zum richten eines laserstrahls auf werkstücke |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7291805B2 (de) |
| EP (1) | EP1528646B1 (de) |
| AT (1) | ATE360273T1 (de) |
| DE (1) | DE602004005941T2 (de) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4631044B2 (ja) * | 2004-05-26 | 2011-02-16 | 国立大学法人北海道大学 | レーザ加工方法および装置 |
| US7619811B2 (en) * | 2004-10-07 | 2009-11-17 | The United States of America as represented by the Secretary of the Army Pentagon | Zonal lenslet array |
| TW201009525A (en) * | 2008-08-18 | 2010-03-01 | Ind Tech Res Inst | Laser marking method and laser marking system |
| ES2544269T3 (es) * | 2011-09-05 | 2015-08-28 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente |
| EP2564976B1 (de) | 2011-09-05 | 2015-06-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Markierungsvorrichtung mit mindestens einem Gaslaser und einer Kühleinrichtung |
| DK2565994T3 (en) | 2011-09-05 | 2014-03-10 | Alltec Angewandte Laserlicht Technologie Gmbh | Laser device and method for marking an object |
| ES2438751T3 (es) | 2011-09-05 | 2014-01-20 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Dispositivo y procedimiento para marcar un objeto por medio de un rayo láser |
| ES2530070T3 (es) * | 2011-09-05 | 2015-02-26 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación |
| DK2565996T3 (da) | 2011-09-05 | 2014-01-13 | Alltec Angewandte Laserlicht Technologie Gmbh | Laserindretning med en laserenhed og en fluidbeholder til en køleindretning af laserenheden |
| EP2564972B1 (de) * | 2011-09-05 | 2015-08-26 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Markierungsvorrichtung mith mehreren Lasern, Deflektionmitteln und Telescopikmitteln für jeden Laserstrahl |
| DK2564973T3 (en) * | 2011-09-05 | 2015-01-12 | Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung | Marking apparatus having a plurality of lasers and a kombineringsafbøjningsindretning |
| JP2013055283A (ja) * | 2011-09-06 | 2013-03-21 | Fujikura Ltd | 高パワーパルス光発生装置 |
| JP5863974B2 (ja) | 2011-09-29 | 2016-02-17 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィ投影露光装置の投影対物レンズ |
| KR20130039955A (ko) | 2011-10-13 | 2013-04-23 | 현대자동차주식회사 | 용접용 레이저 장치 |
| US9242311B2 (en) | 2012-07-11 | 2016-01-26 | Raytheon Company | Use of sulfur hexafluoride gas to prevent laser induced air breakdown |
| WO2014139543A1 (en) * | 2013-03-13 | 2014-09-18 | Carl Zeiss Smt Gmbh | Microlithographic apparatus |
| US11858065B2 (en) | 2015-01-09 | 2024-01-02 | Lsp Technologies, Inc. | Method and system for use in laser shock peening and laser bond inspection process |
| CA2973382A1 (en) | 2015-01-09 | 2016-07-14 | Lsp Technologies, Inc. | Method and apparatus for use in laser shock peening processes |
| JP6797133B2 (ja) | 2015-05-11 | 2020-12-09 | ウエスチングハウス・エレクトリック・カンパニー・エルエルシー | レーザーピーニングに使用できる送出装置および関連する方法 |
| JP6625914B2 (ja) * | 2016-03-17 | 2019-12-25 | ファナック株式会社 | 機械学習装置、レーザ加工システムおよび機械学習方法 |
| CN107492784B (zh) * | 2017-09-20 | 2019-03-22 | 长春理工大学 | 改善不对称光斑输出的激光器 |
| CN110216372A (zh) * | 2019-05-16 | 2019-09-10 | 广东镭奔激光科技有限公司 | 激光冲击强化的机器人内导光装置 |
| CN114361929B (zh) * | 2021-12-30 | 2024-04-19 | 北京大学 | 一种提高多通激光放大器稳定性的指向性监测系统及方法 |
| DE102023136719A1 (de) * | 2023-12-27 | 2025-07-03 | Precitec Gmbh & Co. Kg | Blende für einen Laserbearbeitungskopf und Laserbearbeitungskopf umfassend die Blende |
| CN119225280B (zh) * | 2024-12-03 | 2025-02-11 | 中国石油大学(华东) | 一种面向产品加工质量的数字孪生控制系统 |
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-
2004
- 2004-02-27 US US10/789,557 patent/US7291805B2/en not_active Expired - Lifetime
- 2004-10-29 EP EP04256713A patent/EP1528646B1/de not_active Expired - Lifetime
- 2004-10-29 AT AT04256713T patent/ATE360273T1/de not_active IP Right Cessation
- 2004-10-29 DE DE602004005941T patent/DE602004005941T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004005941T2 (de) | 2008-01-31 |
| DE602004005941D1 (de) | 2007-05-31 |
| EP1528646A1 (de) | 2005-05-04 |
| US20050092722A1 (en) | 2005-05-05 |
| EP1528646B1 (de) | 2007-04-18 |
| US7291805B2 (en) | 2007-11-06 |
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