ATE398645T1 - HEAT AGING RESISTANT POLYAMIDES - Google Patents

HEAT AGING RESISTANT POLYAMIDES

Info

Publication number
ATE398645T1
ATE398645T1 AT06708109T AT06708109T ATE398645T1 AT E398645 T1 ATE398645 T1 AT E398645T1 AT 06708109 T AT06708109 T AT 06708109T AT 06708109 T AT06708109 T AT 06708109T AT E398645 T1 ATE398645 T1 AT E398645T1
Authority
AT
Austria
Prior art keywords
weight
heat aging
aging resistant
resistant polyamides
polyamides
Prior art date
Application number
AT06708109T
Other languages
German (de)
Inventor
Peter Eibeck
Jochen Engelmann
Ralf Neuhaus
Michael Fischer
Bernd Bruchmann
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Application granted granted Critical
Publication of ATE398645T1 publication Critical patent/ATE398645T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Artificial Filaments (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

Thermoplastic molding compositions comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.1 to 5% by weight of at least one polyethyleneimine homo- or copolymer, C) from 0.05 to 3% by weight of a lubricant, D) from 0.05 to 3% by weight of a copper-containing stabilizer or of a sterically hindered phenol or mixtures thereof, E) from 0 to 60% by weight of further additives, the sum of the percentages by weight of components A) to E) adding up to 100%.
AT06708109T 2005-02-08 2006-02-08 HEAT AGING RESISTANT POLYAMIDES ATE398645T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005005847A DE102005005847A1 (en) 2005-02-08 2005-02-08 Heat aging resistant polyamides

Publications (1)

Publication Number Publication Date
ATE398645T1 true ATE398645T1 (en) 2008-07-15

Family

ID=36636651

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06708109T ATE398645T1 (en) 2005-02-08 2006-02-08 HEAT AGING RESISTANT POLYAMIDES

Country Status (12)

