ATE365974T1 - Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile - Google Patents

Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile

Info

Publication number
ATE365974T1
ATE365974T1 AT03745325T AT03745325T ATE365974T1 AT E365974 T1 ATE365974 T1 AT E365974T1 AT 03745325 T AT03745325 T AT 03745325T AT 03745325 T AT03745325 T AT 03745325T AT E365974 T1 ATE365974 T1 AT E365974T1
Authority
AT
Austria
Prior art keywords
layer
components
obtained therefrom
organic optoelectronic
producing organic
Prior art date
Application number
AT03745325T
Other languages
English (en)
Inventor
Alec Gunner
Martin Cacheiro
Original Assignee
Cambridge Display Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Display Tech Ltd filed Critical Cambridge Display Tech Ltd
Application granted granted Critical
Publication of ATE365974T1 publication Critical patent/ATE365974T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H10P14/687—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Light Receiving Elements (AREA)
  • Bipolar Transistors (AREA)
  • Photovoltaic Devices (AREA)
AT03745325T 2002-03-27 2003-03-21 Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile ATE365974T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0207134.8A GB0207134D0 (en) 2002-03-27 2002-03-27 Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained

Publications (1)

Publication Number Publication Date
ATE365974T1 true ATE365974T1 (de) 2007-07-15

Family

ID=9933751

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03745325T ATE365974T1 (de) 2002-03-27 2003-03-21 Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile

Country Status (9)

Country Link
US (1) US7326653B2 (de)
EP (1) EP1490915B1 (de)
JP (2) JP2005522000A (de)
CN (1) CN1653628B (de)
AT (1) ATE365974T1 (de)
AU (1) AU2003215757A1 (de)
DE (1) DE60314610T2 (de)
GB (1) GB0207134D0 (de)
WO (1) WO2003083960A1 (de)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3823981B2 (ja) * 2003-05-12 2006-09-20 セイコーエプソン株式会社 パターンと配線パターン形成方法、デバイスとその製造方法、電気光学装置、電子機器及びアクティブマトリクス基板の製造方法
JP4344270B2 (ja) * 2003-05-30 2009-10-14 セイコーエプソン株式会社 液晶表示装置の製造方法
DE10340643B4 (de) * 2003-09-03 2009-04-16 Polyic Gmbh & Co. Kg Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht
CN1868073B (zh) * 2003-10-13 2012-05-30 奇美电子股份有限公司 电致发光显示面板
JP2005123083A (ja) * 2003-10-17 2005-05-12 Dainippon Screen Mfg Co Ltd 塗布組成物および有機ｅｌ素子の製造方法
US7226819B2 (en) * 2003-10-28 2007-06-05 Semiconductor Energy Laboratory Co., Ltd. Methods for forming wiring and manufacturing thin film transistor and droplet discharging method
JP3915806B2 (ja) 2003-11-11 2007-05-16 セイコーエプソン株式会社 電気光学装置および電子機器
JP4556566B2 (ja) * 2003-11-11 2010-10-06 セイコーエプソン株式会社 電気光学装置および電子機器
KR100993826B1 (ko) * 2003-11-19 2010-11-12 삼성전자주식회사 표시장치 및 이의 제조 방법
JP4583776B2 (ja) * 2004-02-13 2010-11-17 株式会社半導体エネルギー研究所 表示装置の作製方法
US20050282308A1 (en) * 2004-06-22 2005-12-22 Albrecht Uhlig Organic electroluminescent display device and method of producing the same
JP2006012786A (ja) 2004-06-22 2006-01-12 Samsung Sdi Co Ltd 有機電界発光素子、並びに該製造方法
DE102004031071B4 (de) * 2004-06-22 2008-04-30 Samsung SDI Co., Ltd., Suwon Verfahren zur Behandlung einer organischen Leuchtdiode (OLED) zur Verlängerung der Lebensdauer
JP2006024695A (ja) * 2004-07-07 2006-01-26 Nec Lcd Technologies Ltd ナノ粒子インクを用いた配線形成方法
DE102004036734A1 (de) 2004-07-29 2006-03-23 Konarka Technologies, Inc., Lowell Kostengünstige organische Solarzelle und Verfahren zur Herstellung
WO2006016153A1 (en) * 2004-08-10 2006-02-16 Cambridge Display Technology Limited Light emissive device
KR101186966B1 (ko) * 2004-11-09 2012-10-02 코닌클리케 필립스 일렉트로닉스 엔.브이. 유기 트랜지스터를 제조하기 위한 자체-정렬 공정
GB0510382D0 (en) 2005-05-20 2005-06-29 Cambridge Display Tech Ltd Ink jet printing compositions in opto-electrical devices
TW200708591A (en) * 2005-06-10 2007-03-01 Sumitomo Chemical Co Aromatic graft polymer
JP2008544509A (ja) * 2005-06-16 2008-12-04 シーメンス アクチエンゲゼルシヤフト 有機ライン検出器および有機ライン検出器の製造方法
JP2007027589A (ja) * 2005-07-20 2007-02-01 Seiko Epson Corp 膜パターンの形成方法、デバイス、電気光学装置、及び電子機器
KR101209046B1 (ko) 2005-07-27 2012-12-06 삼성디스플레이 주식회사 박막트랜지스터 기판과 박막트랜지스터 기판의 제조방법
JP4506605B2 (ja) * 2005-07-28 2010-07-21 ソニー株式会社 半導体装置の製造方法
DE102005037289A1 (de) * 2005-08-08 2007-02-22 Siemens Ag Fotodetektor, Röntgenstrahlenflachbilddetektor und Verfahren zur Herstellung dergleichen
WO2007023272A1 (en) 2005-08-23 2007-03-01 Cambridge Display Technology Limited Organic electronic device structures and fabrication methods
GB0517195D0 (en) * 2005-08-23 2005-09-28 Cambridge Display Tech Ltd Molecular electronic device structures and fabrication methods
US20070048894A1 (en) * 2005-08-26 2007-03-01 Osram Opto Semiconductors Gmbh System and method for reduced material pileup
JP4872288B2 (ja) * 2005-09-22 2012-02-08 凸版印刷株式会社 有機ｅｌ素子及びその製造方法
GB2432256B (en) 2005-11-14 2009-12-23 Cambridge Display Tech Ltd Organic optoelectrical device
JP4706845B2 (ja) * 2006-02-15 2011-06-22 凸版印刷株式会社 有機ｅｌ素子の製造方法
US8124172B2 (en) * 2006-03-02 2012-02-28 E.I. Du Pont De Nemours And Company Process for making contained layers and devices made with same
TWI336953B (en) 2006-03-29 2011-02-01 Pioneer Corp Organic electroluminescent display panel and manufacturing method thereof
TW200739982A (en) * 2006-04-06 2007-10-16 Nat Univ Chung Cheng Method for manufacturing full-color organic light-emitting diode array based on microcontact printing technology
GB2437113B (en) 2006-04-12 2008-11-26 Cambridge Display Tech Ltd Light-emissive display and method of manufacturing the same
JP4742977B2 (ja) * 2006-05-12 2011-08-10 凸版印刷株式会社 有機ｅｌディスプレイパネルの製造方法
WO2007145977A1 (en) * 2006-06-05 2007-12-21 E. I. Du Pont De Nemours And Company Process for making an organic electronic device
DE102006026981A1 (de) * 2006-06-10 2007-12-13 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer strukturierten Schicht auf einem Trägersubstrat
DE102006027292B4 (de) * 2006-06-13 2010-06-17 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer strukturierten Schichtfolge auf einem Substrat
JP4222390B2 (ja) * 2006-07-25 2009-02-12 セイコーエプソン株式会社 パターンの形成方法、及び液晶表示装置の製造方法
KR101418618B1 (ko) 2006-08-01 2014-07-14 캠브리지 디스플레이 테크놀로지 리미티드 광전기 소자 및 그의 제조 방법
JP2008041960A (ja) * 2006-08-07 2008-02-21 Nissan Chem Ind Ltd 電子回路部品の製造方法
GB0618698D0 (en) 2006-09-22 2006-11-01 Cambridge Display Tech Ltd Molecular electronic device fabrication methods and structures
US20080145697A1 (en) * 2006-12-13 2008-06-19 General Electric Company Opto-electronic devices containing sulfonated light-emitting copolymers
