ATE368568T1 - Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat - Google Patents

Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat

Info

Publication number
ATE368568T1
ATE368568T1 AT99943149T AT99943149T ATE368568T1 AT E368568 T1 ATE368568 T1 AT E368568T1 AT 99943149 T AT99943149 T AT 99943149T AT 99943149 T AT99943149 T AT 99943149T AT E368568 T1 ATE368568 T1 AT E368568T1
Authority
AT
Austria
Prior art keywords
foil
gasket
substrate
outlet aperture
pasty material
Prior art date
Application number
AT99943149T
Other languages
English (en)
Inventor
David Williams
Original Assignee
Dek Int Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9819625.6A external-priority patent/GB9819625D0/en
Priority claimed from GBGB9827763.5A external-priority patent/GB9827763D0/en
Application filed by Dek Int Gmbh filed Critical Dek Int Gmbh
Application granted granted Critical
Publication of ATE368568T1 publication Critical patent/ATE368568T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Die Bonding (AREA)
  • Liquid Crystal (AREA)
AT99943149T 1998-09-10 1999-09-06 Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat ATE368568T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GBGB9819625.6A GB9819625D0 (en) 1998-09-10 1998-09-10 Method and apparatus for applying a viscous or paste material onto a substrate
GBGB9825158.0A GB9825158D0 (en) 1998-09-10 1998-11-18 Method and apparatus for supplying a viscous or paste material onto a substrate
GBGB9827763.5A GB9827763D0 (en) 1998-09-10 1998-12-18 Method and apparatus for applying a viscous or past material onto a substrate
GBGB9903146.0A GB9903146D0 (en) 1998-09-10 1999-02-12 Method and apparatus for applying a viscous or paste material onto a substrate

Publications (1)

Publication Number Publication Date
ATE368568T1 true ATE368568T1 (de) 2007-08-15

Family

ID=27451830

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99943149T ATE368568T1 (de) 1998-09-10 1999-09-06 Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat

Country Status (8)

Country Link
US (1) US6725769B1 (de)
EP (1) EP1113931B1 (de)
JP (1) JP2002524325A (de)
AT (1) ATE368568T1 (de)
AU (1) AU5641999A (de)
DE (1) DE69936725T2 (de)
GB (2) GB9903146D0 (de)
WO (1) WO2000015436A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395087B1 (en) * 1994-12-27 2002-05-28 Visteon Global Technologies, Inc. Method and apparatus for dispensing viscous material
GB2352682A (en) * 1999-04-08 2001-02-07 Crossflow Internat Ltd Method and apparatus for displacing flowable materials
GB9913496D0 (en) * 1999-06-10 1999-08-11 Williams David G Improved squeegee or sealing means/wiper
EP1273213B1 (de) 2000-04-04 2007-03-07 DEK International GmbH Verfahren und vorrichtung zum aufbringen von viskosem oder pastösem material auf ein substrat
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6800232B2 (en) 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
CN1444839A (zh) 2000-05-31 2003-09-24 Ttm先进电路公司 填充方法
CN1444840A (zh) 2000-05-31 2003-09-24 霍尼韦尔国际公司 填充装置
JP3685053B2 (ja) * 2000-12-05 2005-08-17 松下電器産業株式会社 スクリーン印刷装置
KR100782227B1 (ko) * 2006-02-23 2007-12-05 엘에스전선 주식회사 스크린 프린터의 스퀴즈
US7410092B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Fill head for injection molding of solder
US7694869B2 (en) * 2006-04-21 2010-04-13 International Business Machines Corporation Universal mold for injection molding of solder
US7416104B2 (en) * 2006-04-21 2008-08-26 International Business Machines Corporation Rotational fill techniques for injection molding of solder
US9314864B2 (en) * 2007-07-09 2016-04-19 International Business Machines Corporation C4NP compliant solder fill head seals
US7980445B2 (en) 2008-01-23 2011-07-19 International Business Machines Corporation Fill head for full-field solder coverage with a rotatable member
JP4643719B2 (ja) * 2009-02-09 2011-03-02 ヤマハ発動機株式会社 はんだ供給装置、印刷装置および印刷方法
JP5251579B2 (ja) * 2009-02-12 2013-07-31 株式会社デンソー ペースト状物質を有底孔に充填する方法及び装置
US8444770B2 (en) * 2009-06-29 2013-05-21 Ttm Technologies, Inc. System for cleaning components for filling holes in a printed circuit board with a fluid fill material
US8122847B2 (en) 2009-06-29 2012-02-28 Ttm Technologies, Inc. System for filling holes in a printed circuit board with a fluid fill material
JP5947098B2 (ja) * 2011-05-13 2016-07-06 株式会社半導体エネルギー研究所 ガラス封止体の作製方法および発光装置の作製方法
US8511805B2 (en) 2011-12-28 2013-08-20 Hewlett-Packard Indigo B.V. Extracting liquid from a cartridge
US8632171B2 (en) 2011-12-28 2014-01-21 Hewlett-Packard Indigo B.V. Ink cartridges and outputting ink from ink cartridges
JP6430955B2 (ja) 2012-12-06 2018-11-28 スリーエム イノベイティブ プロパティズ カンパニー 液体コーティングされた基材上の液体の離散的コーティング、及び積層体の形成における使用
CN104812501B (zh) 2012-12-06 2018-07-17 3M创新有限公司 粘性液体的精密涂层以及在形成层合物中的用途
US20150321463A1 (en) * 2014-05-09 2015-11-12 GroupeSTAHL Flexible platen cover and a heat press having a flexible platen cover
ITUB20150485A1 (it) * 2015-03-13 2016-09-13 Sacmi Sistema di tenuta per plastica fusa

