ATE360833T1 - Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren - Google Patents

Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren

Info

Publication number
ATE360833T1
ATE360833T1 AT02791901T AT02791901T ATE360833T1 AT E360833 T1 ATE360833 T1 AT E360833T1 AT 02791901 T AT02791901 T AT 02791901T AT 02791901 T AT02791901 T AT 02791901T AT E360833 T1 ATE360833 T1 AT E360833T1
Authority
AT
Austria
Prior art keywords
monolitic
production method
layer arrangement
electronic multi
layer
Prior art date
Application number
AT02791901T
Other languages
English (en)
Inventor
Marc Belleville
Emmanuel Hadji
Bernard Aspar
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE360833T1 publication Critical patent/ATE360833T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12078—Gallium arsenide or alloys (GaAs, GaAlAs, GaAsP, GaInAs)
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12178—Epitaxial growth

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT02791901T 2001-11-15 2002-11-13 Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren ATE360833T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0114784A FR2832224B1 (fr) 2001-11-15 2001-11-15 Dispositif electronique monolithique multicouches et procede de realisation d'un tel dispositif

Publications (1)

Publication Number Publication Date
ATE360833T1 true ATE360833T1 (de) 2007-05-15

Family

ID=8869429

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02791901T ATE360833T1 (de) 2001-11-15 2002-11-13 Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren

Country Status (6)

Country Link
US (1) US20040252931A1 (de)
EP (1) EP1444541B1 (de)
AT (1) ATE360833T1 (de)
DE (1) DE60219815T2 (de)
FR (1) FR2832224B1 (de)
WO (1) WO2003042741A2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
EP1711850A1 (de) * 2004-01-23 2006-10-18 Koninklijke Philips Electronics N.V. Nahtlos integrierter optischer wellenleiter für durch eine halbleiterlichtquelle erzeugtes licht
TW200537143A (en) * 2004-02-11 2005-11-16 Koninkl Philips Electronics Nv Integrated optical wave guide for light generated by a bipolar transistor
US7391801B1 (en) * 2005-11-25 2008-06-24 The United States Of America As Represented By The Secretary Of The Air Force Electrically pumped Group IV semiconductor micro-ring laser
US7608538B2 (en) * 2007-01-05 2009-10-27 International Business Machines Corporation Formation of vertical devices by electroplating
FR2912552B1 (fr) * 2007-02-14 2009-05-22 Soitec Silicon On Insulator Structure multicouche et son procede de fabrication.
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
EP2550683A4 (de) * 2010-03-24 2016-10-05 Sionyx Llc Vorrichtungen mit verstärkter erkennung elektromagnetischer strahlung und entsprechende verfahren
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
WO2011160130A2 (en) 2010-06-18 2011-12-22 Sionyx, Inc High speed photosensitive devices and associated methods
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
JP2014525091A (ja) 2011-07-13 2014-09-25 サイオニクス、インク． 生体撮像装置および関連方法
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
CN104507853B (zh) 2012-07-31 2016-11-23 索泰克公司 形成半导体设备的方法
KR20150130303A (ko) 2013-02-15 2015-11-23 사이오닉스, 아이엔씨. 안티 블루밍 특성 및 관련 방법을 가지는 높은 동적 범위의 cmos 이미지 센서
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
US9002156B2 (en) * 2013-04-29 2015-04-07 International Business Machines Corporation Vertically curved waveguide
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
KR102296915B1 (ko) * 2014-07-30 2021-09-02 삼성디스플레이 주식회사 유기 발광 표시 장치
FR3058830B1 (fr) 2016-11-14 2018-11-30 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation collective d’une pluralite de puces optoelectroniques
CN110703382B (zh) * 2019-01-10 2020-10-09 济南晶正电子科技有限公司 一种高集成度铌酸锂/氮化硅光波导集成结构及其制备方法
US10955614B1 (en) * 2020-01-14 2021-03-23 Globalfoundries U.S. Inc. Optical fiber coupler structure having manufacturing variation-sensitive transmission blocking region
CN111983750B (zh) * 2020-08-28 2022-08-19 济南晶正电子科技有限公司 一种二氧化硅加载条型光波导集成结构及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818072A (en) * 1992-05-12 1998-10-06 North Carolina State University Integrated heterostructure of group II-VI semiconductor materials including epitaxial ohmic contact and method of fabricating same
DE19616932A1 (de) * 1996-04-27 1997-10-30 Bosch Gmbh Robert Optisches, strahlteilendes Bauelement sowie Verfahren zur Herstellung einer Prismenträgerplatte für ein solches Bauelement
US5761350A (en) * 1997-01-22 1998-06-02 Koh; Seungug Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly
DE19720784A1 (de) * 1997-05-17 1998-11-26 Deutsche Telekom Ag Integrierte optische Schaltung
US6195367B1 (en) * 1997-12-31 2001-02-27 Nortel Networks Limited Architectural arrangement for bandwidth management in large central offices
SE513858C2 (sv) * 1998-03-06 2000-11-13 Ericsson Telefon Ab L M Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler
DE19826648B4 (de) * 1998-06-16 2005-07-28 Siemens Ag Schaltungsträger mit einer optischen Schicht und optoelektronisches Bauelement
US6734453B2 (en) * 2000-08-08 2004-05-11 Translucent Photonics, Inc. Devices with optical gain in silicon
US20030035607A1 (en) * 2001-08-15 2003-02-20 Motorola, Inc. Apparatus for effecting conversion between communication signals in a first signal-form and communication signals in a second signal-form and method of manufacture therefor
US7043106B2 (en) * 2002-07-22 2006-05-09 Applied Materials, Inc. Optical ready wafers