WO2008075625A1 (ja) 2006-12-18 2008-06-26 Panasonic Corporation 半導体デバイス
JP5234523B2 (ja) * 2007-04-13 2013-07-10 株式会社ニコン 表示素子の製造方法、表示素子の製造装置、及び表示素子製造用のシート基板
EP2141964B1 (de) 2007-05-31 2011-09-07 Panasonic Corporation Organisches EL-Element und Herstellungsverfahren dafür
US8309376B2 (en) * 2007-10-26 2012-11-13 E I Du Pont De Nemours And Company Process and materials for making contained layers and devices made with same
GB2455747B (en) * 2007-12-19 2011-02-09 Cambridge Display Tech Ltd Electronic devices and methods of making the same using solution processing techniques
GB0724774D0 (en) * 2007-12-19 2008-01-30 Cambridge Display Tech Ltd Organic thin film transistors, active matrix organic optical devices and methods of making the same
US7888867B2 (en) 2007-12-28 2011-02-15 Panasonic Corporation Organic el device having bank with groove, organic el display panel, and method for manufacturing the organic el device
US20090226139A1 (en) * 2008-01-31 2009-09-10 Coretek Opto Corp. Optoelectronic component and optical subassembly for optical communication
GB0803950D0 (en) 2008-03-03 2008-04-09 Cambridge Display Technology O Solvent for printing composition
GB2458454B (en) * 2008-03-14 2011-03-16 Cambridge Display Tech Ltd Electronic devices and methods of making the same using solution processing techniques
GB2462410B (en) 2008-07-21 2011-04-27 Cambridge Display Tech Ltd Compositions and methods for manufacturing light-emissive devices
GB0814971D0 (en) 2008-08-15 2008-09-24 Cambridge Display Tech Ltd Opto-electrical devices and methods of manufacturing the same
GB2462688B (en) 2008-08-22 2012-03-07 Cambridge Display Tech Ltd Opto-electrical devices and methods of manufacturing the same
US7999175B2 (en) 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
US9150966B2 (en) * 2008-11-14 2015-10-06 Palo Alto Research Center Incorporated Solar cell metallization using inline electroless plating
GB2466843A (en) 2009-01-12 2010-07-14 Cambridge Display Tech Ltd Interlayer formulation for flat films
GB2466842B (en) 2009-01-12 2011-10-26 Cambridge Display Tech Ltd Interlayer formulation for flat films
WO2011014216A1 (en) * 2009-07-27 2011-02-03 E. I. Du Pont De Nemours And Company Process and materials for making contained layers and devices made with same
KR101108162B1 (ko) * 2010-01-11 2012-01-31 서울대학교산학협력단 고해상도 유기 박막 패턴 형성 방법
US8871545B2 (en) * 2010-04-27 2014-10-28 Orthogonal, Inc. Method for forming a multicolor OLED device
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
FR2988517B1 (fr) 2012-03-22 2014-04-11 Commissariat Energie Atomique Procede de fabrication de plots d'assemblage sur un support pour l'auto-assemblage d'une puce de circuit integre sur le support
US20130248822A1 (en) * 2012-03-23 2013-09-26 Xiong Gong Broadband Polymer Photodetectors Using Zinc Oxide Nanowire as an Electron-Transporting Layer
CN103066004B (zh) * 2012-11-20 2016-02-17 京东方科技集团股份有限公司 一种表面处理方法
US9444050B2 (en) * 2013-01-17 2016-09-13 Kateeva, Inc. High resolution organic light-emitting diode devices, displays, and related method
US9614191B2 (en) 2013-01-17 2017-04-04 Kateeva, Inc. High resolution organic light-emitting diode devices, displays, and related methods
EP2784839B1 (de) * 2013-03-26 2017-10-25 Novaled GmbH Verfahren zum Herstellen eines organischen Feldeffekttransistors
US9541829B2 (en) 2013-07-24 2017-01-10 Orthogonal, Inc. Cross-linkable fluorinated photopolymer
US9298088B2 (en) 2013-07-24 2016-03-29 Orthogonal, Inc. Fluorinated photopolymer with fluorinated sensitizer
KR20160118340A (ko) 2014-02-07 2016-10-11 올싸거널 인코포레이티드 교차-결합 가능한 플루오르화된 포토폴리머
US9328418B2 (en) * 2014-09-16 2016-05-03 Eastman Kodak Company Method of forming a patterned polymer layer
US9746776B2 (en) * 2014-11-25 2017-08-29 E I Du Pont De Nemours And Company Low surface energy photoresist composition and process
CN104716275A (zh) * 2015-03-20 2015-06-17 京东方科技集团股份有限公司 电子器件的封装方法和封装系统
KR20180017163A (ko) 2015-06-12 2018-02-20 메르크 파텐트 게엠베하 플루오로폴리머 뱅크 구조들을 갖는 유기 전자 디바이스들
KR102360093B1 (ko) 2015-07-22 2022-02-09 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
US10141183B2 (en) * 2016-01-28 2018-11-27 Tokyo Electron Limited Methods of spin-on deposition of metal oxides
WO2018033510A2 (en) 2016-08-17 2018-02-22 Merck Patent Gmbh Electronic device with bank structures
JP6923163B2 (ja) * 2016-12-14 2021-08-18 国立大学法人山形大学 組成物および有機光電子素子並びにその製造方法
CN109786552B (zh) * 2019-01-22 2020-10-16 合肥京东方光电科技有限公司 有机薄膜及其制作方法、显示装置和光学器件
CN110828521B (zh) * 2019-11-18 2023-06-02 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板及显示装置
CN111224020A (zh) * 2020-01-14 2020-06-02 吉林建筑大学 一种基于喷墨融合的薄膜电极材料沉积方法
CN113314509B (zh) * 2020-02-27 2022-11-08 群创光电股份有限公司 发光装置
CN113054058B (zh) * 2021-03-16 2023-07-25 哈尔滨工业大学 一种柔性疏水基衬底上图案化刻蚀pedot:pss透明电极的紫外光刻方法
JP2023130238A (ja) * 2022-03-07 2023-09-20 三菱ケミカル株式会社 有機電界発光素子の製造方法及び有機電界発光素子

