ATE387722T1 - Herstellung thermisch leitender stoffe durch flüssigmetallüberbrückte teilchengruppen - Google Patents

Herstellung thermisch leitender stoffe durch flüssigmetallüberbrückte teilchengruppen

Info

Publication number
ATE387722T1
ATE387722T1 AT01303105T AT01303105T ATE387722T1 AT E387722 T1 ATE387722 T1 AT E387722T1 AT 01303105 T AT01303105 T AT 01303105T AT 01303105 T AT01303105 T AT 01303105T AT E387722 T1 ATE387722 T1 AT E387722T1
Authority
AT
Austria
Prior art keywords
thermally conductive
liquid metal
production
conductive materials
particle groups
Prior art date
Application number
AT01303105T
Other languages
English (en)
Inventor
Sanjay Misra
Richard M Olson
Original Assignee
Bergquist Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co filed Critical Bergquist Co
Application granted granted Critical
Publication of ATE387722T1 publication Critical patent/ATE387722T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Ceramic Products (AREA)
  • Powder Metallurgy (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)
AT01303105T 2000-04-05 2001-03-30 Herstellung thermisch leitender stoffe durch flüssigmetallüberbrückte teilchengruppen ATE387722T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/543,661 US6339120B1 (en) 2000-04-05 2000-04-05 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters

Publications (1)

Publication Number Publication Date
ATE387722T1 true ATE387722T1 (de) 2008-03-15

Family

ID=24169008

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01303105T ATE387722T1 (de) 2000-04-05 2001-03-30 Herstellung thermisch leitender stoffe durch flüssigmetallüberbrückte teilchengruppen

Country Status (10)

Country Link
US (3) US6339120B1 (de)
EP (1) EP1143512B1 (de)
JP (1) JP2001329068A (de)
AT (1) ATE387722T1 (de)
CA (1) CA2343504A1 (de)
DE (3) DE1143512T1 (de)
ES (1) ES2163380T1 (de)
GR (1) GR20010300073T1 (de)
TR (1) TR200103156T3 (de)
TW (1) TW591776B (de)

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Also Published As

Publication number Publication date
EP1143512B1 (de) 2008-02-27
ES2163380T1 (es) 2002-02-01
CA2343504A1 (en) 2001-10-05
US6624224B1 (en) 2003-09-23
DE60132943T2 (de) 2009-02-26
DE60132125D1 (de) 2008-02-14
US6339120B1 (en) 2002-01-15
DE1143512T1 (de) 2002-04-18
TW591776B (en) 2004-06-11
USRE39992E1 (en) 2008-01-01
TR200103156T3 (tr) 2002-01-21
JP2001329068A (ja) 2001-11-27
EP1143512A3 (de) 2004-10-06
EP1143512A2 (de) 2001-10-10
GR20010300073T1 (en) 2001-12-31
DE60132943D1 (de) 2008-04-10
DE60132125T2 (de) 2008-12-18

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