ATE366428T1 - Verfahren zum verbinden mindestens zweier glieder - Google Patents

Verfahren zum verbinden mindestens zweier glieder

Info

Publication number
ATE366428T1
ATE366428T1 AT04808814T AT04808814T ATE366428T1 AT E366428 T1 ATE366428 T1 AT E366428T1 AT 04808814 T AT04808814 T AT 04808814T AT 04808814 T AT04808814 T AT 04808814T AT E366428 T1 ATE366428 T1 AT E366428T1
Authority
AT
Austria
Prior art keywords
direct
ultra low
low expansion
members
expansion glass
Prior art date
Application number
AT04808814T
Other languages
English (en)
Inventor
Elp Jan Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Application granted granted Critical
Publication of ATE366428T1 publication Critical patent/ATE366428T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Products (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Body Structure For Vehicles (AREA)
  • Joining Of Building Structures In Genera (AREA)
AT04808814T 2003-12-22 2004-12-22 Verfahren zum verbinden mindestens zweier glieder ATE366428T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/740,831 US8105457B2 (en) 2003-12-22 2003-12-22 Method for joining at least a first member and a second member, lithographic apparatus and device manufacturing method, as well as a device manufactured thereby

Publications (1)

Publication Number Publication Date
ATE366428T1 true ATE366428T1 (de) 2007-07-15

Family

ID=34677978

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04808814T ATE366428T1 (de) 2003-12-22 2004-12-22 Verfahren zum verbinden mindestens zweier glieder

Country Status (7)

Country Link
US (1) US8105457B2 (de)
EP (1) EP1697800B1 (de)
JP (1) JP4444971B2 (de)
AT (1) ATE366428T1 (de)
DE (1) DE602004007409T2 (de)
TW (1) TWI253102B (de)
WO (1) WO2005062127A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115182B2 (en) * 2004-06-15 2006-10-03 Agency For Science, Technology And Research Anodic bonding process for ceramics
JP5449358B2 (ja) * 2008-08-21 2014-03-19 エーエスエムエル ホールディング エヌ．ブイ． レチクル、リソグラフィ装置、およびレチクルを生成する方法
DE102009011863B4 (de) 2009-03-05 2024-02-08 Asml Netherlands B.V. Leichtgewicht-Trägerstruktur, insbesondere für optische Bauteile, Verfahren zu deren Herstellung und Verwendung der Trägerstruktur
US9048276B2 (en) * 2010-05-28 2015-06-02 Axcelis Technologies, Inc. Matched coefficient of thermal expansion for an electrostatic chuck
EP2555234B1 (de) * 2011-08-02 2020-08-19 ASML Holding N.V. Elektrostatische Klemme, lithografische Vorrichtung und Verfahren zur Herstellung einer elektrostatischen Klemme
DE102011080635A1 (de) * 2011-08-09 2013-02-14 Carl Zeiss Smt Gmbh Verfahren zum Verbinden von Komponenten und Verbundstruktur
WO2014122151A2 (en) * 2013-02-07 2014-08-14 Asml Holding N.V. Lithographic apparatus and method
TWI656596B (zh) * 2014-08-26 2019-04-11 Asml Holding N. V. 靜電夾具及其製造方法
KR20210124997A (ko) 2019-02-13 2021-10-15 에이에스엠엘 홀딩 엔.브이. 기계적 인터페이스를 위한 중간층
DE102019217389A1 (de) * 2019-10-18 2021-04-22 Carl Zeiss Smt Gmbh Verfahren zum Verbinden eines Anbauteils mit einem Grundkörper eines optischen Elements und optisches Element
JP7683317B2 (ja) * 2021-05-21 2025-05-27 住友大阪セメント株式会社 静電チャック装置
GB202212686D0 (en) * 2022-08-31 2022-10-12 Smart Photonics Holding B V Method of providing a wafer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4924701A (en) * 1988-09-06 1990-05-15 Panex Corporation Pressure measurement system
JP2714860B2 (ja) * 1989-07-28 1998-02-16 東芝セラミックス株式会社 半導体巣結晶引上げ用石英ガラスルツボ
JP2933404B2 (ja) * 1990-06-25 1999-08-16 信越石英 株式会社 シリコン単結晶引き上げ用石英ガラスルツボとその製造方法
US5306473A (en) * 1992-01-31 1994-04-26 Toshiba Ceramics Co., Ltd. Quartz glass crucible for pulling a single crystal
US5441591A (en) 1993-06-07 1995-08-15 The United States Of America As Represented By The Secretary Of The Navy Silicon to sapphire bond
US5980629A (en) * 1995-06-14 1999-11-09 Memc Electronic Materials, Inc. Methods for improving zero dislocation yield of single crystals
JP4285788B2 (ja) * 1996-03-14 2009-06-24 信越石英株式会社 単結晶引き上げ用大口径石英るつぼの製造方法
DE19719133C2 (de) * 1997-05-07 1999-09-02 Heraeus Quarzglas Glocke aus Quarzglas und Verfahren für ihre Herstellung
DE19917288C2 (de) * 1999-04-16 2001-06-28 Heraeus Quarzglas Quarzglas-Tiegel
US6814833B2 (en) 2001-10-26 2004-11-09 Corning Incorporated Direct bonding of articles containing silicon
EP1359466A1 (de) * 2002-05-01 2003-11-05 ASML Netherlands B.V. Halter, lithographischer Projektionsapparat, Verfahren zur Herstellung eines Halters und Verfahren zur Herstellung einer Vorrichtung
EP1359469B1 (de) 2002-05-01 2011-03-02 ASML Netherlands B.V. Halter, lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung

Also Published As

Publication number Publication date
JP2007523030A (ja) 2007-08-16
WO2005062127A2 (en) 2005-07-07
DE602004007409D1 (de) 2007-08-16
TWI253102B (en) 2006-04-11
TW200535924A (en) 2005-11-01
US20050132750A1 (en) 2005-06-23
DE602004007409T2 (de) 2008-03-06
JP4444971B2 (ja) 2010-03-31
US8105457B2 (en) 2012-01-31
WO2005062127A3 (en) 2006-01-05
EP1697800B1 (de) 2007-07-04
EP1697800A2 (de) 2006-09-06

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