ATE377259T1 - Selbstlernendes robotisches trägerbehandlungssystem - Google Patents

Selbstlernendes robotisches trägerbehandlungssystem

Info

Publication number
ATE377259T1
ATE377259T1 AT01939753T AT01939753T ATE377259T1 AT E377259 T1 ATE377259 T1 AT E377259T1 AT 01939753 T AT01939753 T AT 01939753T AT 01939753 T AT01939753 T AT 01939753T AT E377259 T1 ATE377259 T1 AT E377259T1
Authority
AT
Austria
Prior art keywords
carrier
buffer
input
calibration
output
Prior art date
Application number
AT01939753T
Other languages
English (en)
Inventor
Paul Sagues
Robert Wiggers
Nathan Harding
Sanjay Aggarwal
Original Assignee
Berkeley Process Control Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berkeley Process Control Inc filed Critical Berkeley Process Control Inc
Application granted granted Critical
Publication of ATE377259T1 publication Critical patent/ATE377259T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404Storage means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Warehouses Or Storage Devices (AREA)
AT01939753T 2000-06-13 2001-05-30 Selbstlernendes robotisches trägerbehandlungssystem ATE377259T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/592,314 US6304051B1 (en) 1999-03-15 2000-06-13 Self teaching robotic carrier handling system

Publications (1)

Publication Number Publication Date
ATE377259T1 true ATE377259T1 (de) 2007-11-15

Family

ID=24370171

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01939753T ATE377259T1 (de) 2000-06-13 2001-05-30 Selbstlernendes robotisches trägerbehandlungssystem

Country Status (7)

Country Link
US (1) US6304051B1 (de)
EP (1) EP1290452B1 (de)
JP (1) JP4979110B2 (de)
AT (1) ATE377259T1 (de)
AU (1) AU2001265237A1 (de)
DE (1) DE60131162T2 (de)
WO (1) WO2001096884A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506009B1 (en) * 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
US20030110649A1 (en) * 2001-12-19 2003-06-19 Applied Materials, Inc. Automatic calibration method for substrate carrier handling robot and jig for performing the method
US6822413B2 (en) * 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
WO2004001582A1 (en) 2002-06-19 2003-12-31 Brooks Automation, Inc. Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists
US20040081546A1 (en) 2002-08-31 2004-04-29 Applied Materials, Inc. Method and apparatus for supplying substrates to a processing tool
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
KR100880291B1 (ko) 2002-10-11 2009-01-23 브룩스 오토메이션, 인크. 자동 재료 핸들링 시스템
US6996456B2 (en) * 2002-10-21 2006-02-07 Fsi International, Inc. Robot with tactile sensor device
US7230702B2 (en) * 2003-11-13 2007-06-12 Applied Materials, Inc. Monitoring of smart pin transition timing
KR20070054683A (ko) 2004-08-23 2007-05-29 브룩스 오토메이션 인코퍼레이티드 승강기 기반의 도구 적재 및 버퍼링 시스템
JP4670808B2 (ja) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 コンテナの搬送システム及び測定用コンテナ
CH699754B1 (de) * 2008-10-20 2020-11-13 Tec Sem Ag Speichervorrichtung für eine Zwischenlagerung von Objekten für die Produktion von Halbleiterbauelementen
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
US8692503B2 (en) * 2009-12-18 2014-04-08 Varian Medical Systems, Inc. Homing and establishing reference frames for motion axes in radiation systems
US9196518B1 (en) * 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
US10002781B2 (en) 2014-11-10 2018-06-19 Brooks Automation, Inc. Tool auto-teach method and apparatus
CN107107336B (zh) 2014-11-18 2021-04-02 柿子技术公司 具有末端执行器位置估计的机器人自适应放置系统
US10065319B2 (en) * 2015-11-30 2018-09-04 Delta Electronics, Inc. Tool calibration apparatus of robot manipulator
KR102166345B1 (ko) * 2018-10-05 2020-10-15 세메스 주식회사 스토커
KR102150670B1 (ko) * 2018-11-01 2020-09-01 세메스 주식회사 스토커
US11643286B2 (en) 2018-11-12 2023-05-09 Bpm Microsystems Automated teaching of pick and place workflow locations on an automated programming system
KR102246792B1 (ko) * 2020-10-08 2021-04-30 세메스 주식회사 스토커
KR102584512B1 (ko) * 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
CN115241106B (zh) * 2022-08-03 2024-07-23 魅杰光电科技(上海)有限公司 一种晶圆工位提升机
JP2024078532A (ja) * 2022-11-30 2024-06-11 株式会社安川電機 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0790494B2 (ja) * 1987-08-22 1995-10-04 ファナック株式会社 視覚センサのキャリブレ−ション方法
US5019233A (en) * 1988-10-31 1991-05-28 Eaton Corporation Sputtering system
JPH06110543A (ja) * 1992-09-30 1994-04-22 Nippon Telegr & Teleph Corp <Ntt> 直接教示装置
US5535306A (en) * 1993-01-28 1996-07-09 Applied Materials Inc. Self-calibration system for robot mechanisms
US5563798A (en) * 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US5980183A (en) * 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
NL1006461C2 (nl) * 1997-07-03 1999-01-05 Asm Int Opslagsamenstel voor wafers.
US6164894A (en) * 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
US6079927A (en) * 1998-04-22 2000-06-27 Varian Semiconductor Equipment Associates, Inc. Automated wafer buffer for use with wafer processing equipment
US6323616B1 (en) * 1999-03-15 2001-11-27 Berkeley Process Control, Inc. Self teaching robotic wafer handling system
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
JP2001202123A (ja) * 2000-01-18 2001-07-27 Sony Corp 搬送ロボットの教示方法