Also Published As

Publication number Publication date
FR2832224B1 (fr) 2004-01-16
EP1444541B1 (de) 2007-04-25
DE60219815T2 (de) 2008-01-17
WO2003042741A2 (fr) 2003-05-22
EP1444541A2 (de) 2004-08-11
WO2003042741A3 (fr) 2004-01-22
FR2832224A1 (fr) 2003-05-16
US20040252931A1 (en) 2004-12-16
DE60219815D1 (de) 2007-06-06

Similar Documents

Publication Publication Date Title
ATE360833T1 (de) Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren
TWI265747B (en) Sealing structure for display devices
DE69941937D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren dafür
DE69932023D1 (de) Piezoelektrisches Leuchtelement, elektronische Anzeigevorrichtung und dessen Herstellungsverfahren
FI20050767L (fi) Monikerroksinen langoituslevy ja menetelmä sen valmistamiseksi
DE60135963D1 (de) Mehrschichtelektronikbauteil
EP1542518A4 (de) Leiterplatte für gedruckte verdrahtung, gedruckte leiterplatte und verfahren zu ihrer herstellung
SG116443A1 (en) Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same.
DE69938767D1 (de) Halbleiterbauelement und dessen herstellungsverfahren, bauelementsubstrat, und elektronisches bauelement
EP1199588A4 (de) Optoelektronisches substrat,leiterplatte, und verfahren zur herstellung optoelektronischen substrats
KR970706714A (ko) 프린트 배선판 및 그 제조방법과 전자기기(printed wiring board, method of producing the same and electronic devices)
DE69936493D1 (de) Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung
FR2702595B1 (fr) Structure de câblage multicouche.
DE69835934D1 (de) Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren
GB2365008B (en) Insulating ceramic compact,ceramic multilayer substrate and ceramic electronic device
DE69535391D1 (de) Mehrlagenschaltungssubstrat
DE10295165D2 (de) Molekulares elektronisches Bauelement zum Aufbau nanoelektronischer Schaltungen, molekulare elektronische Baugruppe, elektronische Schaltung und Herstellungsverfahren
FI20020522A0 (fi) Tehonhallintajärjestely
FI20031251L (fi) Menetelmä näytön valmistamiseksi, elektroninen laite ja näyttöelementti
MY128174A (en) Thin film capacitor and thin film electronic component and method for manufacturing the same.
DE69333226D1 (de) Elektronischer schaltkreis im nanobereich und verfahren zu dessen herstellung
ATE341799T1 (de) Datenträger mit transponderspule
WO2002075810A3 (de) Integrierte schaltung mit elektrischen verbindungselementen
EP1173880A4 (de) Mehrschichtige gedruckte leiterplatte und deren herstellungsverfahren
EP0683516A3 (de) Mehrlagenleiterplatten und Multichipmodul-Substrate.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties