ATE375023T1 - Laservorrichtung zur materialbearbeitung - Google Patents

Laservorrichtung zur materialbearbeitung

Info

Publication number
ATE375023T1
ATE375023T1 AT04730285T AT04730285T ATE375023T1 AT E375023 T1 ATE375023 T1 AT E375023T1 AT 04730285 T AT04730285 T AT 04730285T AT 04730285 T AT04730285 T AT 04730285T AT E375023 T1 ATE375023 T1 AT E375023T1
Authority
AT
Austria
Prior art keywords
optical radiation
rare
emitted
earth doped
pulse
Prior art date
Application number
AT04730285T
Other languages
English (en)
Inventor
Stuart Woods
David Parker
Andrew Appleyard
Malcolm Varnham
Original Assignee
Spi Lasers Uk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spi Lasers Uk Ltd filed Critical Spi Lasers Uk Ltd
Application granted granted Critical
Publication of ATE375023T1 publication Critical patent/ATE375023T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2375—Hybrid lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Laser Beam Processing (AREA)
AT04730285T 2003-04-29 2004-04-29 Laservorrichtung zur materialbearbeitung ATE375023T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0309674 2003-04-29

Publications (1)

Publication Number Publication Date
ATE375023T1 true ATE375023T1 (de) 2007-10-15

Family

ID=33397016

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04730285T ATE375023T1 (de) 2003-04-29 2004-04-29 Laservorrichtung zur materialbearbeitung

Country Status (7)

Country Link
US (1) US20070036184A1 (de)
EP (1) EP1618635B1 (de)
JP (1) JP2006525659A (de)
AT (1) ATE375023T1 (de)
CA (1) CA2522800C (de)
DE (1) DE602004009302T2 (de)
WO (1) WO2004098003A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112004001527T5 (de) 2003-08-19 2006-07-06 Electro Scientific Industries, Inc., Portland Verfahren und Lasersysteme zur Verbindungsbearbeitung unter Verwendung von Laserimpulsen mit speziell zugeschnittenen Leistungsprofilen
US7396706B2 (en) 2004-12-09 2008-07-08 Electro Scientific Industries, Inc. Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
US7289549B2 (en) 2004-12-09 2007-10-30 Electro Scientific Industries, Inc. Lasers for synchronized pulse shape tailoring
WO2006062744A2 (en) * 2004-12-09 2006-06-15 Electro Scientific Industries, Inc. Methods and systems for synchronized pulse shape tailoring
JP4708109B2 (ja) * 2005-07-22 2011-06-22 芝浦メカトロニクス株式会社 ファイバレーザ装置
US9789631B2 (en) 2006-12-19 2017-10-17 Koninklijke Philips N.V. System for and method of heating objects in a production line
GB2445771A (en) * 2007-01-19 2008-07-23 Gsi Group Ltd A diode pumped CW laser
JP5345334B2 (ja) * 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
US8934509B2 (en) * 2009-11-23 2015-01-13 Lockheed Martin Corporation Q-switched oscillator seed-source for MOPA laser illuminator method and apparatus
EP2392429A1 (de) * 2010-06-03 2011-12-07 Lasag Ag Laserbearbeitungsverfahren und -anlage, insbesondere zum Schweißen, mit Änderung der Leistung für jede Pulse
CN103259156B (zh) * 2012-02-20 2015-03-18 中国科学院理化技术研究所 一种产生高平均功率高重复频率脉冲钠信标激光的装置
DE102012021723A1 (de) * 2012-11-05 2014-02-20 Gallus Druckmaschinen Gmbh Vorrichtung und Verfahren zum Schneiden mit Laser-Array
CN103208727A (zh) * 2013-04-12 2013-07-17 上海飞博激光科技有限公司 输出特殊波形的光纤激光器
TW201528379A (zh) * 2013-12-20 2015-07-16 應用材料股份有限公司 雙波長退火方法與設備
JP6347676B2 (ja) * 2014-06-19 2018-06-27 株式会社フジクラ ファイバレーザ装置及び被加工物の加工方法
GB201502149D0 (en) * 2015-02-09 2015-03-25 Spi Lasers Uk Ltd Apparatus and method for laser welding
CN108227595B (zh) * 2018-03-02 2023-11-24 武汉华工激光工程有限责任公司 激光器脉冲同步控制方法及系统
JP7608038B2 (ja) * 2018-09-21 2025-01-06 浜松ホトニクス株式会社 レーザ装置及びレーザ波形制御方法
CN113857666A (zh) * 2021-09-28 2021-12-31 远景动力技术(江苏)有限公司 双层铝极耳与双层铜极耳的激光焊接方法、激光焊接装置及锂电池

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2318168A1 (fr) * 1975-07-18 1977-02-11 Produits Ind Cie Fse Nouveaux amides phosphonyles et leur utilisation dans des procedes d'ignifugation
US4152575A (en) * 1978-06-12 1979-05-01 United Technologies Corporation Method of material processing utilizing an interrupted beam of continuous wave laser radiation
US5867305A (en) * 1996-01-19 1999-02-02 Sdl, Inc. Optical amplifier with high energy levels systems providing high peak powers
DE19624514C1 (de) * 1996-06-19 1997-07-17 Siemens Ag Laserdiode-Modulator-Kombination
US6151338A (en) * 1997-02-19 2000-11-21 Sdl, Inc. High power laser optical amplifier system
US5818630A (en) * 1997-06-25 1998-10-06 Imra America, Inc. Single-mode amplifiers and compressors based on multi-mode fibers
US6281471B1 (en) * 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
JP2002280324A (ja) * 2001-03-16 2002-09-27 Sony Corp レーザ装置

Also Published As

Publication number Publication date
US20070036184A1 (en) 2007-02-15
DE602004009302D1 (de) 2007-11-15
JP2006525659A (ja) 2006-11-09
WO2004098003A1 (en) 2004-11-11
DE602004009302T2 (de) 2008-07-10
EP1618635B1 (de) 2007-10-03
EP1618635A1 (de) 2006-01-25
CA2522800A1 (en) 2004-11-11
CA2522800C (en) 2012-10-02

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Legal Events

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