ATE392010T1 - Mikro-relais - Google Patents

Mikro-relais

Info

Publication number
ATE392010T1
ATE392010T1 AT99902030T AT99902030T ATE392010T1 AT E392010 T1 ATE392010 T1 AT E392010T1 AT 99902030 T AT99902030 T AT 99902030T AT 99902030 T AT99902030 T AT 99902030T AT E392010 T1 ATE392010 T1 AT E392010T1
Authority
AT
Austria
Prior art keywords
support member
contact
upper portion
substrate
micro relay
Prior art date
Application number
AT99902030T
Other languages
English (en)
Inventor
Sridhar Uppili
D Victor
Pang Foo
Dirk Wagenaar
Krupka Kay
Helmut Schlaak
Original Assignee
Inst Of Microelectronics
Tyco Electronics Logistics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Of Microelectronics, Tyco Electronics Logistics Ag filed Critical Inst Of Microelectronics
Application granted granted Critical
Publication of ATE392010T1 publication Critical patent/ATE392010T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161—Controlling physical properties of the material
    • B81C2201/0163—Controlling internal stress of deposited layers
    • B81C2201/0167—Controlling internal stress of deposited layers by adding further layers of materials having complementary strains, i.e. compressive or tensile strain

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Saccharide Compounds (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Pressure Sensors (AREA)
AT99902030T 1999-02-04 1999-02-04 Mikro-relais ATE392010T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1999/000005 WO2000046852A1 (en) 1999-02-04 1999-02-04 Micro-relay

Publications (1)

Publication Number Publication Date
ATE392010T1 true ATE392010T1 (de) 2008-04-15

Family

ID=20430181

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99902030T ATE392010T1 (de) 1999-02-04 1999-02-04 Mikro-relais

Country Status (10)

Country Link
US (1) US6765300B1 (de)
EP (1) EP1166352B1 (de)
JP (1) JP2002537630A (de)
KR (1) KR100540245B1 (de)
CN (1) CN1173398C (de)
AT (1) ATE392010T1 (de)
CA (1) CA2361756A1 (de)
DE (1) DE69938511T2 (de)
TW (1) TW420814B (de)
WO (1) WO2000046852A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244367B2 (en) 2001-12-11 2007-07-17 Jds Uniphase Corporation Metal alloy elements in micromachined devices
SG101537A1 (en) * 2002-06-03 2004-01-30 Sensfab Pte Ltd Method of forming atomic force microscope tips
JP2004055410A (ja) * 2002-07-22 2004-02-19 Advantest Corp バイモルフスイッチ、バイモルフスイッチ製造方法、電子回路、及び電子回路製造方法
US6621022B1 (en) * 2002-08-29 2003-09-16 Intel Corporation Reliable opposing contact structure
KR20040092228A (ko) * 2003-04-25 2004-11-03 엘지전자 주식회사 저전압 마이크로 스위치
US20050134141A1 (en) * 2003-12-23 2005-06-23 Jovica Savic Meso-microelectromechanical system having a glass beam and method for its fabrication
JP4506529B2 (ja) * 2005-03-18 2010-07-21 オムロン株式会社 静電マイクロスイッチおよびその製造方法、ならびに静電マイクロスイッチを備えた装置
JP2007167998A (ja) * 2005-12-20 2007-07-05 Toshiba Corp 梁構造を有する装置、および半導体装置
JP4929753B2 (ja) * 2006-02-22 2012-05-09 オムロン株式会社 薄膜構造体の形成方法並びに薄膜構造体、振動センサ、圧力センサ及び加速度センサ
JP5118546B2 (ja) * 2008-04-25 2013-01-16 太陽誘電株式会社 電気式微小機械スイッチ
US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
US8558330B2 (en) * 2011-10-31 2013-10-15 Taiwan Semiconductor Manufacturing Co., Ltd. Deep well process for MEMS pressure sensor
CN108352277B (zh) * 2015-11-16 2021-02-26 卡文迪什动力有限公司 用于esd保护的自然闭合的mems开关
TWI683337B (zh) * 2018-10-05 2020-01-21 松川精密股份有限公司 微型繼電器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4205340C1 (en) * 1992-02-21 1993-08-05 Siemens Ag, 8000 Muenchen, De Micro-mechanical electrostatic relay with parallel electrodes - has frame shaped armature substrate with armature contacts above base electrode contacts on base substrate
JP3402642B2 (ja) * 1993-01-26 2003-05-06 松下電工株式会社 静電駆動型リレー
US5479042A (en) * 1993-02-01 1995-12-26 Brooktree Corporation Micromachined relay and method of forming the relay
DE4437261C1 (de) 1994-10-18 1995-10-19 Siemens Ag Mikromechanisches elektrostatisches Relais
US6483056B2 (en) * 2000-10-27 2002-11-19 Daniel J Hyman Microfabricated relay with multimorph actuator and electrostatic latch mechanism

Also Published As

Publication number Publication date
CN1173398C (zh) 2004-10-27
KR20010113675A (ko) 2001-12-28
JP2002537630A (ja) 2002-11-05
US6765300B1 (en) 2004-07-20
TW420814B (en) 2001-02-01
CN1338116A (zh) 2002-02-27
DE69938511D1 (de) 2008-05-21
EP1166352B1 (de) 2008-04-09
KR100540245B1 (ko) 2006-01-16
EP1166352A1 (de) 2002-01-02
CA2361756A1 (en) 2000-08-10
DE69938511T2 (de) 2009-05-07
WO2000046852A1 (en) 2000-08-10

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties