|
US6985378B2
(en)
|
1998-12-04 |
2006-01-10 |
Axon Technologies Corporation |
Programmable microelectronic device, structure, and system and method of forming the same
|
|
US20030107105A1
(en)
*
|
1999-08-31 |
2003-06-12 |
Kozicki Michael N. |
Programmable chip-to-substrate interconnect structure and device and method of forming same
|
|
US6927411B2
(en)
|
2000-02-11 |
2005-08-09 |
Axon Technologies Corporation |
Programmable structure, an array including the structure, and methods of forming the same
|
|
JP3837993B2
(ja)
|
2000-03-21 |
2006-10-25 |
日本電気株式会社 |
電子素子およびそれを用いた記録方法
|
|
JP4119950B2
(ja)
*
|
2000-09-01 |
2008-07-16 |
独立行政法人科学技術振興機構 |
コンダクタンスの制御が可能な電子素子
|
|
WO2002037500A1
(en)
*
|
2000-10-31 |
2002-05-10 |
The Regents Of The University Of California |
Organic bistable device and organic memory cells
|
|
EP1662575B1
(de)
*
|
2000-11-01 |
2007-10-17 |
Japan Science and Technology Agency |
Ein NOT-Schaltkreis
|
|
US6653193B2
(en)
|
2000-12-08 |
2003-11-25 |
Micron Technology, Inc. |
Resistance variable device
|
|
US6638820B2
(en)
|
2001-02-08 |
2003-10-28 |
Micron Technology, Inc. |
Method of forming chalcogenide comprising devices, method of precluding diffusion of a metal into adjacent chalcogenide material, and chalcogenide comprising devices
|
|
US6727192B2
(en)
|
2001-03-01 |
2004-04-27 |
Micron Technology, Inc. |
Methods of metal doping a chalcogenide material
|
|
US6818481B2
(en)
|
2001-03-07 |
2004-11-16 |
Micron Technology, Inc. |
Method to manufacture a buried electrode PCRAM cell
|
|
US6734455B2
(en)
|
2001-03-15 |
2004-05-11 |
Micron Technology, Inc. |
Agglomeration elimination for metal sputter deposition of chalcogenides
|
|
AU2002311808A1
(en)
*
|
2001-04-06 |
2002-10-21 |
Axon Technologies Corporation |
Microelectronic device, structure, and system, including a memory structure having a variable programmable property and method of forming the same
|
|
US6627944B2
(en)
|
2001-05-07 |
2003-09-30 |
Advanced Micro Devices, Inc. |
Floating gate memory device using composite molecular material
|
|
US6781868B2
(en)
|
2001-05-07 |
2004-08-24 |
Advanced Micro Devices, Inc. |
Molecular memory device
|
|
WO2002091385A1
(en)
*
|
2001-05-07 |
2002-11-14 |
Advanced Micro Devices, Inc. |
Molecular memory cell
|
|
US6844608B2
(en)
|
2001-05-07 |
2005-01-18 |
Advanced Micro Devices, Inc. |
Reversible field-programmable electric interconnects
|
|
KR100900080B1
(ko)
|
2001-05-07 |
2009-06-01 |
어드밴스드 마이크로 디바이시즈, 인코포레이티드 |
자기 조립형 폴리머 막을 구비한 메모리 디바이스 및 그제조 방법
|
|
EP1388179A1
(de)
|
2001-05-07 |
2004-02-11 |
Advanced Micro Devices, Inc. |
Schaltelement mit speichereffekt
|
|
US7102150B2
(en)
|
2001-05-11 |
2006-09-05 |
Harshfield Steven T |
PCRAM memory cell and method of making same
|
|
US6951805B2
(en)
|
2001-08-01 |
2005-10-04 |
Micron Technology, Inc. |
Method of forming integrated circuitry, method of forming memory circuitry, and method of forming random access memory circuitry
|
|
EP1434232B1
(de)
|
2001-08-13 |
2007-09-19 |
Advanced Micro Devices, Inc. |
Speicherzelle
|
|
US6838720B2
(en)
|
2001-08-13 |
2005-01-04 |
Advanced Micro Devices, Inc. |
Memory device with active passive layers
|
|
US6806526B2
(en)
|
2001-08-13 |
2004-10-19 |
Advanced Micro Devices, Inc. |
Memory device
|
|
US6858481B2
(en)
|
2001-08-13 |
2005-02-22 |
Advanced Micro Devices, Inc. |
Memory device with active and passive layers
|
|
US6768157B2
(en)
|
2001-08-13 |
