ATE398656T1 - Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat - Google Patents

Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat

Info

Publication number: ATE398656T1
Authority: AT; Austria
Prior art keywords: layer circuit; film; curable composition; layer substrate; produced therefrom
Prior art date: 2000-03-30

Application number

AT01917732T

Other languages

English (en)

Inventor

Yasuhiro Wakizaka

Kanji Yuyama

Original Assignee

Zeon Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-03-30

Filing date

2001-03-30

Publication date

2008-07-15

2001-03-30 Application filed by Zeon Corp filed Critical Zeon Corp

2008-07-15 Application granted granted Critical

2008-07-15 Publication of ATE398656T1 publication Critical patent/ATE398656T1/de

Links

239000000758 substrate Substances 0.000 title abstract 2
RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
125000002723 alicyclic group Chemical group 0.000 abstract 1
125000003118 aryl group Chemical group 0.000 abstract 1
238000005266 casting Methods 0.000 abstract 1
239000003795 chemical substances by application Substances 0.000 abstract 1
230000001627 detrimental effect Effects 0.000 abstract 1
239000003063 flame retardant Substances 0.000 abstract 1
238000000034 method Methods 0.000 abstract 1
-1 phosphoric acid ester amide Chemical class 0.000 abstract 1
229920000570 polyether Polymers 0.000 abstract 1
229920000098 polyolefin Polymers 0.000 abstract 1
239000011347 resin Substances 0.000 abstract 1
229920005989 resin Polymers 0.000 abstract 1
239000000126 substance Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/60—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
General Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Laminated Bodies (AREA)
Compositions Of Macromolecular Compounds (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Epoxy Resins (AREA)

AT01917732T 2000-03-30 2001-03-30 Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat ATE398656T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2000095184A JP4231976B2 (ja)	2000-03-30	2000-03-30	硬化性組成物及び多層回路基板

Publications (1)

Publication Number	Publication Date
ATE398656T1 true ATE398656T1 (de)	2008-07-15

Family

ID=18610117

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT01917732T ATE398656T1 (de)	2000-03-30	2001-03-30	Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat

Country Status (7)

Country	Link
US (1)	US6955848B2 (de)
EP (1)	EP1275695B1 (de)
JP (1)	JP4231976B2 (de)
KR (1)	KR20020086732A (de)
AT (1)	ATE398656T1 (de)
DE (1)	DE60134467D1 (de)
WO (1)	WO2001072902A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4300382B2 (ja) *	2000-03-30	2009-07-22	日本ゼオン株式会社	絶縁材料、絶縁材料の製造方法および多層回路基板の製造方法
JP4770004B2 (ja) *	2000-06-30	2011-09-07	日立化成工業株式会社	樹脂組成物、積層板及び配線板
CN100339446C (zh) *	2002-04-15	2007-09-26	日本瑞翁株式会社	清漆、成型物、电绝缘膜、层压物、阻燃剂淤浆以及阻燃剂粒子和清漆的制造方法
JP3887357B2 (ja) *	2003-07-30	2007-02-28	日本油脂株式会社	めっき可能な架橋性樹脂組成物、架橋性樹脂成形品および架橋樹脂成形品
JP4694162B2 (ja) *	2004-07-21	2011-06-08	富士フイルム株式会社	硬化性樹脂組成物並びにこれを用いたカラーフィルタ用樹脂皮膜およびカラーフィルタ
US20090151984A1 (en) *	2005-08-26	2009-06-18	Zeon Corporation	Composite resin molded article, laminate, multi-layer circuit board, and electronic device
US7758964B2 (en) *	2006-02-10	2010-07-20	3M Innovative Properties Company	Flame resistant covercoat for flexible circuit
JP4984743B2 (ja) *	2006-08-24	2012-07-25	日本化成株式会社	架橋剤、架橋性エラストマー組成物およびその成形体、架橋性熱可塑性樹脂組成物およびその成形体
JP5092315B2 (ja) *	2006-08-24	2012-12-05	日本化成株式会社	イソシアヌレート誘導体、架橋剤、架橋性エラストマー組成物およびその成形体、架橋性熱可塑性樹脂組成物およびその成形体
WO2008047583A1 (en) *	2006-09-29	2008-04-24	Zeon Corporation	Curable resin composition, composite body, molded body, laminate and multilayer circuit board
JP2010077333A (ja) *	2008-09-29	2010-04-08	Fuji Electric Fa Components & Systems Co Ltd	難燃性樹脂組成物
WO2010042422A2 (en) *	2008-10-07	2010-04-15	3M Innovative Properties Company	Composition, method of making the same, and use thereof
JP5944909B2 (ja) *	2010-09-30	2016-07-05	ダウグローバルテクノロジーズエルエルシー	改良された層接着を有する可撓性多層電気物品を製造するための方法
KR101228734B1 (ko)	2010-11-05	2013-02-01	삼성전기주식회사	다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판
JP5323033B2 (ja) *	2010-12-06	2013-10-23	富士フイルム株式会社	カラーフィルタ用樹脂皮膜およびカラーフィルタ
KR20140064877A (ko) *	2011-08-23	2014-05-28	제온 코포레이션	경화성 수지 조성물, 필름, 프리프레그, 적층체, 경화물, 및 복합체
CN102926202B (zh) *	2012-09-25	2014-12-03	台州学院	一种阻燃涂层及其制备方法和应用
CN104870510A (zh) *	2012-12-13	2015-08-26	日本瑞翁株式会社	固化性树脂组合物、绝缘膜、预浸料、固化物、复合体、以及电子材料用基板
TWI540944B (zh) *	2014-07-14	2016-07-01	啟碁科技股份有限公司	基板結構的製造方法、基板結構以及金屬構件
CN105307378B (zh) *	2014-07-18	2018-10-19	启碁科技股份有限公司	基板结构的制造方法、基板结构以及金属构件
TWI526129B (zh) *	2014-11-05	2016-03-11	Elite Material Co Ltd	Multilayer printed circuit boards with dimensional stability
CN113150484B (zh) *	2021-03-23	2022-05-13	浙江大学	一种用于高频覆铜板的coc基复合基板材料及制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4269947A (en) *	1977-07-05	1981-05-26	Teijin Limited	Cured or uncured aromatic polyester composition and process for its production
US4292151A (en) *	1978-03-01	1981-09-29	Teijin Limited	Process for preparing a cured copolyetherester elastomeric composition
JPS5572304A (en) *	1978-11-28	1980-05-31	Teijin Ltd	Insulating material
JPS6055927B2 (ja) *	1978-11-28	1985-12-07	帝人株式会社	電気絶縁材
JPS5698161A (en)	1980-01-04	1981-08-07	Teijin Ltd	Manufacture of conductive composite film
US4691045A (en) *	1984-12-06	1987-09-01	Nippon Shokubai Kagaku Co., Ltd.	Hydroxyl group-containing (meth)acrylate oligomer, prepolymer therefrom, and method for use thereof
JPH01174522A (ja) *	1987-12-28	1989-07-11	Hitachi Chem Co Ltd	感光性樹脂組成物
JPH01174552A (ja)	1987-12-28	1989-07-11	Sakai Chem Ind Co Ltd	塩素含有樹脂組成物
US5180767A (en)	1988-12-21	1993-01-19	Mitsui Petrochemical Industries, Ltd.	Flame retardant cyclic olefinic polymer composition
JP2857893B2 (ja)	1988-12-21	1999-02-17	三井化学株式会社	難燃性環状オレフィン系重合体組成物
JPH0726014B2 (ja) *	1989-03-08	1995-03-22	旭化成工業株式会社	難燃化樹脂組成物
CN1036402C (zh) *	1991-01-11	1997-11-12	旭化成工业株式会社	可固化的聚苯氧树脂组合物及由它制成的薄膜
JP3282315B2 (ja) *	1993-09-28	2002-05-13	ジェイエスアール株式会社	難燃性樹脂組成物
KR100365545B1 (ko) *	1994-03-14	2003-04-11	후지쯔 가부시끼가이샤	에폭시기를갖는시클로올레핀수지조성물
JP3361616B2 (ja) *	1994-06-09	2003-01-07	積水化学工業株式会社	ポリオレフィン系難燃架橋性樹脂組成物
JPH08236942A (ja) *	1995-02-28	1996-09-13	Asahi Chem Ind Co Ltd	新しい多層回路基板
JPH10316665A (ja) *	1997-05-13	1998-12-02	Nippon Kasei Chem Co Ltd	置換イソシアヌレートの製造方法
JP3922318B2 (ja)	1997-09-30	2007-05-30	日本ゼオン株式会社	難燃性樹脂組成物
JPH11189743A (ja) *	1997-12-26	1999-07-13	Nippon Zeon Co Ltd	環状オレフィン系樹脂電線被覆材料
JP3952560B2 (ja) *	1997-10-31	2007-08-01	日本ゼオン株式会社	複合フィルム