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539507A (en) * 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
GB8909011D0 (en) 1989-04-20 1989-06-07 Friend Richard H Electroluminescent devices
GB9423692D0 (en) * 1994-11-23 1995-01-11 Philips Electronics Uk Ltd A photoresponsive device
JP3247388B2 (ja) 1996-02-26 2002-01-15 出光興産株式会社 有機エレクトロルミネッセンス素子及びその製造方法
GB9609282D0 (en) 1996-05-03 1996-07-10 Cambridge Display Tech Ltd Protective thin oxide layer
JP3724589B2 (ja) 1996-07-29 2005-12-07 ケンブリッジ ディスプレイ テクノロジー リミテッド エレクトロルミネセンス素子
GB9623185D0 (en) 1996-11-09 1997-01-08 Epigem Limited Improved micro relief element and preparation thereof
JP3899566B2 (ja) 1996-11-25 2007-03-28 セイコーエプソン株式会社 有機ｅｌ表示装置の製造方法
US5904154A (en) * 1997-07-24 1999-05-18 Vanguard International Semiconductor Corporation Method for removing fluorinated photoresist layers from semiconductor substrates
GB9718393D0 (en) 1997-08-29 1997-11-05 Cambridge Display Tech Ltd Electroluminescent Device
JP3633229B2 (ja) 1997-09-01 2005-03-30 セイコーエプソン株式会社 発光素子の製造方法および多色表示装置の製造方法
KR100660384B1 (ko) * 1998-03-17 2006-12-21 세이코 엡슨 가부시키가이샤 표시장치의 제조방법
GB2335884A (en) 1998-04-02 1999-10-06 Cambridge Display Tech Ltd Flexible substrates for electronic or optoelectronic devices
US6080031A (en) * 1998-09-02 2000-06-27 Motorola, Inc. Methods of encapsulating electroluminescent apparatus
CN1150639C (zh) 1998-12-17 2004-05-19 剑桥显示技术有限公司 有机发光装置
WO2000067072A1 (en) * 1999-05-04 2000-11-09 E.I. Du Pont De Nemours And Company Fluorinated polymers, photoresists and processes for microlithography
NO311797B1 (no) 1999-05-12 2002-01-28 Thin Film Electronics Asa Fremgangsmåter til mönstring av polymerfilmer og anvendelse av fremgangsmåtene
WO2000076008A1 (en) * 1999-06-09 2000-12-14 Cambridge Display Technology Limited Method of producing organic light-emissive devices
GB9920543D0 (en) * 1999-08-31 1999-11-03 Cambridge Display Tech Ltd A formulation for depositing a light-emitting polymer layer
CN1245769C (zh) 1999-12-21 2006-03-15 造型逻辑有限公司 溶液加工
JP2003518754A (ja) 1999-12-21 2003-06-10 プラスティック ロジック リミテッド 溶液処理された素子
US6633121B2 (en) * 2000-01-31 2003-10-14 Idemitsu Kosan Co., Ltd. Organic electroluminescence display device and method of manufacturing same
JP2001284047A (ja) * 2000-04-03 2001-10-12 Sharp Corp 有機エレクトロルミネッセンス表示装置の製造方法
JP2001326069A (ja) 2000-05-15 2001-11-22 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子及びその製造方法
US7148148B2 (en) 2001-12-06 2006-12-12 Seiko Epson Corporation Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
JP2003283103A (ja) * 2002-03-22 2003-10-03 Seiko Epson Corp パターン形成方法および装置並びにデバイスの製造方法およびデバイス
GB0215309D0 (en) * 2002-07-03 2002-08-14 Cambridge Display Tech Ltd Combined information display and information input device
US7217496B2 (en) * 2004-11-12 2007-05-15 International Business Machines Corporation Fluorinated photoresist materials with improved etch resistant properties

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DE60314610D1 (de) 2007-08-09
EP1490915A1 (de) 2004-12-29
CN1653628B (zh) 2010-10-13
EP1490915B1 (de) 2007-06-27
AU2003215757A1 (en) 2003-10-13
US7326653B2 (en) 2008-02-05
DE60314610T2 (de) 2008-03-06
US20050196969A1 (en) 2005-09-08
GB0207134D0 (en) 2002-05-08
HK1073531A1 (en) 2005-10-07
JP2008243817A (ja) 2008-10-09
WO2003083960A1 (en) 2003-10-09
CN1653628A (zh) 2005-08-10
JP2005522000A (ja) 2005-07-21

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