2004-07-27 |
Advanced Micro Devices, Inc. |
Memory device
|
|
US6737312B2
(en)
|
2001-08-27 |
2004-05-18 |
Micron Technology, Inc. |
Method of fabricating dual PCRAM cells sharing a common electrode
|
|
US6784018B2
(en)
|
2001-08-29 |
2004-08-31 |
Micron Technology, Inc. |
Method of forming chalcogenide comprising devices and method of forming a programmable memory cell of memory circuitry
|
|
US6881623B2
(en)
|
2001-08-29 |
2005-04-19 |
Micron Technology, Inc. |
Method of forming chalcogenide comprising devices, method of forming a programmable memory cell of memory circuitry, and a chalcogenide comprising device
|
|
US6955940B2
(en)
|
2001-08-29 |
2005-10-18 |
Micron Technology, Inc. |
Method of forming chalcogenide comprising devices
|
|
US20030047765A1
(en)
|
2001-08-30 |
2003-03-13 |
Campbell Kristy A. |
Stoichiometry for chalcogenide glasses useful for memory devices and method of formation
|
|
US6709958B2
(en)
*
|
2001-08-30 |
2004-03-23 |
Micron Technology, Inc. |
Integrated circuit device and fabrication using metal-doped chalcogenide materials
|
|
US6646902B2
(en)
|
2001-08-30 |
2003-11-11 |
Micron Technology, Inc. |
Method of retaining memory state in a programmable conductor RAM
|
|
JP3593582B2
(ja)
*
|
2001-09-19 |
2004-11-24 |
彰 土井 |
銀イオン含有イオン伝導体の電界誘導黒化現象を利用した記憶素子
|
|
US6815818B2
(en)
|
2001-11-19 |
2004-11-09 |
Micron Technology, Inc. |
Electrode structure for use in an integrated circuit
|
|
US6791859B2
(en)
*
|
2001-11-20 |
2004-09-14 |
Micron Technology, Inc. |
Complementary bit PCRAM sense amplifier and method of operation
|
|
JP3515556B2
(ja)
|
2001-12-04 |
2004-04-05 |
株式会社東芝 |
プログラマブル素子、プログラマブル回路及び半導体装置
|
|
US6873538B2
(en)
|
2001-12-20 |
2005-03-29 |
Micron Technology, Inc. |
Programmable conductor random access memory and a method for writing thereto
|
|
WO2003058638A1
(en)
*
|
2002-01-03 |
2003-07-17 |
Axon Technologies Corporation |
Programming circuit for a programmable microelectronic device, system including the circuit, and method of forming the same
|
|
US6909656B2
(en)
|
2002-01-04 |
2005-06-21 |
Micron Technology, Inc. |
PCRAM rewrite prevention
|
|
US20030143782A1
(en)
|
2002-01-31 |
2003-07-31 |
Gilton Terry L. |
Methods of forming germanium selenide comprising devices and methods of forming silver selenide comprising structures
|
|
US6867064B2
(en)
|
2002-02-15 |
2005-03-15 |
Micron Technology, Inc. |
Method to alter chalcogenide glass for improved switching characteristics
|
|
US6791885B2
(en)
|
2002-02-19 |
2004-09-14 |
Micron Technology, Inc. |
Programmable conductor random access memory and method for sensing same
|
|
US6847535B2
(en)
|
2002-02-20 |
2005-01-25 |
Micron Technology, Inc. |
Removable programmable conductor memory card and associated read/write device and method of operation
|
|
US6891749B2
(en)
|
2002-02-20 |
2005-05-10 |
Micron Technology, Inc. |
Resistance variable ‘on ’ memory
|
|
US7151273B2
(en)
|
2002-02-20 |
2006-12-19 |
Micron Technology, Inc. |
Silver-selenide/chalcogenide glass stack for resistance variable memory
|
|
US6809362B2
(en)
|
2002-02-20 |
2004-10-26 |
Micron Technology, Inc. |
Multiple data state memory cell
|
|
US7087919B2
(en)
|
2002-02-20 |
2006-08-08 |
Micron Technology, Inc. |
Layered resistance variable memory device and method of fabrication
|
|
US6937528B2
(en)
|
2002-03-05 |
2005-08-30 |
Micron Technology, Inc. |
Variable resistance memory and method for sensing same
|
|
US6849868B2
(en)
*
|
2002-03-14 |
2005-02-01 |
Micron Technology, Inc. |
Methods and apparatus for resistance variable material cells
|
|
US6751114B2
(en)
|
2002-03-28 |
2004-06-15 |
Micron Technology, Inc. |
Method for programming a memory cell
|
|
US6858482B2
(en)
|
2002-04-10 |
2005-02-22 |
Micron Technology, Inc. |
Method of manufacture of programmable switching circuits and memory cells employing a glass layer
|
|
US6855975B2
(en)
|
2002-04-10 |
2005-02-15 |
Micron Technology, Inc. |
Thin film diode integrated with chalcogenide memory cell
|
|
US6864500B2
(en)
|
2002-04-10 |
2005-03-08 |
Micron Technology, Inc. |
Programmable conductor memory cell structure
|
|
EP1501124B1
(de)
*
|
2002-04-30 |
2011-06-08 |
Japan Science and Technology Agency |
Festelektrolyt-schaltelemente, fpga- und speicherbauelemente mit denselben sowie verfahren zur herstellung derselben
|
|
US6890790B2
(en)
|
2002-06-06 |
2005-05-10 |
Micron Technology, Inc. |
Co-sputter deposition of metal-doped chalcogenides
|
|
US6825135B2
(en)
|
2002-06-06 |
2004-11-30 |
Micron Technology, Inc. |
Elimination of dendrite formation during metal/chalcogenide glass deposition
|
|
US7015494B2
(en)
|
2002-07-10 |
2006-03-21 |
Micron Technology, Inc. |
Assemblies displaying differential negative resistance
|
|
US7209378B2
(en)
|
2002-08-08 |
2007-04-24 |
Micron Technology, Inc. |
Columnar 1T-N memory cell structure
|
|
US7018863B2
(en)
|
2002-08-22 |
2006-03-28 |
Micron Technology, Inc. |
Method of manufacture of a resistance variable memory cell
|
|
US7163837B2
(en)
|
2002-08-29 |
2007-01-16 |
Micron Technology, Inc. |
Method of forming a resistance variable memory element
|
|
US7364644B2
(en)
|
2002-08-29 |
2008-04-29 |
Micron Technology, Inc. |
Silver selenide film stoichiometry and morphology control in sputter deposition
|
|
US7294527B2
(en)
|
2002-08-29 |
2007-11-13 |
Micron Technology Inc. |
Method of forming a memory cell
|
|
US6831019B1
(en)
|
2002-08-29 |
2004-12-14 |
Micron Technology, Inc. |
Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer received operably proximate conductive electrodes
|
|
US6867996B2
(en)
|
2002-08-29 |
2005-03-15 |
Micron Technology, Inc. |
Single-polarity programmable resistance-variable memory element
|
|
US6867114B2
(en)
|
2002-08-29 |
2005-03-15 |
Micron Technology Inc. |
Methods to form a memory cell with metal-rich metal chalcogenide
|
|
US7010644B2
(en)
|
2002-08-29 |
2006-03-07 |
Micron Technology, Inc. |
Software refreshed memory device and method
|
|
US6856002B2
(en)
|
2002-08-29 |
2005-02-15 |
Micron Technology, Inc. |
Graded GexSe100-x concentration in PCRAM
|
|
US6864521B2
(en)
|
2002-08-29 |
2005-03-08 |
Micron Technology, Inc. |
Method to control silver concentration in a resistance variable memory element
|
|
US7012276B2
(en)
|
2002-09-17 |
2006-03-14 |
Advanced Micro Devices, Inc. |
Organic thin film Zener diodes
|
|
US6813178B2
(en)
|
2003-03-12 |
2004-11-02 |
Micron Technology, Inc. |
Chalcogenide glass constant current device, and its method of fabrication and operation
|
|
US7022579B2
(en)
|
2003-03-14 |
2006-04-04 |
Micron Technology, Inc. |
Method for filling via with metal
|
|
JP4465969B2
(ja)
*
|
2003-03-20 |
2010-05-26 |
ソニー株式会社 |
半導体記憶素子及びこれを用いた半導体記憶装置
|
|
JP4613478B2
(ja)
*
|
2003-05-15 |
2011-01-19 |
ソニー株式会社 |
半導体記憶素子及びこれを用いた半導体記憶装置
|
|
TWI245288B
(en)
|
2003-03-20 |
2005-12-11 |
Sony Corp |
