ATE360833T1 - Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren - Google Patents

Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren

Info

Publication number
ATE360833T1
ATE360833T1 AT02791901T AT02791901T ATE360833T1 AT E360833 T1 ATE360833 T1 AT E360833T1 AT 02791901 T AT02791901 T AT 02791901T AT 02791901 T AT02791901 T AT 02791901T AT E360833 T1 ATE360833 T1 AT E360833T1
Authority
AT
Austria
Prior art keywords
monolitic
production method
layer arrangement
electronic multi
layer
Prior art date
Application number
AT02791901T
Other languages
English (en)
Inventor
Marc Belleville
Emmanuel Hadji
Bernard Aspar
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE360833T1 publication Critical patent/ATE360833T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12078—Gallium arsenide or alloys (GaAs, GaAlAs, GaAsP, GaInAs)
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12178—Epitaxial growth

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
AT02791901T 2001-11-15 2002-11-13 Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren ATE360833T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0114784A FR2832224B1 (fr) 2001-11-15 2001-11-15 Dispositif electronique monolithique multicouches et procede de realisation d'un tel dispositif

Publications (1)

Publication Number Publication Date
ATE360833T1 true ATE360833T1 (de) 2007-05-15

Family

ID=8869429

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02791901T ATE360833T1 (de) 2001-11-15 2002-11-13 Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren

Country Status (6)

Country Link
US (1) US20040252931A1 (de)
EP (1) EP1444541B1 (de)
AT (1) ATE360833T1 (de)
DE (1) DE60219815T2 (de)
FR (1) FR2832224B1 (de)
WO (1) WO2003042741A2 (de)

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US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
CN1910487A (zh) * 2004-01-23 2007-02-07 皇家飞利浦电子股份有限公司 用于由半导体光源产生的光的无缝整合光波导
TW200537143A (en) * 2004-02-11 2005-11-16 Koninkl Philips Electronics Nv Integrated optical wave guide for light generated by a bipolar transistor
US7391801B1 (en) * 2005-11-25 2008-06-24 The United States Of America As Represented By The Secretary Of The Air Force Electrically pumped Group IV semiconductor micro-ring laser
US7608538B2 (en) * 2007-01-05 2009-10-27 International Business Machines Corporation Formation of vertical devices by electroplating
FR2912552B1 (fr) * 2007-02-14 2009-05-22 Soitec Silicon On Insulator Structure multicouche et son procede de fabrication.
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US20120068289A1 (en) * 2010-03-24 2012-03-22 Sionyx, Inc. Devices Having Enhanced Electromagnetic Radiation Detection and Associated Methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
CN103081128B (zh) 2010-06-18 2016-11-02 西奥尼克斯公司 高速光敏设备及相关方法
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
JP2014525091A (ja) 2011-07-13 2014-09-25 サイオニクス、インク． 生体撮像装置および関連方法
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
US9481566B2 (en) 2012-07-31 2016-11-01 Soitec Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices
WO2014127376A2 (en) 2013-02-15 2014-08-21 Sionyx, Inc. High dynamic range cmos image sensor having anti-blooming properties and associated methods
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
US9002156B2 (en) * 2013-04-29 2015-04-07 International Business Machines Corporation Vertically curved waveguide
WO2014209421A1 (en) 2013-06-29 2014-12-31 Sionyx, Inc. Shallow trench textured regions and associated methods
KR102296915B1 (ko) * 2014-07-30 2021-09-02 삼성디스플레이 주식회사 유기 발광 표시 장치
FR3058830B1 (fr) * 2016-11-14 2018-11-30 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation collective d’une pluralite de puces optoelectroniques
CN110703382B (zh) * 2019-01-10 2020-10-09 济南晶正电子科技有限公司 一种高集成度铌酸锂/氮化硅光波导集成结构及其制备方法
US10955614B1 (en) * 2020-01-14 2021-03-23 Globalfoundries U.S. Inc. Optical fiber coupler structure having manufacturing variation-sensitive transmission blocking region
CN111983750B (zh) * 2020-08-28 2022-08-19 济南晶正电子科技有限公司 一种二氧化硅加载条型光波导集成结构及其制备方法

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US5818072A (en) * 1992-05-12 1998-10-06 North Carolina State University Integrated heterostructure of group II-VI semiconductor materials including epitaxial ohmic contact and method of fabricating same
DE19616932A1 (de) * 1996-04-27 1997-10-30 Bosch Gmbh Robert Optisches, strahlteilendes Bauelement sowie Verfahren zur Herstellung einer Prismenträgerplatte für ein solches Bauelement
US5761350A (en) * 1997-01-22 1998-06-02 Koh; Seungug Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly
DE19720784A1 (de) * 1997-05-17 1998-11-26 Deutsche Telekom Ag Integrierte optische Schaltung
US6195367B1 (en) * 1997-12-31 2001-02-27 Nortel Networks Limited Architectural arrangement for bandwidth management in large central offices
SE513858C2 (sv) * 1998-03-06 2000-11-13 Ericsson Telefon Ab L M Flerskiktsstruktur samt förfarande för att tillverka flerskiktsmoduler
DE19826648B4 (de) * 1998-06-16 2005-07-28 Siemens Ag Schaltungsträger mit einer optischen Schicht und optoelektronisches Bauelement
US6734453B2 (en) * 2000-08-08 2004-05-11 Translucent Photonics, Inc. Devices with optical gain in silicon
US20030035607A1 (en) * 2001-08-15 2003-02-20 Motorola, Inc. Apparatus for effecting conversion between communication signals in a first signal-form and communication signals in a second signal-form and method of manufacture therefor
US7043106B2 (en) * 2002-07-22 2006-05-09 Applied Materials, Inc. Optical ready wafers

Also Published As

Publication number Publication date
EP1444541B1 (de) 2007-04-25
FR2832224A1 (fr) 2003-05-16
DE60219815D1 (de) 2007-06-06
FR2832224B1 (fr) 2004-01-16
WO2003042741A3 (fr) 2004-01-22
DE60219815T2 (de) 2008-01-17
WO2003042741A2 (fr) 2003-05-22
US20040252931A1 (en) 2004-12-16
EP1444541A2 (de) 2004-08-11

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