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1433957A (en) * 1974-01-29 1976-04-28 Mitter & Co Apparatus for applying fluid or pasty printing media for screen printing machines
US4043683A (en) * 1974-06-20 1977-08-23 Loctite Corporation Dispensing and wiping device
US4023486A (en) * 1974-08-01 1977-05-17 E.T. Barwick Industries Screen printing squeegee apparatus
DE2653912A1 (de) * 1976-11-27 1978-06-01 Mathias Mitter Vorrichtung zum bemustern und faerben von druckgut, insbesondere textilgut, das entweder in bahnen oder flaechigen einzelstuecken vorliegt mittels einer flachdrucksiebschablone
US4541395A (en) * 1984-01-23 1985-09-17 Leroy Geiger Pressure regulation in pumping a liquid
US4622239A (en) 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
US4961955A (en) * 1988-12-20 1990-10-09 Itt Corporation Solder paste applicator for circuit boards
US5284189A (en) * 1992-03-16 1994-02-08 Printron, Inc. Conductive ink packaging for printed circuit board screen printing operations
NL9301820A (nl) * 1993-10-20 1995-05-16 Stork Screens Bv Rakelsamenstel.
US6286422B1 (en) * 1994-12-27 2001-09-11 Visteon Global Tech., Inc. Method and apparatus for dispensing viscous material
CN1077845C (zh) * 1994-12-27 2002-01-16 福特汽车公司 布施粘性材料的装置
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
US6158338A (en) * 1998-12-22 2000-12-12 Dek Printing Machines Limited Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate

Also Published As

Publication number Publication date
GB9903146D0 (en) 1999-04-07
AU5641999A (en) 2000-04-03
WO2000015436A1 (en) 2000-03-23
JP2002524325A (ja) 2002-08-06
GB2341347A (en) 2000-03-15
GB9920805D0 (en) 1999-11-10
US6725769B1 (en) 2004-04-27
EP1113931B1 (de) 2007-08-01
GB2341347B (en) 2001-04-18
DE69936725T2 (de) 2008-04-30
EP1113931A1 (de) 2001-07-11
DE69936725D1 (de) 2007-09-13

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