Semiconductor memory element and semiconductor memory device using the same
|
|
US7050327B2
(en)
|
2003-04-10 |
2006-05-23 |
Micron Technology, Inc. |
Differential negative resistance memory
|
|
JP2004319587A
(ja)
*
|
2003-04-11 |
2004-11-11 |
Sharp Corp |
メモリセル、メモリ装置及びメモリセル製造方法
|
|
US7180767B2
(en)
*
|
2003-06-18 |
2007-02-20 |
Macronix International Co., Ltd. |
Multi-level memory device and methods for programming and reading the same
|
|
US6930909B2
(en)
|
2003-06-25 |
2005-08-16 |
Micron Technology, Inc. |
Memory device and methods of controlling resistance variation and resistance profile drift
|
|
JP2005026576A
(ja)
|
2003-07-04 |
2005-01-27 |
Sony Corp |
記憶装置
|
|
US6961277B2
(en)
|
2003-07-08 |
2005-11-01 |
Micron Technology, Inc. |
Method of refreshing a PCRAM memory device
|
|
CN100407440C
(zh)
|
2003-07-18 |
2008-07-30 |
日本电气株式会社 |
开关元件、驱动开关元件的方法、可重写的逻辑集成电路以及存储元件
|
|
US7061004B2
(en)
|
2003-07-21 |
2006-06-13 |
Micron Technology, Inc. |
Resistance variable memory elements and methods of formation
|
|
US7399655B2
(en)
*
|
2003-08-04 |
2008-07-15 |
Ovonyx, Inc. |
Damascene conductive line for contacting an underlying memory element
|
|
US6914255B2
(en)
*
|
2003-08-04 |
2005-07-05 |
Ovonyx, Inc. |
Phase change access device for memories
|
|
US6903361B2
(en)
|
2003-09-17 |
2005-06-07 |
Micron Technology, Inc. |
Non-volatile memory structure
|
|
JP4792714B2
(ja)
|
2003-11-28 |
2011-10-12 |
ソニー株式会社 |
記憶素子及び記憶装置
|
|
US7050319B2
(en)
|
2003-12-03 |
2006-05-23 |
Micron Technology, Inc. |
Memory architecture and method of manufacture and operation thereof
|
|
JP4608875B2
(ja)
*
|
2003-12-03 |
2011-01-12 |
ソニー株式会社 |
記憶装置
|
|
JP2005183557A
(ja)
*
|
2003-12-18 |
2005-07-07 |
Canon Inc |
半導体集積回路とその動作方法、該回路を備えたicカード
|
|
JP4670252B2
(ja)
*
|
2004-01-20 |
2011-04-13 |
ソニー株式会社 |
記憶装置
|
|
US7082052B2
(en)
|
2004-02-06 |
2006-07-25 |
Unity Semiconductor Corporation |
Multi-resistive state element with reactive metal
|
|
US20060171200A1
(en)
*
|
2004-02-06 |
2006-08-03 |
Unity Semiconductor Corporation |
Memory using mixed valence conductive oxides
|
|
JP4834956B2
(ja)
*
|
2004-02-16 |
2011-12-14 |
ソニー株式会社 |
記憶装置
|
|
DE102004010243A1
(de)
*
|
2004-03-03 |
2005-05-19 |
Infineon Technologies Ag |
Statische Speicherzelle mit einem PMC-Widerstandsbauelement
|
|
JP2005252068A
(ja)
|
2004-03-05 |
2005-09-15 |
Sony Corp |
記憶装置
|
|
US7098068B2
(en)
|
2004-03-10 |
2006-08-29 |
Micron Technology, Inc. |
Method of forming a chalcogenide material containing device
|
|
US7190048B2
(en)
|
2004-07-19 |
2007-03-13 |
Micron Technology, Inc. |
Resistance variable memory device and method of fabrication
|
|
US7354793B2
(en)
|
2004-08-12 |
2008-04-08 |
Micron Technology, Inc. |
Method of forming a PCRAM device incorporating a resistance-variable chalocogenide element
|
|
US7326950B2
(en)
|
2004-07-19 |
2008-02-05 |
Micron Technology, Inc. |
Memory device with switching glass layer
|
|
JP4830275B2
(ja)
|
2004-07-22 |
2011-12-07 |
ソニー株式会社 |
記憶素子
|
|
US7365411B2
(en)
|
2004-08-12 |
2008-04-29 |
Micron Technology, Inc. |
Resistance variable memory with temperature tolerant materials
|
|
DE102004040750B4
(de)
|
2004-08-23 |
2008-03-27 |
Qimonda Ag |
Speicherzellenanordnung mit Speicherzellen vom CBRAM-Typ und Verfahren zum Programmieren derselben
|
|
US7151688B2
(en)
|
2004-09-01 |
2006-12-19 |
Micron Technology, Inc. |
Sensing of resistance variable memory devices
|
|
JP4529654B2
(ja)
