ATE374425T1 - Zweilagige schutzschicht - Google Patents

Zweilagige schutzschicht

Info

Publication number
ATE374425T1
ATE374425T1 AT02748067T AT02748067T ATE374425T1 AT E374425 T1 ATE374425 T1 AT E374425T1 AT 02748067 T AT02748067 T AT 02748067T AT 02748067 T AT02748067 T AT 02748067T AT E374425 T1 ATE374425 T1 AT E374425T1
Authority
AT
Austria
Prior art keywords
layer
dual
multilayer structure
embodiment combines
silicide
Prior art date
Application number
AT02748067T
Other languages
English (en)
Inventor
Sasa Bajt
James Folta
Eberhard Spiller
Original Assignee
Euv Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26746375&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE374425(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/898,833 external-priority patent/US20030008148A1/en
Application filed by Euv Llc filed Critical Euv Llc
Application granted granted Critical
Publication of ATE374425T1 publication Critical patent/ATE374425T1/de

Links

Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062—Devices having a multilayer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
    • G02B5/0825—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
    • G02B5/0825—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only
    • G02B5/0833—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only comprising inorganic materials only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0891—Ultraviolet [UV] mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Nanotechnology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electronic Switches (AREA)
AT02748067T 2001-07-03 2002-07-02 Zweilagige schutzschicht ATE374425T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/898,833 US20030008148A1 (en) 2001-07-03 2001-07-03 Optimized capping layers for EUV multilayers
US10/066,108 US6780496B2 (en) 2001-07-03 2002-02-01 Optimized capping layers for EUV multilayers

Publications (1)

Publication Number Publication Date
ATE374425T1 true ATE374425T1 (de) 2007-10-15

Family

ID=26746375

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02748067T ATE374425T1 (de) 2001-07-03 2002-07-02 Zweilagige schutzschicht

Country Status (7)

Country Link
EP (1) EP1402542B1 (de)
JP (1) JP4460284B2 (de)
KR (1) KR100749897B1 (de)
AT (1) ATE374425T1 (de)
AU (1) AU2002318192A1 (de)
DE (1) DE60222663T2 (de)
WO (1) WO2003005377A2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4521696B2 (ja) * 2003-05-12 2010-08-11 Ｈｏｙａ株式会社 反射多層膜付き基板及び反射型マスクブランクス並びに反射型マスク
JP4553239B2 (ja) * 2004-06-29 2010-09-29 Ｈｏｙａ株式会社 反射型マスクブランクス及び反射型マスク並びに半導体装置の製造方法
DE102005016591B4 (de) * 2005-04-11 2009-11-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Transmissionsfilter für den EUV-Spektralbereich
US7948675B2 (en) 2005-10-11 2011-05-24 Nikon Corporation Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
JP5061903B2 (ja) * 2005-10-11 2012-10-31 株式会社ニコン 多層膜反射鏡、多層膜反射鏡の製造方法、光学系、露光装置及びデバイスの製造方法
TWI427334B (zh) * 2007-02-05 2014-02-21 Zeiss Carl Smt Gmbh Ｅｕｖ蝕刻裝置反射光學元件
EP2297746A1 (de) 2008-07-07 2011-03-23 Philips Intellectual Property & Standards GmbH Extreme uv-strahlung reflektierendes element mit einem sputter-resistenten material
EP2157584A3 (de) * 2008-08-14 2011-07-13 ASML Netherlands B.V. Strahlungsquelle, Lithografiegerät und Herstellungsverfahren für ein Bauteil
WO2011071086A1 (ja) * 2009-12-09 2011-06-16 旭硝子株式会社 Ｅｕｖリソグラフィ用光学部材
KR20130111524A (ko) * 2010-07-27 2013-10-10 아사히 가라스 가부시키가이샤 Ｅｕｖ 리소그래피용 반사층 형성 기판, 및 ｅｕｖ 리소그래피용 반사형 마스크 블랭크
CN102621815B (zh) * 2011-01-26 2016-12-21 Asml荷兰有限公司 用于光刻设备的反射光学部件及器件制造方法
DE102011077983A1 (de) * 2011-06-22 2012-12-27 Carl Zeiss Smt Gmbh Verfahren zur Herstellung eines reflektiven optischen Elements für die EUV-Lithographie
US20140168758A1 (en) * 2012-12-13 2014-06-19 Kla-Tencor Corporation Carbon as grazing incidence euv mirror and spectral purity filter
DE102013102670A1 (de) 2013-03-15 2014-10-02 Asml Netherlands B.V. Optisches Element und optisches System für die EUV-Lithographie sowie Verfahren zur Behandlung eines solchen optischen Elements
KR20160003140A (ko) * 2013-05-09 2016-01-08 가부시키가이샤 니콘 광학 소자, 투영 광학계, 노광 장치 및 디바이스 제조 방법
JP6301127B2 (ja) * 2013-12-25 2018-03-28 Hoya株式会社 反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法
US11268911B2 (en) * 2019-01-04 2022-03-08 Kla-Tencor Corporation Boron-based capping layers for EUV optics
DE102020206117A1 (de) 2020-05-14 2021-11-18 Carl Zeiss Smt Gmbh Optisches Element, EUV-Lithographiesystem und Verfahren zum Bilden von Nanopartikeln
JP7577486B2 (ja) 2020-09-10 2024-11-05 信越化学工業株式会社 Ｅｕｖマスクブランク用多層反射膜付き基板、その製造方法及びｅｕｖマスクブランク
JP7420027B2 (ja) 2020-09-10 2024-01-23 信越化学工業株式会社 Ｅｕｖマスクブランク用多層反射膜付き基板、その製造方法及びｅｕｖマスクブランク

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5958605A (en) * 1997-11-10 1999-09-28 Regents Of The University Of California Passivating overcoat bilayer for multilayer reflective coatings for extreme ultraviolet lithography
US6229652B1 (en) * 1998-11-25 2001-05-08 The Regents Of The University Of California High reflectance and low stress Mo2C/Be multilayers
US6228512B1 (en) * 1999-05-26 2001-05-08 The Regents Of The University Of California MoRu/Be multilayers for extreme ultraviolet applications
TWI267704B (en) * 1999-07-02 2006-12-01 Asml Netherlands Bv Capping layer for EUV optical elements
DE10016008A1 (de) * 2000-03-31 2001-10-11 Zeiss Carl Villagensystem und dessen Herstellung
US6664554B2 (en) * 2001-01-03 2003-12-16 Euv Llc Self-cleaning optic for extreme ultraviolet lithography
JP2004524524A (ja) * 2001-01-26 2004-08-12 カール ツァイス エスエムテー アーゲー 狭周波数帯分光フィルタおよびその用途

Also Published As

Publication number Publication date
WO2003005377A3 (en) 2003-10-30
EP1402542A2 (de) 2004-03-31
DE60222663T2 (de) 2008-07-17
AU2002318192A1 (en) 2003-01-21
DE60222663D1 (de) 2007-11-08
JP2005516182A (ja) 2005-06-02
WO2003005377A2 (en) 2003-01-16
KR100749897B1 (ko) 2007-08-21
JP4460284B2 (ja) 2010-05-12
KR20040020959A (ko) 2004-03-09
EP1402542B1 (de) 2007-09-26

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