ATE384306T1 - Sensoreinheit, insbesondere für fingerabdrucksensoren - Google Patents

Sensoreinheit, insbesondere für fingerabdrucksensoren

Info

Publication number
ATE384306T1
ATE384306T1 AT01938853T AT01938853T ATE384306T1 AT E384306 T1 ATE384306 T1 AT E384306T1 AT 01938853 T AT01938853 T AT 01938853T AT 01938853 T AT01938853 T AT 01938853T AT E384306 T1 ATE384306 T1 AT E384306T1
Authority
AT
Austria
Prior art keywords
sensor unit
fingerprint sensors
substrate
chip
sensor
Prior art date
Application number
AT01938853T
Other languages
English (en)
Inventor
Mathiassen Svein
Ovidiu Vermesan
Jon Nysfther
Bjoern Seeberg
Original Assignee
Idex Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa filed Critical Idex Asa
Application granted granted Critical
Publication of ATE384306T1 publication Critical patent/ATE384306T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Image Input (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Thin Film Transistor (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
AT01938853T 2000-06-09 2001-06-08 Sensoreinheit, insbesondere für fingerabdrucksensoren ATE384306T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO20003004A NO315017B1 (no) 2000-06-09 2000-06-09 Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate

Publications (1)

Publication Number Publication Date
ATE384306T1 true ATE384306T1 (de) 2008-02-15

Family

ID=19911250

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01938853T ATE384306T1 (de) 2000-06-09 2001-06-08 Sensoreinheit, insbesondere für fingerabdrucksensoren

Country Status (12)

Country Link
US (2) US7251351B2 (de)
EP (1) EP1303828B1 (de)
JP (1) JP4708671B2 (de)
AT (1) ATE384306T1 (de)
AU (1) AU2001264429A1 (de)
CY (1) CY1107257T1 (de)
DE (1) DE60132460T2 (de)
DK (1) DK1303828T3 (de)
ES (1) ES2299488T3 (de)
NO (1) NO315017B1 (de)
PT (1) PT1303828E (de)
WO (1) WO2001099035A2 (de)

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* Cited by examiner, † Cited by third party
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Also Published As

Publication number Publication date
EP1303828B1 (de) 2008-01-16
JP4708671B2 (ja) 2011-06-22
WO2001099035A3 (en) 2002-05-02
DE60132460D1 (de) 2008-03-06
AU2001264429A1 (en) 2002-01-02
ES2299488T3 (es) 2008-06-01
CY1107257T1 (el) 2012-11-21
NO20003004D0 (no) 2000-06-09
US20030161512A1 (en) 2003-08-28
PT1303828E (pt) 2008-03-25
EP1303828A2 (de) 2003-04-23
DK1303828T3 (da) 2008-05-19
US20080002867A1 (en) 2008-01-03
US7251351B2 (en) 2007-07-31
US7848550B2 (en) 2010-12-07
DE60132460T2 (de) 2009-01-15
JP2003536085A (ja) 2003-12-02
NO20003004L (no) 2001-12-10
NO315017B1 (no) 2003-06-23
WO2001099035A2 (en) 2001-12-27

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