|
2004-11-15 |
2010-08-25 |
ソニー株式会社 |
記憶素子及び記憶装置
|
|
FR2880177B1
(fr)
*
|
2004-12-23 |
2007-05-18 |
Commissariat Energie Atomique |
Memoire pmc ayant un temps de retention et une vitesse d'ecriture ameliores
|
|
JP5066917B2
(ja)
|
2004-12-27 |
2012-11-07 |
日本電気株式会社 |
スイッチング素子、スイッチング素子の駆動方法及び製造方法、集積回路装置並びにメモリ素子
|
|
WO2006070693A1
(ja)
|
2004-12-27 |
2006-07-06 |
Nec Corporation |
スイッチング素子、スイッチング素子の駆動方法および製造方法、書き換え可能な論理集積回路、メモリ素子
|
|
JP5135796B2
(ja)
*
|
2004-12-28 |
2013-02-06 |
日本電気株式会社 |
スイッチング素子、および書き換え可能な論理集積回路
|
|
WO2006070773A1
(ja)
|
2004-12-28 |
2006-07-06 |
Nec Corporation |
スイッチング素子、書き換え可能な論理集積回路、およびメモリ素子
|
|
JP5135797B2
(ja)
|
2004-12-28 |
2013-02-06 |
日本電気株式会社 |
スイッチング素子、スイッチング素子の製造方法、書き換え可能な論理集積回路、およびメモリ素子
|
|
US7804085B2
(en)
|
2005-01-17 |
2010-09-28 |
Nec Corporation |
Solid electrolyte switching element, and fabrication method of the solid electrolyte element, and integrated circuit
|
|
US7208372B2
(en)
*
|
2005-01-19 |
2007-04-24 |
Sharp Laboratories Of America, Inc. |
Non-volatile memory resistor cell with nanotip electrode
|
|
US7317200B2
(en)
|
2005-02-23 |
2008-01-08 |
Micron Technology, Inc. |
SnSe-based limited reprogrammable cell
|
|
US20130082232A1
(en)
|
2011-09-30 |
2013-04-04 |
Unity Semiconductor Corporation |
Multi Layered Conductive Metal Oxide Structures And Methods For Facilitating Enhanced Performance Characteristics Of Two Terminal Memory Cells
|
|
US7427770B2
(en)
|
2005-04-22 |
2008-09-23 |
Micron Technology, Inc. |
Memory array for increased bit density
|
|
US7269044B2
(en)
|
2005-04-22 |
2007-09-11 |
Micron Technology, Inc. |
Method and apparatus for accessing a memory array
|
|
JP4552745B2
(ja)
*
|
2005-05-10 |
2010-09-29 |
ソニー株式会社 |
記憶素子及びその製造方法
|
|
US7269079B2
(en)
|
2005-05-16 |
2007-09-11 |
Micron Technology, Inc. |
Power circuits for reducing a number of power supply voltage taps required for sensing a resistive memory
|
|
JP4552752B2
(ja)
*
|
2005-05-16 |
2010-09-29 |
ソニー株式会社 |
記憶素子の製造方法、記憶装置の製造方法
|
|
JP2006338784A
(ja)
|
2005-06-02 |
2006-12-14 |
Sony Corp |
記憶装置及び半導体装置
|
|
JP4475174B2
(ja)
|
2005-06-09 |
2010-06-09 |
ソニー株式会社 |
記憶装置
|
|
US7233520B2
(en)
|
2005-07-08 |
2007-06-19 |
Micron Technology, Inc. |
Process for erasing chalcogenide variable resistance memory bits
|
|
JP2007026492A
(ja)
|
2005-07-13 |
2007-02-01 |
Sony Corp |
記憶装置及び半導体装置
|
|
JP4635759B2
(ja)
*
|
2005-07-19 |
2011-02-23 |
ソニー株式会社 |
記憶素子及び記憶装置
|
|
US7274034B2
(en)
|
2005-08-01 |
2007-09-25 |
Micron Technology, Inc. |
Resistance variable memory device with sputtered metal-chalcogenide region and method of fabrication
|
|
US7317567B2
(en)
|
2005-08-02 |
2008-01-08 |
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|
|
US7332735B2
(en)
|
2005-08-02 |
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|
|
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(en)
|
2005-08-09 |
2009-08-25 |
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|
|
US7304368B2
(en)
|
2005-08-11 |
2007-12-04 |
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|
|
US7251154B2
(en)
|
2005-08-15 |
2007-07-31 |
Micron Technology, Inc. |
Method and apparatus providing a cross-point memory array using a variable resistance memory cell and capacitance
|
|
US7277313B2
(en)
|
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2007-10-02 |
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|
|
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(ja)
|
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2007-03-29 |
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|
|
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(ja)
|
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|
|
US20090289371A1
(en)
*
|
2005-12-15 |
2009-11-26 |
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|
|
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(ja)
|
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|
|
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(ja)
*
|
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|
|
US8013711B2
(en)
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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(ja)
*
|
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|
|
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(ja)
|
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|
|
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(ja)
*
|
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|
|
US20080314738A1
(en)
*
|
2007-06-19 |
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International Business Machines Corporation |
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|
|
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(ja)
|
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|
|
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(ja)
|
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|
|
JP2009043873A
(ja)
*
|
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|
|
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(en)
|
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|
|
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(ja)
|
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|
|
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(en)
|
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|
|
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(ja)
|
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|
|
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(ja)
*
|
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|
|
US8455855B2
(en)
*
|
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|
|
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(ja)
|
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|
|
JP2011124511A
(ja)
*
|
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|
|
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(ja)
|
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|
|
JP2012094759A
(ja)
*
|
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Elpida Memory Inc |
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|
|
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(zh)
|
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|
|
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(ja)
|
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|
|
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(ja)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ja)
|
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|
|
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(de)
|
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|
|
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(ja)
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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(ja)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|