ATE365974T1 - Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile - Google Patents
Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteileInfo
- Publication number
- ATE365974T1 ATE365974T1 AT03745325T AT03745325T ATE365974T1 AT E365974 T1 ATE365974 T1 AT E365974T1 AT 03745325 T AT03745325 T AT 03745325T AT 03745325 T AT03745325 T AT 03745325T AT E365974 T1 ATE365974 T1 AT E365974T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- components
- obtained therefrom
- organic optoelectronic
- producing organic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
- H10P14/687—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
- H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Light Receiving Elements (AREA)
- Bipolar Transistors (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0207134.8A GB0207134D0 (en) | 2002-03-27 | 2002-03-27 | Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE365974T1 true ATE365974T1 (de) | 2007-07-15 |
Family
ID=9933751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03745325T ATE365974T1 (de) | 2002-03-27 | 2003-03-21 | Verfahren zur herstellung von organischen optoelektronischen und elektronischen bauteilen sowie dadurch erhaltene bauteile |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7326653B2 (de) |
| EP (1) | EP1490915B1 (de) |
| JP (2) | JP2005522000A (de) |
| CN (1) | CN1653628B (de) |
| AT (1) | ATE365974T1 (de) |
| AU (1) | AU2003215757A1 (de) |
| DE (1) | DE60314610T2 (de) |
| GB (1) | GB0207134D0 (de) |
| WO (1) | WO2003083960A1 (de) |
Families Citing this family (87)
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| JP3823981B2 (ja) * | 2003-05-12 | 2006-09-20 | セイコーエプソン株式会社 | パターンと配線パターン形成方法、デバイスとその製造方法、電気光学装置、電子機器及びアクティブマトリクス基板の製造方法 |
| JP4344270B2 (ja) * | 2003-05-30 | 2009-10-14 | セイコーエプソン株式会社 | 液晶表示装置の製造方法 |
| DE10340643B4 (de) * | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Druckverfahren zur Herstellung einer Doppelschicht für Polymerelektronik-Schaltungen, sowie dadurch hergestelltes elektronisches Bauelement mit Doppelschicht |
| JP2007508674A (ja) * | 2003-10-13 | 2007-04-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | エレクトロルミネッセントディスプレイパネル |
| JP2005123083A (ja) * | 2003-10-17 | 2005-05-12 | Dainippon Screen Mfg Co Ltd | 塗布組成物および有機el素子の製造方法 |
| US7226819B2 (en) * | 2003-10-28 | 2007-06-05 | Semiconductor Energy Laboratory Co., Ltd. | Methods for forming wiring and manufacturing thin film transistor and droplet discharging method |
| JP3915806B2 (ja) | 2003-11-11 | 2007-05-16 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| JP4556566B2 (ja) * | 2003-11-11 | 2010-10-06 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| KR100993826B1 (ko) * | 2003-11-19 | 2010-11-12 | 삼성전자주식회사 | 표시장치 및 이의 제조 방법 |
| JP4583776B2 (ja) * | 2004-02-13 | 2010-11-17 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| DE102004031071B4 (de) * | 2004-06-22 | 2008-04-30 | Samsung SDI Co., Ltd., Suwon | Verfahren zur Behandlung einer organischen Leuchtdiode (OLED) zur Verlängerung der Lebensdauer |
| JP2006012786A (ja) | 2004-06-22 | 2006-01-12 | Samsung Sdi Co Ltd | 有機電界発光素子、並びに該製造方法 |
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| JP2006024695A (ja) * | 2004-07-07 | 2006-01-26 | Nec Lcd Technologies Ltd | ナノ粒子インクを用いた配線形成方法 |
| DE102004036734A1 (de) | 2004-07-29 | 2006-03-23 | Konarka Technologies, Inc., Lowell | Kostengünstige organische Solarzelle und Verfahren zur Herstellung |
| JP5198861B2 (ja) * | 2004-08-10 | 2013-05-15 | ケンブリッジ ディスプレイ テクノロジー リミテッド | 発光装置 |
| ATE518259T1 (de) * | 2004-11-09 | 2011-08-15 | Creator Technology Bv | Selbstausgerichtetes verfahren zur herstellung organischer transistoren |
| GB0510382D0 (en) | 2005-05-20 | 2005-06-29 | Cambridge Display Tech Ltd | Ink jet printing compositions in opto-electrical devices |
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| JP4706845B2 (ja) * | 2006-02-15 | 2011-06-22 | 凸版印刷株式会社 | 有機el素子の製造方法 |
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| US6080031A (en) * | 1998-09-02 | 2000-06-27 | Motorola, Inc. | Methods of encapsulating electroluminescent apparatus |
| JP2002532847A (ja) | 1998-12-17 | 2002-10-02 | ケンブリッジ ディスプレイ テクノロジー リミテッド | 有機発光デバイス |
| KR20020012206A (ko) | 1999-05-04 | 2002-02-15 | 메리 이. 보울러 | 플루오르화 중합체, 포토레지스트 및 마이크로리소그래피방법 |
| NO311797B1 (no) | 1999-05-12 | 2002-01-28 | Thin Film Electronics Asa | Fremgangsmåter til mönstring av polymerfilmer og anvendelse av fremgangsmåtene |
| US6878297B1 (en) * | 1999-06-09 | 2005-04-12 | Cambridge Display Technology, Limited | Method of producing organic light-emissive devices |
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| JP2001326069A (ja) | 2000-05-15 | 2001-11-22 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子及びその製造方法 |
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| JP2003283103A (ja) | 2002-03-22 | 2003-10-03 | Seiko Epson Corp | パターン形成方法および装置並びにデバイスの製造方法およびデバイス |
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| US7217496B2 (en) * | 2004-11-12 | 2007-05-15 | International Business Machines Corporation | Fluorinated photoresist materials with improved etch resistant properties |
-
2002
- 2002-03-27 GB GBGB0207134.8A patent/GB0207134D0/en not_active Ceased
-
2003
- 2003-03-21 AU AU2003215757A patent/AU2003215757A1/en not_active Abandoned
- 2003-03-21 AT AT03745325T patent/ATE365974T1/de not_active IP Right Cessation
- 2003-03-21 WO PCT/GB2003/001214 patent/WO2003083960A1/en not_active Ceased
- 2003-03-21 JP JP2003581274A patent/JP2005522000A/ja active Pending
- 2003-03-21 DE DE60314610T patent/DE60314610T2/de not_active Expired - Lifetime
- 2003-03-21 EP EP03745325A patent/EP1490915B1/de not_active Expired - Lifetime
- 2003-03-21 US US10/509,311 patent/US7326653B2/en not_active Expired - Lifetime
- 2003-03-21 CN CN038106663A patent/CN1653628B/zh not_active Expired - Fee Related
-
2008
- 2008-03-27 JP JP2008082742A patent/JP2008243817A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE60314610D1 (de) | 2007-08-09 |
| HK1073531A1 (en) | 2005-10-07 |
| CN1653628A (zh) | 2005-08-10 |
| CN1653628B (zh) | 2010-10-13 |
| JP2008243817A (ja) | 2008-10-09 |
| US20050196969A1 (en) | 2005-09-08 |
| WO2003083960A1 (en) | 2003-10-09 |
| DE60314610T2 (de) | 2008-03-06 |
| EP1490915A1 (de) | 2004-12-29 |
| GB0207134D0 (en) | 2002-05-08 |
| AU2003215757A1 (en) | 2003-10-13 |
| US7326653B2 (en) | 2008-02-05 |
| JP2005522000A (ja) | 2005-07-21 |
| EP1490915B1 (de) | 2007-06-27 |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |