ATE371709T1 - Polierzusammensetzung und poliermethode - Google Patents

Polierzusammensetzung und poliermethode

Info

Publication number
ATE371709T1
ATE371709T1 AT05006024T AT05006024T ATE371709T1 AT E371709 T1 ATE371709 T1 AT E371709T1 AT 05006024 T AT05006024 T AT 05006024T AT 05006024 T AT05006024 T AT 05006024T AT E371709 T1 ATE371709 T1 AT E371709T1
Authority
AT
Austria
Prior art keywords
polishing
polishing composition
composition
iron
alloy containing
Prior art date
Application number
AT05006024T
Other languages
English (en)
Inventor
Kazusei Tamai
Yasuyuki Yamato
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Application granted granted Critical
Publication of ATE371709T1 publication Critical patent/ATE371709T1/de

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H17/00—Fencing, e.g. fences, enclosures, corrals
    • E04H17/02—Wire fencing, e.g. made of wire mesh
    • E04H17/06—Parts for wire fences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Disintegrating Or Milling (AREA)
AT05006024T 2004-03-19 2005-03-18 Polierzusammensetzung und poliermethode ATE371709T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004081583A JP2005268664A (ja) 2004-03-19 2004-03-19 研磨用組成物

Publications (1)

Publication Number Publication Date
ATE371709T1 true ATE371709T1 (de) 2007-09-15

Family

ID=34836612

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05006024T ATE371709T1 (de) 2004-03-19 2005-03-18 Polierzusammensetzung und poliermethode

Country Status (6)

Country Link
US (2) US20050204637A1 (de)
EP (1) EP1577357B1 (de)
JP (1) JP2005268664A (de)
KR (1) KR101110717B1 (de)
AT (1) ATE371709T1 (de)
DE (1) DE602005002164T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006077127A (ja) * 2004-09-09 2006-03-23 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP2006086462A (ja) 2004-09-17 2006-03-30 Fujimi Inc 研磨用組成物およびそれを用いた配線構造体の製造法
US20070068902A1 (en) * 2005-09-29 2007-03-29 Yasushi Matsunami Polishing composition and polishing method
FR2893939B1 (fr) * 2005-11-29 2008-02-22 Snecma Propulsion Solide Sa Protection contre l'oxydation de materiaux composites contenant du carbone
CN101153205A (zh) * 2006-09-29 2008-04-02 安集微电子（上海）有限公司 用于抛光低介电材料的化学机械抛光液
JP2008135453A (ja) * 2006-11-27 2008-06-12 Fujimi Inc 研磨用組成物及び研磨方法
JP2008135452A (ja) * 2006-11-27 2008-06-12 Fujimi Inc 研磨用組成物及び研磨方法
US20080135520A1 (en) * 2006-12-12 2008-06-12 Tao Sun Chemical composition for chemical mechanical planarization
JP5523662B2 (ja) * 2007-09-25 2014-06-18 富士フイルム株式会社 研磨液及び研磨方法
US20140308155A1 (en) * 2011-11-25 2014-10-16 Fujimi Incorporated Method for polishing alloy material and method for producing alloy material
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
KR102226441B1 (ko) * 2013-02-13 2021-03-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마용 조성물 제조 방법 및 연마물 제조 방법
EP3261114B1 (de) * 2015-02-19 2021-01-13 Fujimi Incorporated Zusammensetzung für siliciumwafer-polierung und polierverfahren
SG10201602672UA (en) 2015-04-06 2016-11-29 Cabot Microelectronics Corp Cmp composition and method for polishing rigid disks
CN115353808B (zh) * 2022-07-13 2024-01-23 锦矽半导体(上海)有限公司 一种镍镀层用抛光液