2000
- 2000-03-30 JP JP2000095184A patent/JP4231976B2/ja not_active Expired - Fee Related
2001
- 2001-03-30 KR KR1020027012919A patent/KR20020086732A/ko not_active Abandoned
- 2001-03-30 EP EP01917732A patent/EP1275695B1/de not_active Expired - Lifetime
- 2001-03-30 WO PCT/JP2001/002798 patent/WO2001072902A1/ja not_active Ceased
- 2001-03-30 DE DE60134467T patent/DE60134467D1/de not_active Expired - Fee Related
- 2001-03-30 US US10/240,400 patent/US6955848B2/en not_active Expired - Fee Related
- 2001-03-30 AT AT01917732T patent/ATE398656T1/de not_active IP Right Cessation

Also Published As

Publication number	Publication date
KR20020086732A (ko)	2002-11-18
EP1275695B1 (de)	2008-06-18
EP1275695A4 (de)	2003-08-06
US6955848B2 (en)	2005-10-18
EP1275695A1 (de)	2003-01-15
WO2001072902A1 (en)	2001-10-04
JP4231976B2 (ja)	2009-03-04
US20030146421A1 (en)	2003-08-07
DE60134467D1 (de)	2008-07-31
JP2001279087A (ja)	2001-10-10

Legal Events

Date	Code	Title	Description
2008-12-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
DE60134467D1 (de)	2008-07-31	Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat
BR0002904B1 (pt)	2010-07-27	composto de camadas múltiplas termoplástico, bem como massa de moldar.
JP7102691B2 (ja)	2022-07-20	フレキシブルプリント配線板用銅張積層板及びフレキシブルプリント配線板
ATE370991T1 (de)	2007-09-15	Polyphenylenoxid-harze, prepregs, schichtplatten, gedruckte leiterplatten und gedruckte multilayer- leiterplatten
EP1048680A4 (de)	2003-05-21	Modifiziertes polyimidharz und diese enthaltende wärmehärtende harzzusammensetzung
FI20020191A0 (fi)	2002-01-31	Menetelmõ komponentin upottamiseksi alustaan
EP1307077A4 (de)	2003-06-18	Haftfilm und verfahren zur herstellung einer mehrschichtigen leiterplatte damit
MY141911A (en)	2010-07-30	Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
AU2002352080A1 (en)	2003-06-17	Heat-curable resin composition
WO2008087890A1 (ja)	2008-07-24	熱硬化性樹脂組成物
WO2001042253A3 (en)	2001-10-25	Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
RU2009101644A (ru)	2010-07-27	Встраиваемое электронное устройство и способ изготовления встраиваемых электронных устройств
ATE398657T1 (de)	2008-07-15	Flammgeschützte polyamidformmassen und deren verwendung
CA2036253A1 (en)	1991-08-15	Thermoplastic resin composition
MY139193A (en)	2009-08-28	Multi-layer circuit board and production method thereof
EP1566395A4 (de)	2007-04-25	Flammwidrige epoxidharzzusammensetzung und daraus erhaltenes gehärtetes objekt
WO2006055732A3 (en)	2006-06-29	Method of making a flame retardant poly (arylene ether)/polyamide composition and the composition thereof
TW200706364A (en)	2007-02-16	Laminate containing 4-methyl-1-pentene based polymer and release film comprising the same
JP2014058592A (ja)	2014-04-03	熱硬化性樹脂組成物、ｂステージ化した樹脂フィルム、金属箔、銅張板および多層ビルドアップ基板
WO2009022619A1 (ja)	2009-02-19	ポリイミド樹脂組成物、該ポリイミド樹脂組成物を与えるポリイミド前駆体樹脂組成物およびそれらの製造方法、ならびにポリイミドフィルムおよびその製造方法
TW200833745A (en)	2008-08-16	Prepreg, laminate and printed wiring board
TW200505994A (en)	2005-02-16	Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them
DE602005024863D1 (de)	2010-12-30	Polycarbonate mit fluoralkylencarbonat-endgruppen
TW200635018A (en)	2006-10-01	Flexible wiring board for tape carrier package having improved flame resistance
EP1278404A4 (de)	2005-07-20	Leiterplatte und verfahren zu ihrer herstellung