Country Link
US (2) US20080262133A1 (en)
EP (1) EP1851265B1 (en)
JP (1) JP5118976B2 (en)
KR (2) KR20130041392A (en)
CN (1) CN101115786B (en)
AT (1) ATE398645T1 (en)
BR (1) BRPI0606914B1 (en)
DE (2) DE102005005847A1 (en)
ES (1) ES2306429T3 (en)
MY (1) MY139749A (en)
PL (1) PL1851265T3 (en)
WO (1) WO2006084862A1 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1683830A1 (en) 2005-01-12 2006-07-26 DSM IP Assets B.V. Heat stabilized moulding composition
EP1681313A1 (en) 2005-01-17 2006-07-19 DSM IP Assets B.V. Heat stabilized moulding composition
BRPI0721119A2 (en) 2006-12-15 2015-01-27 Basf Se WATER POLYMERIC DISPERSION, PROCESS FOR THE PREPARATION OF THEREOF, METHOD OF MODIFICATION OF THE RHEOLOGICAL PROPERTIES OF A WATER POLYMERIC DISPOSAL, AGRICULTURAL COATING MATERIAL, USES OF A POLYMERICAN ALTERNATE POLYMERICANT DISPOSAL FOLDER FOR PAPER COATING, AND, PAPER OR PAPER
ES2373007T3 (en) * 2007-12-18 2012-01-30 Basf Se THERMOPLASTIC POLYAMIDS WITH AMINES POLYETHER.
US7902287B2 (en) * 2008-01-21 2011-03-08 Basf Aktiengesellschaft Polyamide resin composition and method of preparing
JP2011515523A (en) * 2008-03-18 2011-05-19 ビーエーエスエフ ソシエタス・ヨーロピア Polyamide-nanocomposite with hyperbranched polyethyleneimine
KR20100126514A (en) * 2008-03-18 2010-12-01 바스프 에스이 Polyamide Nanocomposites with Highly Branched Polyetheramines
JP2012508314A (en) * 2008-11-11 2012-04-05 ビーエーエスエフ ソシエタス・ヨーロピア Stabilized polyamide
DE102008058246A1 (en) 2008-11-19 2010-05-20 Basf Se Thermoplastic molding composition, useful to produce fibers, films and moldings including e.g. intake manifolds, intercooler and circuit board components, comprises thermoplastic polyamide, polyethyleneimine homo or copolymer and additives
BRPI0922909B1 (en) * 2008-12-16 2019-06-25 Basf Se MATERIAL OF THERMOPLASTIC MOLDING, USE OF THERMOPLASTIC MOLDING MATERIALS, AND, FIBERS, SHEETS OR MOLDED BODY OF ANY KIND
DE102010062538A1 (en) 2009-12-17 2011-06-22 Basf Se, 67063 Producing welded molded body, useful e.g. as fender, comprises assembling and welding prefabricated molded parts comprising polyamide-6.10, polyethyleneimine homo- or copolymer, filler, copper-containing stabilizer and phenol and additive
US20120181487A1 (en) * 2011-01-18 2012-07-19 Basf Se Thermoplastic molding composition
JP5759532B2 (en) * 2011-02-22 2015-08-05 株式会社ブリヂストン Polyamide resin composition, method for producing the same, and refrigerant transport hose
EP2570448A1 (en) * 2011-09-13 2013-03-20 Basf Se Use of polyethylenimines in the production of polyamides
JP2015519465A (en) 2012-06-13 2015-07-09 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ Thermoplastic melt blend composition comprising an epoxy-carboxylic acid compound heat stabilizer
JP6416756B2 (en) 2012-06-13 2018-10-31 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ Thermoplastic melt blend composition containing amino acid heat stabilizer
JP2015519463A (en) 2012-06-13 2015-07-09 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ Thermoplastic melt blend composition containing polyetherol thermal stabilizer
US8871874B2 (en) 2012-06-13 2014-10-28 E I Du Pont De Nemours And Company Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation
ES2624127T3 (en) * 2012-10-10 2017-07-13 Lanxess Deutschland Gmbh Molding dough
JP6169280B2 (en) * 2013-08-21 2017-07-26 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ Composite plastic parts with improved adhesion between plastic components contained in the parts
KR102224391B1 (en) * 2013-08-21 2021-03-08 바스프 에스이 Composite plastic part with improved resistance to heat aging
EP3036276B1 (en) * 2013-08-21 2017-10-11 Basf Se Method for producing a composite plastic component
JP2015199938A (en) * 2014-04-03 2015-11-12 旭化成ケミカルズ株式会社 Polyamide resin composition and molded product
CN104045922A (en) * 2014-07-16 2014-09-17 苏州新区华士达工程塑胶有限公司 Improved EPDM
JP6724368B2 (en) * 2015-02-23 2020-07-15 東レ株式会社 Molded article and polyamide resin composition
US10836904B2 (en) 2016-10-18 2020-11-17 Ascend Performance Materials Operations Llc Low-halogen flame retardant polyamide compositions resistant to heat aging
JPWO2020121846A1 (en) * 2018-12-10 2021-09-27 日本曹達株式会社 Polyalkyleneimine-modified polyamide 4
EP3670576B8 (en) * 2018-12-19 2020-12-09 Ems-Chemie Ag Polyamide moulding material for glass compositions
US12312467B2 (en) 2019-03-06 2025-05-27 Basf Se Polyamide molding composition for high-gloss applications
CN115210319B (en) * 2020-02-26 2024-12-06 巴斯夫欧洲公司 Heat-resistant polyamide molding composition
US20230129664A1 (en) * 2020-03-25 2023-04-27 Basf Se Heat-aging resistant polyamide molding compositions
JP7732756B2 (en) * 2021-03-31 2025-09-02 旭化成株式会社 Polyamide composition, electrical component, and method for improving heat aging resistance, flowability, and ion migration resistance of electrical component
WO2023033043A1 (en) * 2021-09-01 2023-03-09 旭化成株式会社 Polyamide composition
JP7826102B2 (en) * 2022-04-12 2026-03-09 旭化成株式会社 Polyamide composition
CN115594966B (en) * 2022-09-30 2024-01-02 上海金发科技发展有限公司 Polyamide composite material and preparation method and application thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1794227A1 (en) * 1967-09-28 1971-11-18 Allied Chem Heat stabilized polyamides
ES372097A1 (en) * 1968-10-09 1971-12-16 Union Carbide Canada Ltd Procedure for preparing a nylon composition that has enhanced receptivity for acid dyes. (Machine-translation by Google Translate, not legally binding)
JPS54103475A (en) * 1978-02-01 1979-08-14 Mitsubishi Plastics Ind Ltd Preparation of laminated drawn film
JPH0418426A (en) * 1990-05-11 1992-01-22 Toyobo Co Ltd Readily bondable film having excellent blocking resistance
JPH04202357A (en) * 1990-11-29 1992-07-23 Toray Ind Inc Flame retardant polyamide resin composition excellent in thermal stability
JPH04220460A (en) * 1990-12-20 1992-08-11 Asahi Chem Ind Co Ltd Heat-resistant polyamide composition
DE4305166A1 (en) * 1993-02-19 1994-08-25 Bayer Ag Thermostable copper-containing polyamide molding compounds
DE4339509A1 (en) * 1993-11-22 1995-05-24 Basf Ag PPE / PA moldings for the production of moldings by means of blow molding, profile extrusion and pipe extrusion
DE19519820A1 (en) * 1995-05-31 1996-12-05 Bayer Ag Thermostable, weather-resistant polyamide molding compounds
JP3714788B2 (en) * 1998-02-13 2005-11-09 旭化成ケミカルズ株式会社 Process for producing pellets of polyamide resin composition having excellent molding characteristics
JP2000344960A (en) * 1999-03-31 2000-12-12 Chisso Corp Flame retardant resin composition, flame retardant sheet and film molding using the same
EP1065236B1 (en) * 1999-06-29 2003-09-24 Degussa AG Highly branched polyamide graft copolymers
DE10030553A1 (en) * 2000-06-29 2002-01-10 Basf Ag Stabilized thermoplastic molding compounds
DE10064333A1 (en) * 2000-12-21 2002-06-27 Degussa Multi-layer composite with an EVOH layer
JP4245327B2 (en) * 2002-10-25 2009-03-25 旭化成ケミカルズ株式会社 Polyamide resin composition
EP1498445A1 (en) * 2003-07-18 2005-01-19 DSM IP Assets B.V. Heat stabilized moulding composition

Also Published As

Publication number Publication date
EP1851265A1 (en) 2007-11-07
US20120149817A1 (en) 2012-06-14
EP1851265B1 (en) 2008-06-18
KR101278734B1 (en) 2013-06-25
DE502006000958D1 (en) 2008-07-31
DE102005005847A1 (en) 2006-08-10
CN101115786A (en) 2008-01-30
BRPI0606914B1 (en) 2017-04-04
JP5118976B2 (en) 2013-01-16
KR20070102739A (en) 2007-10-19
CN101115786B (en) 2012-06-20
WO2006084862A1 (en) 2006-08-17
ES2306429T3 (en) 2008-11-01
US20080262133A1 (en) 2008-10-23
MY139749A (en) 2009-10-30
BRPI0606914A2 (en) 2009-12-01
JP2008530290A (en) 2008-08-07
PL1851265T3 (en) 2008-11-28
KR20130041392A (en) 2013-04-24

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