Also Published As

Publication number Publication date
DE60131162T2 (de) 2008-08-14
EP1290452A4 (de) 2006-06-21
JP4979110B2 (ja) 2012-07-18
EP1290452B1 (de) 2007-10-31
AU2001265237A1 (en) 2001-12-24
JP2004503926A (ja) 2004-02-05
EP1290452A1 (de) 2003-03-12
US6304051B1 (en) 2001-10-16
DE60131162D1 (de) 2007-12-13
WO2001096884A1 (en) 2001-12-20

Similar Documents

Publication Publication Date Title
DE60131162D1 (de) Selbstlernendes robotisches trägerbehandlungssystem
KR102380422B1 (ko) 웨이퍼 처리 시스템
US9340372B2 (en) Workpiece inspection equipment
WO2002101792A3 (en) Method and apparatus for alignment of automated workpiece handling systems
HK1052770A1 (zh) 高产率的加工系统及其使用方法
EP1047115A3 (de) Verfahren und Vorrichtung zum Ausrichten einer Kassette
US9665946B2 (en) Article conveyor system
KR950015707A (ko) 레지스트 처리장치 및 기판처리장치 및 피처리체의 반송방법
EP3336015A1 (de) Spülvorrichtung, spüllagervorrichtung und reinigungsverfahren
DE50002092D1 (de) Verfahren und vorrichtung zum kalibrieren von robotermessstationen, manipulatoren und mitgeführten optischen messeinrichtungen
KR102290940B1 (ko) 프레임 유닛 반송 시스템
TW200731452A (en) Method for determining position of semiconductor wafer, and apparatus using the same
EP1327495A4 (de) Messverfahren und -vorrichtung , mit einer solchen vorrichtung ausgerüstete werkzeugmaschine und bearbeitungsverfahren
DE60214763D1 (de) Waferhandhabungsvorrichtung und verfahren dafür
EP1413404A3 (de) Verfahren und Vorrichtung zum Transportieren von Gegenständen mit zwei Robotern
EP1061558A3 (de) Kantenkontakt für einen Ladungsnapf
WO2004043831A3 (en) Systems and methods of sorting samples
CN101992189A (zh) 工件检测分拣装置及方法
DE59814140D1 (de) Verfahren und Vorrichtung zum Handhaben von scheibenförmigen Gegenständen, insbesondere Silizium-Wafer
JP2004503926A5 (de)
MY140551A (en) System for processing electronic devices
TW345566B (en) Control system for use with semiconductor device transporting and handling apparatus
US6708816B2 (en) Device for handling components
WO2006133039A3 (en) Workpiece handling alignment system
JP7245118B2 (ja) 処理装置

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1290452

Country of ref document: EP

EEIH Change in the person of patent owner