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5428721A (en) * 1990-02-07 1995-06-27 Kabushiki Kaisha Toshiba Data processing apparatus for editing image by using image conversion
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
JP3397501B2 (ja) * 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
JP3507628B2 (ja) * 1996-08-06 2004-03-15 昭和電工株式会社 化学的機械研磨用研磨組成物
US5954997A (en) * 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
US6126853A (en) * 1996-12-09 2000-10-03 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US5759917A (en) * 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
US6432828B2 (en) * 1998-03-18 2002-08-13 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
HK1040412B (en) * 1998-10-23 2011-05-20 Fujifilm Planar Solutions, LLC A chemical mechanical polishing slurry system having an activator solution
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2001053039A (ja) * 1999-08-05 2001-02-23 Okamoto Machine Tool Works Ltd ウエハの研磨終点検出方法および研磨終点検出装置
KR20020026954A (ko) * 1999-08-13 2002-04-12 에이취. 캐롤 번스타인 화학 기계적 연마 시스템 및 그의 사용 방법
US6471735B1 (en) * 1999-08-17 2002-10-29 Air Liquide America Corporation Compositions for use in a chemical-mechanical planarization process
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
US6432826B1 (en) * 1999-11-29 2002-08-13 Applied Materials, Inc. Planarized Cu cleaning for reduced defects
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
US6541384B1 (en) * 2000-09-08 2003-04-01 Applied Materials, Inc. Method of initiating cooper CMP process
JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法
JP2002113431A (ja) * 2000-10-10 2002-04-16 Tokyo Electron Ltd 洗浄方法
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP3541225B2 (ja) * 2001-07-16 2004-07-07 宇宙科学研究所長 大型膜宇宙構造物およびその展開方法
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
MY133305A (en) * 2001-08-21 2007-11-30 Kao Corp Polishing composition
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US20030219982A1 (en) * 2002-05-23 2003-11-27 Hitachi Chemical Co., Ltd CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
JP4083502B2 (ja) * 2002-08-19 2008-04-30 株式会社フジミインコーポレーテッド 研磨方法及びそれに用いられる研磨用組成物
JP4593064B2 (ja) * 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP3981616B2 (ja) * 2002-10-02 2007-09-26 株式会社フジミインコーポレーテッド 研磨用組成物
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
US7485162B2 (en) * 2003-09-30 2009-02-03 Fujimi Incorporated Polishing composition
US20050076580A1 (en) * 2003-10-10 2005-04-14 Air Products And Chemicals, Inc. Polishing composition and use thereof
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
WO2005047410A1 (en) * 2003-11-14 2005-05-26 Showa Denko K.K. Polishing composition and polishing method
US20050136671A1 (en) * 2003-12-22 2005-06-23 Goldberg Wendy B. Compositions and methods for low downforce pressure polishing of copper

Also Published As

Publication number Publication date
KR20060044391A (ko) 2006-05-16
KR101110717B1 (ko) 2012-02-29
JP2005268664A (ja) 2005-09-29
US20080210665A1 (en) 2008-09-04
EP1577357A1 (de) 2005-09-21
DE602005002164T2 (de) 2008-05-21
US20050204637A1 (en) 2005-09-22
DE602005002164D1 (de) 2007-10-11
EP1577357B1 (de) 2007-08-29

Similar Documents

Publication Publication Date Title
DE602005002164D1 (de) Polierzusammensetzung und Poliermethode
TW200605263A (en) Polishing composition and polishing method
IL158559A0 (en) Acne treatment
TW200516134A (en) Novel slurry for chemical mechanical polishing of metals
IL147235A0 (en) Chemical mechanical polishing systems and methods for their use
MX2007005408A (es) Compuestos de aminoquinazolinas.
MY145771A (en) Controlled electrochemical polishing method
MY155900A (en) Cleaning and/or polishing compositions and method for use thereof
MXPA05009694A (es) Metodos para mejorar la calidad de la piel.
EA200300375A1 (ru) Производные 2-амино-2-алкил-4-гексеновой и -гексиновой кислот, которые могут быть использованы в качестве ингибиторов синтетазы оксида азота
DE60134995D1 (de) Verfahren und zusammensetzungen, die eine stearoyl-coa desuturase-hscd5 verwenden
DE602007010876D1 (de) Herstellung von Komponenten für orthopädische Verbindungsprothesen
ATE419225T1 (de) Verbundkeramikkörper sowie verfahren zum herstellen eines solchen
AU5124901A (en) Method for polishing a memory or rigid disk with an amino acid-containing composition
MY131964A (en) 2-amino-2-alkyl-5 heptenoic and heptynoic acid derivatives useful as nitric oxide synthase inhibitors
TW200617151A (en) Polishing composition and polishing method using the same
IL179441A (en) Method of measuring the activity of egln enzyme and of identifying an agent that modulates activity of said enzyme
SI1476438T1 (sl) Oksa- in tiadiazoli in njihova uporaba kot inhibitorji metaloproteinaze
UA83203C2 (uk) Тіазол-(бі)циклоалкілкарбоксаніліди, засіб на їх основі та застосування для боротьби з небажаними мікроорганізмами
WO2005053725A3 (en) Cancer treatment
GB2387101A (en) Compositions containing creatine and creatinine
MX344589B (es) Instrumento para el cuidado oral que incluye un agente para el cuidado oral.
TW200632156A (en) Process for treating a semiconductor wafer with a gaseous medium, and semiconductor wafer treated by this process
ATE522806T1 (de) Verfahren zum reduzieren der sauerstoffverlustrate aus wässrigen lösungen
MD3077C2 (ro) Electrolit pentru prelucrarea electrochimică dimensională a oţelurilor

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties