ATE383585T1 - Magnetometergehäuse - Google Patents

Magnetometergehäuse

Info

Publication number
ATE383585T1
ATE383585T1 AT02725366T AT02725366T ATE383585T1 AT E383585 T1 ATE383585 T1 AT E383585T1 AT 02725366 T AT02725366 T AT 02725366T AT 02725366 T AT02725366 T AT 02725366T AT E383585 T1 ATE383585 T1 AT E383585T1
Authority
AT
Austria
Prior art keywords
housing
board
sealing element
sensing elements
bore
Prior art date
Application number
AT02725366T
Other languages
English (en)
Inventor
Joel Bodin
Michael Boblinger
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of ATE383585T1 publication Critical patent/ATE383585T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/0206—Three-component magnetometers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Magnetic Variables (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Eye Examination Apparatus (AREA)
AT02725366T 2001-03-29 2002-03-26 Magnetometergehäuse ATE383585T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/681,396 US6504366B2 (en) 2001-03-29 2001-03-29 Magnetometer package

Publications (1)

Publication Number Publication Date
ATE383585T1 true ATE383585T1 (de) 2008-01-15

Family

ID=24735106

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02725366T ATE383585T1 (de) 2001-03-29 2002-03-26 Magnetometergehäuse

Country Status (6)

Country Link
US (1) US6504366B2 (de)
EP (1) EP1373916B1 (de)
JP (1) JP2004522976A (de)
AT (1) ATE383585T1 (de)
DE (1) DE60224511D1 (de)
WO (1) WO2002079790A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7028387B1 (en) 2003-03-26 2006-04-18 Advanced Neuromodulation Systems, Inc. Method of making a miniaturized positional assembly
US6960912B2 (en) * 2003-05-12 2005-11-01 Vacuumschmelze Gmbh & Co. Kg Magnetic field sensor device
WO2005026761A1 (en) * 2003-09-16 2005-03-24 Koninklijke Philips Electronics N.V. A method of manufacturing an electronic device and an electronic device
US6933716B2 (en) * 2003-11-25 2005-08-23 Wolff Controls Corporation Minimized cross-section sensor package
US7095226B2 (en) * 2003-12-04 2006-08-22 Honeywell International, Inc. Vertical die chip-on-board
US7126330B2 (en) * 2004-06-03 2006-10-24 Honeywell International, Inc. Integrated three-dimensional magnetic sensing device and method to fabricate an integrated three-dimensional magnetic sensing device
EP1770406A4 (de) * 2004-07-16 2010-03-03 Amosense Co Ltd Magnetsensorbaugruppe, geomagnetischer sensor, elementbaugruppe und tragbares endgerät
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
US7687882B2 (en) * 2006-04-14 2010-03-30 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
US7573112B2 (en) * 2006-04-14 2009-08-11 Allegro Microsystems, Inc. Methods and apparatus for sensor having capacitor on chip
US20080013298A1 (en) 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
KR100950676B1 (ko) 2008-01-07 2010-03-31 에스티에스반도체통신 주식회사 3축 지자기 센서 및 그 제조 방법
US8093670B2 (en) * 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US20100052424A1 (en) * 2008-08-26 2010-03-04 Taylor William P Methods and apparatus for integrated circuit having integrated energy storage device
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9488699B2 (en) * 2012-04-26 2016-11-08 Honeywell International Inc. Devices for sensing current
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US10309992B2 (en) 2013-08-30 2019-06-04 Honeywell International Inc. Stray magnetic field rejection for in-hole current-measurement systems
EP3149429B1 (de) * 2014-06-02 2019-05-29 Twinleaf LLC Leiterplattenintegriertes atomares magnetometer und gyroskop
GB2543338B (en) 2015-10-15 2021-09-15 Nal Ltd Detector access chamber
US10411498B2 (en) 2015-10-21 2019-09-10 Allegro Microsystems, Llc Apparatus and methods for extending sensor integrated circuit operation through a power disturbance
US10978897B2 (en) 2018-04-02 2021-04-13 Allegro Microsystems, Llc Systems and methods for suppressing undesirable voltage supply artifacts
JP6908014B2 (ja) * 2018-06-28 2021-07-21 株式会社デンソー 磁気検出モジュール、検出装置、ケースアセンブリ、及び、磁気検出モジュールの製造方法
WO2020004161A1 (ja) 2018-06-28 2020-01-02 株式会社デンソー 磁気検出モジュール、検出装置、ケースアセンブリ、及び、磁気検出モジュールの製造方法
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3822369A1 (de) 1987-12-18 1989-06-29 Rautenkranz Int Hermann Messsonde mit einem klein bauenden magnetometer und verfahren zur durchfuehrung von messungen mit einer solchen messsonde
US5121289A (en) * 1990-01-31 1992-06-09 Honeywell Inc. Encapsulatable sensor assembly
US5414355A (en) 1994-03-03 1995-05-09 Honeywell Inc. Magnet carrier disposed within an outer housing
US6169254B1 (en) * 1994-07-20 2001-01-02 Honeywell, Inc. Three axis sensor package on flexible substrate

Also Published As

Publication number Publication date
DE60224511D1 (en) 2008-02-21
JP2004522976A (ja) 2004-07-29
EP1373916A1 (de) 2004-01-02
US20020140422A1 (en) 2002-10-03
WO2002079790A1 (en) 2002-10-10
EP1373916B1 (de) 2008-01-09
US6504366B2 (en) 2003-01-07

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Legal Events

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