ATE363079T1 - Leiterrahmen mit niedrigem temperaturkoeffizienten für integrierte schaltungen sowie integrierte schaltungen mit einem solchen leiterrahmen - Google Patents

Leiterrahmen mit niedrigem temperaturkoeffizienten für integrierte schaltungen sowie integrierte schaltungen mit einem solchen leiterrahmen

Info

Publication number
ATE363079T1
ATE363079T1 AT01650024T AT01650024T ATE363079T1 AT E363079 T1 ATE363079 T1 AT E363079T1 AT 01650024 T AT01650024 T AT 01650024T AT 01650024 T AT01650024 T AT 01650024T AT E363079 T1 ATE363079 T1 AT E363079T1
Authority
AT
Austria
Prior art keywords
integrated circuits
conductor frame
leadframe
integrated
resistive element
Prior art date
Application number
AT01650024T
Other languages
English (en)
Inventor
Mark R Stitt
Larry D Hobson
Original Assignee
Texas Instr Tucson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Tucson Corp filed Critical Texas Instr Tucson Corp
Application granted granted Critical
Publication of ATE363079T1 publication Critical patent/ATE363079T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0084—Measuring voltage only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Measuring current only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
AT01650024T 2000-02-29 2001-02-28 Leiterrahmen mit niedrigem temperaturkoeffizienten für integrierte schaltungen sowie integrierte schaltungen mit einem solchen leiterrahmen ATE363079T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/515,300 US6225684B1 (en) 2000-02-29 2000-02-29 Low temperature coefficient leadframe

Publications (1)

Publication Number Publication Date
ATE363079T1 true ATE363079T1 (de) 2007-06-15

Family

ID=24050780

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01650024T ATE363079T1 (de) 2000-02-29 2001-02-28 Leiterrahmen mit niedrigem temperaturkoeffizienten für integrierte schaltungen sowie integrierte schaltungen mit einem solchen leiterrahmen

Country Status (5)

Country Link
US (1) US6225684B1 (de)
EP (1) EP1150129B1 (de)
JP (1) JP3429750B2 (de)
AT (1) ATE363079T1 (de)
DE (1) DE60128510T2 (de)

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DE102005019569A1 (de) * 2005-04-27 2006-11-09 Siemens Ag Shunt, Batteriesensor und Verfahren zur Herstellung eines Shunts
US8324721B2 (en) * 2008-07-01 2012-12-04 Texas Instruments Incorporated Integrated shunt resistor with external contact in a semiconductor package
US7847391B2 (en) * 2008-07-01 2010-12-07 Texas Instruments Incorporated Manufacturing method for integrating a shunt resistor into a semiconductor package
US8446159B2 (en) * 2010-06-30 2013-05-21 Linear Technology Corporation Current sensor using leadframe as sensing element
JP5793995B2 (ja) * 2011-06-28 2015-10-14 トヨタ自動車株式会社 リードフレーム、及び、パワーモジュール
US9523720B2 (en) * 2013-03-15 2016-12-20 Infineon Technologies Ag Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
DE102013009726A1 (de) 2013-06-10 2014-12-11 Isabellenhütte Heusler Gmbh & Co. Kg Stanzteil zur Herstellung eines elektrischen Widerstands, Stromsensor und entsprechendes Herstellungsverfahren
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9734852B2 (en) 2015-06-30 2017-08-15 Hutchinson Technology Incorporated Disk drive head suspension structures having improved gold-dielectric joint reliability
DE102016201447A1 (de) * 2016-02-01 2017-08-03 Continental Automotive Gmbh Verbindung zwischen einer Wicklung und einer Platine
US10242938B2 (en) 2017-05-16 2019-03-26 Infineon Technologies Americas Corp. Integrated shunt in circuit package
US20230221356A1 (en) * 2022-01-07 2023-07-13 Semiconductor Components Industries, Llc Current sense circuit having a temperature compensated response
CN114823598A (zh) * 2022-04-01 2022-07-29 上海兴感半导体有限公司 引线框架、封装结构及封装方法

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Also Published As

Publication number Publication date
JP2001284518A (ja) 2001-10-12
EP1150129A3 (de) 2004-05-19
DE60128510T2 (de) 2008-01-24
DE60128510D1 (de) 2007-07-05
EP1150129A2 (de) 2001-10-31
US6225684B1 (en) 2001-05-01
JP3429750B2 (ja) 2003-07-22
EP1150129B1 (de) 2007-05-23

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